5 mm x 7 mm Ceramic Package SMD VCXO, LVPECL / LVDS
I617 Series
Product Features:
Small Surface Mount Package
Frequencies to 750 Mhz
Pb Free/ RoHS Complient
Compatible with Leadfree Processing
Applications:
SD/HD Video
Wireless Base Stations
Sonet /SDH
Server and Storage
5.0
0.2
7.0 0.3
Frequency
Output Level
LVDS
LVPECL
Duty Cycle
Rise / Fall Time
Output Load
LVDS
LVPECL
Frequency Stability
Start-up Time
Supply Voltage
Current
Linearity
Pullability
Control Voltage
Input Impedance
Operating
Storage
77.76 MHz to 622.080 MHz
Vod = 393 mV Typ., 475 mV Max.
‘0’ = Vcc - 1.63 V Max.
‘1’ = Vcc - 1.02 V Min.
50% ±10%
0.6 nS Max.
100
Differential
50
to Vcc - 2.0 VDC
50 ppm Max.
10 mS Max.
3.3 VDC ± 5%
LVDS = 90 mA Max., LVPECL = 130 mA Max.
2.0 Max.
5.08
Recommended Pad Layout
5.08
4.2
15% Max.
See Table Below
1.65 VDC ± 1.5 VDC
50K
Min.
See Operating Temperature Table in Part Number Guide
-55
C to +125
C
Bypass =0.01 uF
Pin
1
2
3
4
5
6
Connection
Control Voltage
Enable / Disable
Ground
Output
N.C.
Vdd
2.0
Dimension Units: mm
Part Number Guide
Package
Operating
Temperature
1 = 0 C to +70 C
3 = -20 C to +70 C
2 = -40 C to +85 C
Sample Part Number:
Stability
(in ppm)
**D =
15
A =
25
B =
50
C =
100
I617–1BC3H–155.520
Output
8 = LVDS
9 = LVPECL
-155.520 MHz
Pullability
B =
50
ppm
C =
100
ppm
Enable /
Disable
H = Enable
Frequency
I617
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 6) and GND (pin 3) to minimize power supply noise.
** Not available for all temperature ranges.
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
12/10_A
Specifications subject to change without notice
Page 1
5 mm x 7 mm Ceramic Package SMD VCXO, LVPECL / LVDS
Pb Free Solder Reflow Profile:
I617 Series
Typical Application:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic, storage life is
unlimited under normal room conditions).
Termination = e4 (Au over Ni over W base metalization).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
16 +/-.3
8 +/-.2
7.5 +/-.2
17.5 +/-1
50 / 60 / 80
180 / 250
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI and Date Code (YWW)
Line 2: Frequency
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
12/10_A
Specifications subject to change without notice
Page 2
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