3-MCG-8060-D datasheet, PDF - EEWORLD Datasheet

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3-MCG-8060-D: DescriptionFixed Resistor, Thin Film, 0.1W, 806ohm, 0.5% +/-Tol, 50ppm/Cel, Surface Mount, 0505, CHIP; CategoryPassive components The resistor; File Size1MB，2 Pages; ManufacturerAPI Technologies; Websitehttp://www.apitech.com/about-api

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3-MCG-8060-D Overview

Fixed Resistor, Thin Film, 0.1W, 806ohm, 0.5% +/-Tol, 50ppm/Cel, Surface Mount, 0505, CHIP

3-MCG-8060-D Parametric

Parameter Name	Attribute value
Maker	API Technologies
package instruction	CHIP
Reach Compliance Code	compli
ECCN code	EAR99
JESD-609 code	e4
Installation features	SURFACE MOUNT
Number of terminals	2
Maximum operating temperature	150 °C
Package shape	RECTANGULAR PACKAGE
Rated power dissipation(P)	0.1 W
Rated temperature	70 °C
resistance	806 Ω
Resistor type	FIXED RESISTOR
size code	0505
surface mount	YES
technology	THIN FILM
Temperature Coefficient	50 ppm/°C
Terminal surface	GOLD
Terminal shape	ONE SURFACE
Tolerance	0.5%

3-MCG-8060-D Preview

ICROWAVE

HIP

ESISTORS

Thin Film on Ceramic

EATURES

• Low VSWR: < 1.2 at 8 GHz

• Low TCR 0 to -50 ppm

• Four Sizes:

0.020 X 0.040 to 0.100 X 0.100 inches

• Wire Bond / Solder Mount Option

Spectrum Microwave

Chip Resistors are produced with

state-of-the-art thin film sputtering techniques on microwave

grade alumina. The advantages of sputtered over evaporated

metal films include better adhesion to the substrate, increased

reliability, and more uniform composition, density, and

thickness. Their T

, noise level, and stability are similar to

discrete metal film resistors. The small size and careful

design of Spectrum Microwave Chip Resistors result in low

VSWR and low parasitics. They are available with gold pads

for wire bonding or solder bumps for surface mounting.

MCB/MCG (B

ARE

ACK

OLD

ACK

)

The MCB and MCG resistors have gold terminations for wirebonds,

although epoxy may also be used. MCB resistors have no backside

metallization. They are die-mounted with epoxy. MCG resistors have

a gold backside metallization. The metallization is electronically

isolated from the front terminations.

.003

TYP.

.010 MIN.

.003 TYP.

T = .010

.001

.005

T = .020 MAX.

.010 MIN.

.003 TYP.

0.003 TYP.

MCS (S

OLDER

UMP

)

MCS resistors have solder bump terminations for flip-chip surface

mounting. They have no backside metallizing. They can also be

die-mounted with epoxy with solder bumps exposed for connection.

RDERING

NSTRUCTIONS

Construct Part Number From Choices:

___________ - _____________________- ___________

(size)

(type)

(ohms)*

(tolerance)

MCB

D = 0.5%

MCG

F = 1%

MCS

J = 5%

K = 10%

.005

Example: 2-MCS-1001-J

(Example is a 0.020-by-0.040-inch chip with solder-bump

terminations, 1000 ohms ±5% resistance.)

*First 3 digits are significant figures. Fourth is number of zeros to follow or D for decimal between second and third digits.

Tel: 508-485-6350 Fax: 508-485-5168

165 Cedar Hill Street, Marlborough, Ma 01752

www.SpectrumMicrowave.com

Spectrum Microwave

ICROWAVE

HIP

ESISTORS

Thin Film on Ceramic

PECIFICATIONS

Substrate:

Material . . . . . . . . . . . . . . . . . . . . . . . .99.6% Al

Thickness . . . . . . . . . . . . . . . . . . .0.010 ± 0.001 in.

Conductor Film Thickness:

MCB

Nichrome . . . . . . . . . . . . .As required for resistivity

Titungsten . . . . . . . . . . . . . . . . . . . . . . .700Å min.

Gold . . . . . . . . . . . . . . . . . . . . . . . . . .100µ in. min.

MCG

Front . . . . . . . . . . . . . . . . . . . . . . . . .same as MCB

Back

Titungsten . . . . . . . . . . . . . . . . . . .250 ± 100Å

Gold . . . . . . . . . . . . . . . . . . . . . .100µ in. min.

MCS

Nichrome . . . . . . . . . . . . .As required for resistivity

Titungsten . . . . . . . . . . . . . . . . . . . .700Å min.

Gold . . . . . . . . . . . . . . . . . . . . . . . .7µ in. min.

Nickel . . . . . . . . . . . . . . . . . . . . . .10µ in. min.

Gold . . . . . . . . . . . . . . . . . . . . . . .30µ in. min.

Solder (60/40) . . . . . . . . . . . . . .1 to 3 mils typ

YPICAL

LECTRICAL

ATA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . .0 to -50 ppm

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-55°

to +150°C

Noise: . . . . . . . . . . . . . . . . . . . . . . . . . . . .< 0.1 mV/V

VSWR . . . . . . . . . . . . . . . . . . . . . . . . .< 1.2 to 8 GHz

VSWR . . . . . . . . . . . . . . . . . . . . . .

1.48 to 18 GHZ

Dielectric k . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9.9

Dissipation Factor . . . . . . . . . . . . . . . . . . . . . . .0.001

Loss Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.0001

Specifications subject to change without notice.

IZES

/ P

OWER

/ R

ESISTANCE

ANGE

Dimensions

(Inches)

Size 2:

0.020 X 0.040

Size 3:

0.050 X 0.050

Size 4:

0.50 X 0.100

Size 5:

0.100 X 0.100

Power*

(mW)

100

150

250

Range

(ohms)

10 to 3000

10 to 1500

*Maximum continuous rating at 70°C when bonded to substrate.

Derate to zero at 150°C.

Spectrum Microwave

also manufactures Custom Substrates on a variety of materials, a wide range of Microwave, PIN

Diode Drivers, and Custom Hybrid Circuits. Please contact the factory or your local representative for more information.

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