2 Pad Ceramic Package Quartz Crystal, 5 mm x 7 mm
Product Features:
Low Cost SMD Package
Low ESR
Compatible with Leadfree Processing
ILCX10 Series
7.0
±0.2
Applications:
Fibre Channel
Server & Storage
Sonet /SDH
802.11 / Wifi
T1/E1, T3/E3
5.0
±0.2
Frequency
6 MHz to 100 MHz
1.3
Max.
ESR (Equivalent Series Resistance)
6.0 MHz – 40.0 MHz
rd
36.0 MHz – 100.0 MHz (3 O.T.)
40
Ω
Max.
40
Ω
Max.
1.25
2.0
Shunt Capacitance (C0)
Frequency Tolerance @ 25°
C
Frequency Stability over
Temperature
Crystal Cut
Load Capacitance
Drive Level
Aging
Temperature
Operating
Storage
7 pF Max.
±30
ppm Standard (see Part Number Guide for more options)
±50
ppm Standard (see Part Number Guide for more options)
AT Cut
18 pF Standard
100 µW Max.
±5
ppm Max. / Year Standard
4.50
Connection Diagram
Recommended Pad Layout
2.2
0° C to +70° C Standard (see Part Number Guide for more
options)
6.3
2.4
-40° C to +85° C Standard
Dimension Units: mm
Part Number Guide
Package
Tolerance
(ppm) at Room
Temperature
B = ±50 ppm
F = ±30 ppm
ILCX10 -
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm
J = ±10 ppm*
Sample Part Number:
Stability
(ppm) over Operating
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm**
J = ±10 ppm**
ILCX10 - FB1F18 - 20.000
Operating
Temperature Range
0 = 0°C to +50°C
1 = 0°C to +70°C
2 = -10°C to +60°C
3 = -20°C to +70°C
5 = -40°C to +85°C
9 = -10°C to +50°C
Mode
(overtone)
F = Fundamental
3 = 3
rd
overtone
Load Capacitance
(pF)
Frequency
18 pF Standard
Or Specify
- 20.000 MHz
* Not available at all frequencies. ** Not available for all temperature ranges.
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
06/09_A
Specifications subject to change without notice
Page 1
2 Pad Ceramic Package Quartz Crystal, 5 mm x 7 mm
Pb Free Solder Reflow Profile:
Typical Circuit:
ILCX10 Series
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 1
Termination = e4 (Au over Ni over W base metal).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
16 +/-.3
8 +/-.2
7.5 +/-.2
17.5 +/-1
50 / 60 / 80
180 / 250
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI, Date Code (yww)
Line 2: Frequency
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
06/09_A
Specifications subject to change without notice
Page 2
Embedded System
京公网安备 11010802033920号
EEWORLD
