4 Pad Ceramic Package, 2 mm x 2.5 mm
Product Features:
SMD Package
Small package Foot Print
Supplied in Tape and Reel
Compatible with Leadfree Processing
ILCX18 Series
Applications:
PCMCIA Cards
Storage
PC’s
Wireless Lan
USB
GSM Cell Phone
2.0
+/-0.1
2.5
+/-0.1
4
3
Frequency
12 MHz to 60 MHz*
0.55
+/-0.1
1
2
ESR (Equivalent Series Resistance)
12 MHz – 19.9 MHz
20 MHz – 29.9 MHz
30 MHz – 39.9 MHz
40 MHz – 60.0 MHz
100
Max.
80
Max.
60
Max.
40
Max.
1
2
4
3
Shunt Capacitance (C0)
Frequency Tolerance @ 25
C
Frequency Stability over
Temperature
Crystal Cut
Load Capacitance
Drive Level
Aging
Temperature
Operating
3.5 pF Max.
30
ppm Standard (see Part Number Guide for more options)
50
ppm Standard (see Part Number Guide for more options)
Connection diagram
4
3
1
2
AT Cut
18 pF Standard (see Part Number Guide for more options)
100 µW Max.
5
ppm Max. / Year Standard
1.25
Recommended pad layout
0.9
0.8
0 C to +70 C Standard (see Part Number Guide for more
options)
-40 C to +85 C Standard
1.65
Dimension Units: mm
Storage
Part Number Guide
Package
Tolerance
(ppm) at Room
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
ILCX18 -
H = ±20 ppm
I = ±15 ppm
J = ±10 ppm*
Sample Part Number:
Stability
(ppm) over Operating
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm**
J = ±10 ppm**
ILCX18 - FB1F18 - 20.000
Operating
Temperature Range
Mode
(overtone)
Load
Capacitance
(pF)
Frequency
0 = 0°C to +50°C
1 = 0°C to +70°C
2 = -10°C to +60°C
3 = -20°C to +70°C
5 = -40°C to +85°C
9 = -10°C to +50°C
D = -10°C to +105°C*
E = -40°C to +105°C*
F = Fundamental
18 pF Standard
Or Specify
- 20.000 MHz
* Not available at all frequencies. ** Not available for all temperature ranges.
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
7/23/12_D
Specifications subject to change without notice
Page 1
4 Pad Ceramic Package, 2 mm x 2.5 mm
Pb Free Solder Reflow Profile:
Typical Circuit:
ILCX18 Series
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 1
Termination = e4 (Au over Ni over W base metal).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
8 +/-.3
4 +/-.2
3.5 +/-.2
9 +/-1 or 12 +/-3
60 / 80
180
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: I-Date Code(yww)
Line 2: Frequency
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
7/23/12_D
Specifications subject to change without notice
Page 2
Microcontroller MCU
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