MX23L3222VC-10 datasheet, PDF - EEWORLD Datasheet

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MX23L3222VC-10: DescriptionMASK ROM, 1MX32, 100ns, CMOS, PQFP100, 14 X 14 MM, TQFP-100; Categorystorage storage; File Size160KB，5 Pages; ManufacturerMacronix; Websitehttp://www.macronix.com/en-us/Pages/default.aspx

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MX23L3222VC-10 Overview

MASK ROM, 1MX32, 100ns, CMOS, PQFP100, 14 X 14 MM, TQFP-100

MX23L3222VC-10 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Macronix
Parts packaging code	QFP
package instruction	LFQFP, QFP100,.63SQ,20
Contacts	100
Reach Compliance Code	unknow
ECCN code	EAR99
Maximum access time	100 ns
Other features	CAN ALSO BE CONFIGURED AS 1M X 32
Spare memory width	16
JESD-30 code	S-PQFP-G100
JESD-609 code	e0
length	14 mm
memory density	33554432 bi
Memory IC Type	MASK ROM
memory width	32
Number of functions	1
Number of terminals	100
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX32
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Encapsulate equivalent code	QFP100,.63SQ,20
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	1.6 mm
Maximum standby current	0.00005 A
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	3.63 V
Minimum supply voltage (Vsup)	2.97 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm

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MX23L3222VC-10 Related Products

	MX23L3222VC-10	MX23L3222VC-12
Description	MASK ROM, 1MX32, 100ns, CMOS, PQFP100, 14 X 14 MM, TQFP-100	MASK ROM, 1MX32, 120ns, CMOS, PQFP100, 14 X 14 MM, TQFP-100
Is it Rohs certified?	incompatible	incompatible
Maker	Macronix	Macronix
Parts packaging code	QFP	QFP
package instruction	LFQFP, QFP100,.63SQ,20	LFQFP, QFP100,.63SQ,20
Contacts	100	100
Reach Compliance Code	unknow	unknown
ECCN code	EAR99	EAR99
Maximum access time	100 ns	120 ns
Other features	CAN ALSO BE CONFIGURED AS 1M X 32	CAN ALSO BE CONFIGURED AS 1M X 32
Spare memory width	16	16
JESD-30 code	S-PQFP-G100	S-PQFP-G100
JESD-609 code	e0	e0
length	14 mm	14 mm
memory density	33554432 bi	33554432 bit
Memory IC Type	MASK ROM	MASK ROM
memory width	32	32
Number of functions	1	1
Number of terminals	100	100
word count	1048576 words	1048576 words
character code	1000000	1000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C
organize	1MX32	1MX32
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFQFP	LFQFP
Encapsulate equivalent code	QFP100,.63SQ,20	QFP100,.63SQ,20
Package shape	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED
power supply	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified
Maximum seat height	1.6 mm	1.6 mm
Maximum standby current	0.00005 A	0.00005 A
Maximum slew rate	0.06 mA	0.06 mA
Maximum supply voltage (Vsup)	3.63 V	3.63 V
Minimum supply voltage (Vsup)	2.97 V	2.97 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.5 mm
Terminal location	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	14 mm	14 mm

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