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IS64WV5128BLL-10BA3

Description
512K X 8 STANDARD SRAM, 10 ns, PBGA36
Categorystorage   
File Size510KB,25 Pages
ManufacturerISSI(Integrated Silicon Solution Inc.)
Websitehttp://www.issi.com/
Download Datasheet Parametric Compare View All

IS64WV5128BLL-10BA3 Overview

512K X 8 STANDARD SRAM, 10 ns, PBGA36

IS64WV5128BLL-10BA3 Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals36
Maximum operating temperature85 Cel
Minimum operating temperature-40 Cel
Maximum supply/operating voltage3.6 V
Minimum supply/operating voltage2.4 V
Rated supply voltage3.3 V
maximum access time10 ns
Processing package description6 X 8 MM, LEAD FREE, MINI, BGA-36
Lead-freeYes
EU RoHS regulationsYes
stateACTIVE
CraftsmanshipCMOS
packaging shapeRECTANGULAR
Package SizeGRID ARRAY, THIN PROFILE, FINE PITCH
surface mountYes
Terminal formBALL
Terminal spacing0.7500 mm
terminal coatingTIN SILVER COPPER
Terminal locationBOTTOM
Packaging MaterialsPLASTIC/EPOXY
Temperature levelINDUSTRIAL
memory width8
organize512K X 8
storage density4.19E6 deg
operating modeASYNCHRONOUS
Number of digits524288 words
Number of digits512K
Memory IC typeSTANDARD SRAM
serial parallelPARALLEL
IS61WV5128ALL/ALS
IS61WV5128BLL/BLS
IS64WV5128BLL/BLS
512K x 8 HIGH-SPEED ASYNCHRONOUS CMOS STATIC RAM
AUGUST 2009
FEATURES
HIGH SPEED: (IS61/64WV5128ALL/BLL)
• High-speed access time: 8, 10, 20 ns
• Low Active Power: 85 mW (typical)
• Low stand-by power: 7 mW (typical)
CMOS standby
LOW POWER: (IS61/64WV5128ALS/BLS)
• High-speed access time: 25, 35 ns
• Low Active Power: 35 mW (typical)
• Low stand-by power: 0.6 mW (typical)
CMOS standby
• Single power supply
— V
dd
1.65V to 2.2V (IS61WV5128Axx)
— V
dd
2.4V to 3.6V (IS61/64WV5128Bxx)
• Fully static operation: no clock or refresh
required
• Three state outputs
• Industrial and Automotive temperature support
• Lead-free available
DESCRIPTION
The
ISSI
IS61WV5128Axx and IS61/64WV5128Bxx
are very high-speed, low power, 524,288-word by
8-bit CMOS static RAMs. The IS61WV5128Axx and
IS61/64WV5128Bxx are fabricated using
ISSI
's high-
performance CMOS technology. This highly reliable pro-
cess coupled with innovative circuit design techniques,
yields higher performance and low power consumption
devices.
When
CE
is HIGH (deselected), the device assumes
a standby mode at which the power dissipation can be
reduced down with CMOS input levels.
The IS61WV5128Axx and IS61/64WV5128Bxx operate
from a single power supply.
The IS61WV5128ALL and IS61/64WV5128BLL are avail-
able in 36-pin 400-mil SOJ, 36-pin mini BGA, and 44-pin
TSOP (Type II) packages.
The IS61WV5128ALS and IS61/64WV5128BLS are
available in 32-pinTSOP (Type I), 32-pin sTSOP (Type I),
32-pin SOP and 32-pin TSOP (Type II) packages.
FUNCTIONAL BLOCK DIAGRAM
A0-A18
DECODER
512K X 8
MEMORY ARRAY
V
DD
GND
I/O
DATA
CIRCUIT
I/O0-I/O7
COLUMN I/O
CE
OE
WE
CONTROL
CIRCUIT
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the lat-
est version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com
Rev. I
08/10/09
1

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Description 512K X 8 STANDARD SRAM, 10 ns, PBGA36 512K X 8 STANDARD SRAM, 10 ns, PBGA36 512K X 8 STANDARD SRAM, 10 ns, PBGA36 512K X 8 STANDARD SRAM, 10 ns, PBGA36 512K X 8 STANDARD SRAM, 10 ns, PBGA36 512K X 8 STANDARD SRAM, 10 ns, PBGA36
Number of functions 1 1 1 1 1 1
Number of terminals 36 36 44 36 36 36
Maximum operating temperature 85 Cel 85 Cel 85 °C 85 Cel 85 Cel 85 Cel
Minimum operating temperature -40 Cel -40 Cel -40 °C -40 Cel -40 Cel -40 Cel
surface mount Yes Yes YES Yes Yes Yes
Terminal form BALL BALL GULL WING BALL BALL BALL
Terminal location BOTTOM BOTTOM DUAL BOTTOM BOTTOM BOTTOM
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
memory width 8 8 8 8 8 8
organize 512K X 8 512K X 8 512KX8 512K X 8 512K X 8 512K X 8
Maximum supply/operating voltage 3.6 V 3.6 V - 3.6 V 3.6 V 3.6 V
Minimum supply/operating voltage 2.4 V 2.4 V - 2.4 V 2.4 V 2.4 V
Rated supply voltage 3.3 V 3.3 V - 3.3 V 3.3 V 3.3 V
maximum access time 10 ns 10 ns - 10 ns 10 ns 10 ns
Processing package description 6 X 8 MM, LEAD FREE, MINI, BGA-36 6 X 8 MM, LEAD FREE, MINI, BGA-36 - 6 X 8 MM, LEAD FREE, MINI, BGA-36 6 X 8 MM, LEAD FREE, MINI, BGA-36 6 X 8 MM, LEAD FREE, MINI, BGA-36
Lead-free Yes Yes - Yes Yes Yes
EU RoHS regulations Yes Yes - Yes Yes Yes
state ACTIVE ACTIVE - ACTIVE ACTIVE ACTIVE
Craftsmanship CMOS CMOS - CMOS CMOS CMOS
packaging shape RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR
Package Size GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH - GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Terminal spacing 0.7500 mm 0.7500 mm - 0.7500 mm 0.7500 mm 0.7500 mm
terminal coating TIN SILVER COPPER TIN SILVER COPPER - TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER
Packaging Materials PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
storage density 4.19E6 deg 4.19E6 deg - 4.19E6 deg 4.19E6 deg 4.19E6 deg
operating mode ASYNCHRONOUS ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Number of digits 512K 512K - 512K 512K 512K
Memory IC type STANDARD SRAM STANDARD SRAM - STANDARD SRAM STANDARD SRAM STANDARD SRAM
serial parallel PARALLEL PARALLEL - PARALLEL PARALLEL PARALLEL
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