EEWORLDEEWORLDEEWORLD

Part Number

Search

54112-804-46-1300

Description
Board Connector, 46 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Locking, Black Insulator, Receptacle
CategoryThe connector    The connector   
File Size67KB,1 Pages
ManufacturerAmphenol
Websitehttp://www.amphenol.com/
Download Datasheet Parametric View All

54112-804-46-1300 Overview

Board Connector, 46 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Locking, Black Insulator, Receptacle

54112-804-46-1300 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerAmphenol
Reach Compliance Codecompliant
ECCN codeEAR99
body width0.19 inch
subject depth0.512 inch
body length2.3 inch
Body/casing typeRECEPTACLE
Connector typeBOARD CONNECTOR
Contact to complete cooperationAU ON NI
Contact completed and terminatedTin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Contact point genderMALE
Contact materialPHOSPHOR BRONZE
contact modeRECTANGULAR
Contact styleSQ PIN-SKT
Insulation resistance5000000000 Ω
Insulator colorBLACK
insulator materialTHERMOPLASTIC
JESD-609 codee0
Manufacturer's serial number54112
Plug contact pitch0.1 inch
Match contact row spacing0.1 inch
Installation option 1LOCKING
Installation methodSTRAIGHT
Installation typeBOARD
Number of connectorsONE
PCB row number2
Number of rows loaded2
Maximum operating temperature125 °C
Minimum operating temperature-65 °C
PCB contact patternRECTANGULAR
PCB contact row spacing2.54 mm
Plating thickness15u inch
Rated current (signal)3 A
GuidelineUL, CSA
reliabilityCOMMERCIAL
Terminal length0.095 inch
Terminal pitch2.54 mm
Termination typeSOLDER
Total number of contacts46
PDM: Rev:G
STATUS:
Released
Printed: Feb 20, 2009
.
LSM6DS3 sensor problem, help!
Dear experts, please help me! I recently helped a customer purchase a batch of LSM6DS3TR chips (made in Thailand). After the customer installed them on the board, they found that the S3 chip failed to...
keith123 MEMS sensors
IC Design Process
IC design process (from USTC) 2. Implementation method; IC can be divided into two types from the production purpose: general-purpose IC (such as CPU, DRAM, interface chip, etc.) and ASIC (Application...
gjgd FPGA/CPLD
Disadvantages of Traditional Differential Amplifiers and Solutions
The classic discrete difference amplifier design is very simple, what's the complexity of an op amp and a four-resistor network? The classic four-resistor difference amplifier is shown in Figure 1, bu...
Aguilera Analogue and Mixed Signal
Can I ask how the air pressure sensor can achieve accurate height (altitude) measurement and ignore the influence of wind speed?
I am currently working on a project using the HP303B sensor, but this sensor is greatly affected by wind speed. How can I avoid this problem? The sensor is placed on a tower for attitude monitoring. H...
StruggleMySen Sensor
Entrepreneurship Cooperation - Welcome to join like-minded friends in Shanghai to start a business together
Hello friend! The project our entrepreneurial team is currently working on is a product that combines health and mobile Internet of Things. It is divided into two parts: hardware and software. The har...
davywang Recruitment
Will fast charging of mobile phones without overcharge protection damage the phone?
I have a Bluetooth speaker that supports fast charging, and I need to test the fast charging function. The test phone is Samsung S7. Everything was normal at the beginning of the test, but when the ph...
金戋2107 Power technology

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1833  1759  1558  2682  1859  37  36  32  55  38 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号