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IT3M-200P-28H03

Description
High-Speed(10Gbps) BGA Mezzanine Connectors
File Size2MB,20 Pages
ManufacturerHirose
Websitehttp://www.hirose-connectors.com/
Download Datasheet View All

IT3M-200P-28H03 Overview

High-Speed(10Gbps) BGA Mezzanine Connectors

NEW
High-Speed(10
+
Gbps) BGA Mezzanine Connectors
IT3 Series
sFlexibility
Hirose’s IT3 mezzanine connector system is as
comfortable in today’s data rates of PCIe and XAUI
as it is in tomorrow’s 10
+
Gbps systems.
With the ability to transmit differential, single-ended,
and power through one package and being stackable
from 15 – 40mm, IT3 can solve your interface needs
for both current and future generations.
sMechanical
features
q
Unique 3-piece structure for flexibility
q
Stacking heights from 15 to 40mm
(
*
15mmH is 2-piece)
q
Staggered 1.5mm
1.75mm ball grid array
q
Number of Contacts: 100, 200, &300 signals
+ 90% additional grounds
q
Differential, single-ended, and power
q
Low mating/extracting forces
q
Wide misalignment tolerances for multiple
connector use
q
Both of SnPb and Pb-free are available
q
Excellent reflow solderability
Interposer
Signal
Ground
Signal / Ground Configuration
sSignal
integrity features
q
Insertion loss to Crosstalk Ratio (ICR)
The ICR performance meets the extrapolated
IEEE 802.3ap specification for 6.25Gbps with
fully-populated pin assignment, and 10
+
Gbps
with skipped pin assignment.
60
50
40
ICR (dB)
30
20
10
0
-40
RL
IEEE Spec
0
5
10
Frequency (GHz)
15
20
RL (dB)
0
5
10
Frequency (GHz)
15
20
-20
ICR
IEEE spec
0
-10
q
Return Loss
The differential return loss meets the
extrapolated IEEE 802.3ap specification
up to 12GHz.
-30
-50
sStacking
height variations
Stacking Height
Contact Position
100
200
300
17mm
*
20mm
22mm
*
25mm
26mm
28mm
30mm
*
32mm
*
38mm
40mm
* : Under planning
2010.02
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