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89H24NT24G2ZBHL8

Description
FCBGA-324, Reel
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size449KB,36 Pages
ManufacturerIDT (Integrated Device Technology)
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89H24NT24G2ZBHL8 Overview

FCBGA-324, Reel

89H24NT24G2ZBHL8 Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeFCBGA
package instructionBGA,
Contacts324
Manufacturer packaging codeHL324
Reach Compliance Codenot_compliant
ECCN code3A001.A.3
Address bus width
Bus compatibilityI2C; ISA; PCI; SMBUS; VGA
maximum clock frequency125 MHz
Maximum data transfer rate24000 MBps
External data bus width
JESD-30 codeS-PBGA-B324
JESD-609 codee0
length19 mm
Humidity sensitivity level4
Number of terminals324
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)225
Maximum seat height2.88 mm
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature20
width19 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
24-Lane 24-Port PCIe® Gen2
System Interconnect Switch
®
89HPES24NT24G2
Datasheet
Device Overview
The 89HPES24NT24G2 is a member of the IDT family of PCI
Express® switching solutions. The PES24NT24G2 is a 24-lane, 24-port
system interconnect switch optimized for PCI Express Gen2 packet
switching in high-performance applications, supporting multiple simulta-
neous peer-to-peer traffic flows. Target applications include multi-host or
intelligent I/O based systems where inter-domain communication is
required, such as servers, storage, communications, and embedded
systems.
Features
High Performance Non-Blocking Switch Architecture
24-lane, 24-port PCIe switch with flexible port configuration
Integrated SerDes supports 5.0 GT/s Gen2 and 2.5 GT/s
Gen1 operation
Delivers up to 24 GBps (192 Gbps) of switching capacity
Supports 128 Bytes to 2 KB maximum payload size
Low latency cut-through architecture
Supports one virtual channel and eight traffic classes
Port Configurability
Twenty-four x1 ports configurable as follows:
One x8 stack
• Eight x1 ports (ports 0 through 7 are not capable of
merging with an adjacent port)
Two x8 stacks configurable as:
• Two x8 ports
• Four x4 ports
• Eight x2 ports
• Sixteen x1 ports
Automatic per port link width negotiation
(x8
x4
x2
x1)
Crosslink support
Automatic lane reversal
Per lane SerDes configuration
De-emphasis
Receive equalization
Drive strength
Innovative Switch Partitioning Feature
Supports up to 8 fully independent switch partitions
Logically independent switches in the same device
Configurable downstream port device numbering
Supports dynamic reconfiguration of switch partitions
Dynamic port reconfiguration — downstream, upstream,
non-transparent bridge
Dynamic migration of ports between partitions
Movable upstream port within and between switch partitions
Non-Transparent Bridging (NTB) Support
Supports up to 8 NT endpoints per switch, each endpoint can
communicate with other switch partitions or external PCIe
domains or CPUs
6 BARs per NT Endpoint
Bar address translation
All BARs support 32/64-bit base and limit address translation
Two BARs (BAR2 and BAR4) support look-up table based
address translation
32 inbound and outbound doorbell registers
4 inbound and outbound message registers
Supports up to 64 masters
Unlimited number of outstanding transactions
Multicast
Compliant with the PCI-SIG multicast
Supports 64 multicast groups
Supports multicast across non-transparent port
Multicast overlay mechanism support
ECRC regeneration support
Integrated Direct Memory Access (DMA) Controllers
Supports up to 2 DMA upstream ports, each with 2 DMA chan-
nels
Supports 32-bit and 64-bit memory-to-memory transfers
Fly-by translation provides reduced latency and increased
performance over buffered approach
Supports arbitrary source and destination address alignment
Supports intra- as well as inter-partition data transfers using
the non-transparent endpoint
Supports DMA transfers to multicast groups
Linked list descriptor-based operation
Flexible addressing modes
Linear addressing
Constant addressing
Quality of Service (QoS)
Port arbitration
Round robin
Request metering
IDT proprietary feature that balances bandwidth among
switch ports for maximum system throughput
High performance switch core architecture
Combined Input Output Queued (CIOQ) switch architecture
with large buffers
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 35
2013 Integrated Device Technology, Inc
December 17, 2013

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Description FCBGA-324, Reel FCBGA-324, Tray FCBGA-324, Reel FCBGA-324, Reel FCBGA-324, Reel FCBGA-324, Tray FCBGA-324, Reel FCBGA-324, Tray FCBGA-324, Reel
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
Is it lead-free? Contains lead Contains lead Lead free Lead free Contains lead Contains lead Lead free Contains lead Contains lead
Is it Rohs certified? incompatible incompatible conform to conform to incompatible incompatible conform to incompatible incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA
package instruction BGA, BGA, BGA324,18X18,40 BGA, BGA, BGA, BGA, BGA324,18X18,40 BGA, BGA, BGA324,18X18,40 BGA,
Contacts 324 324 324 324 324 324 324 324 324
Manufacturer packaging code HL324 HL324 HLG324 HLG324 HL324 HL324 HLG324 HL324 HL324
Reach Compliance Code not_compliant not_compliant compliant compliant not_compliant not_compliant compliant not_compliant not_compliant
ECCN code 3A001.A.3 3A001.A.3 EAR99 EAR99 3A001.A.3 3A001.A.3 EAR99 3A001.A.3 3A001.A.3
Bus compatibility I2C; ISA; PCI; SMBUS; VGA I2C; ISA; VGA I2C; ISA; PCI; SMBUS; VGA I2C; ISA; PCI; SMBUS; VGA I2C; ISA; PCI; SMBUS; VGA I2C; ISA; VGA I2C; ISA; PCI; SMBUS; VGA I2C; ISA; VGA I2C; ISA; PCI; SMBUS; VGA
maximum clock frequency 125 MHz 125 MHz 125 MHz 125 MHz 125 MHz 125 MHz 125 MHz 125 MHz 125 MHz
JESD-30 code S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324
JESD-609 code e0 e0 e1 e1 e0 e0 e1 e0 e0
length 19 mm 19 mm 19 mm 19 mm 19 mm 19 mm 19 mm 19 mm 19 mm
Humidity sensitivity level 4 4 4 4 4 4 4 4 4
Number of terminals 324 324 324 324 324 324 324 324 324
Maximum operating temperature 70 °C 70 °C 70 °C 85 °C 85 °C 70 °C 70 °C 85 °C 85 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA BGA BGA BGA BGA BGA
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 225 225 260 260 225 225 260 225 225
Maximum seat height 2.88 mm 2.88 mm 2.88 mm 2.88 mm 2.88 mm 2.88 mm 2.88 mm 2.88 mm 2.88 mm
Maximum supply voltage 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V
Minimum supply voltage 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V
Nominal supply voltage 1 V 1 V 1 V 1 V 1 V 1 V 1 V 1 V 1 V
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL BALL BALL BALL BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 20 NOT SPECIFIED 30 30 20 NOT SPECIFIED 30 NOT SPECIFIED 20
width 19 mm 19 mm 19 mm 19 mm 19 mm 19 mm 19 mm 19 mm 19 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Maximum data transfer rate 24000 MBps - 24000 MBps 24000 MBps 24000 MBps - 24000 MBps - 24000 MBps
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