DIP Sockets
Table of Models
Molded DIP Sockets
Closed Frame and Open Frame
Description:
Closed Frame Socket (RDS)
Mat’l: High Temp. Liquid Crystal Polymer (LCP)
Index: -40°C to 260°C (-40°F to 500°F)
.125
(3.18)
Description:
Open Frame Socket (RLS)
Mat’l: High Temp. Liquid Crystal Polymer (LCP)
Index: -40°C to 260°C (-40°F to 500°F)
.050
(1.27)
*
*
.100/(2.54) for 48 and 60 pos.
Description:
Peel-A-Way
®
Socket (KS)
Material: Polyimide Film
Index: -269°C to 400°C (-452°F to 752°F)
For more information, refer to the Peel-A-Way
®
DIP Sockets pages (30-31).
RDS replaces DS and HDS.
RLS replaces LS and HLS.
.005
(.13)
Polyimide
Film
Features:
• Multiple finger contact on all
sockets assures maximum
reliability.
• Tapered entry for ease of insertion.
• Closed bottom sleeve for 100%
anti-wicking of solder.
• To fit .100/(2.54mm) pitch.
• Easily customized to fit your
application.
Options
Tape Seal - add 3M to end of part number
• Removable tape seal protects plated contact in harsh environments
• Sealed socket will not allow dirt and other contaminants to enter
socket chamber and become entrapped behind contact fingers
• Spray flux without contaminating contact area
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper - Copper Alloy
(C17200) ASTM-B-194
Solder Preform:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
M - Matte Tin over Nickel
T - Tin/Lead over Nickel
Gold per ASTM-B-488
Matte Tin per ASTM545-97
Tin/Lead per MIL-P-81728
Nickel per QQ-N-290
Material
Silicone Backed Polyimide Film, -74°C to 260°C (-100°F to 500°F)
Intermittent to 371°C (700°F)
How To Order
RDS 3
16 - 01
M
G
Contact Plating
RoHS Compliant:
Body Type
RoHS Compliant:
G - Gold
T - Tin/Lead
Terminal Plating
RoHS Compliant:
RDS - Hi-Temp LCP
Closed Frame Molded
RLS - Hi-Temp LCP
Open Frame Molded
DIP Spacing
3 - .300/(7.62mm)
4 - .400/(10.16mm)
6 - .600/(15.24mm)
9 - .900/(22.86mm)*
*Open Frame only
G - Gold
M - Matte Tin
T - Tin/Lead
Terminal Type
See options on next page
Number of Pins
Closed Frame 8 - 40
Open Frame 8 - 64
(see table on next page for standard pin counts)
Note: Terminals plated with Matte Tin are available only with Gold plated contacts.
Quick-Turn delivery is not available on products with Matte Tin plating.
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16
rev. Sept. 07
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
Molded DIP Sockets
Closed Frame and Open Frame
Standard Quick-Turn Terminals
Type -01
Low Profile Solder Tail
QU
5D
K-TU
IC
DIP Sockets
RN
Additional standard and custom terminals available.
See Terminals section or consult factory.
Type -30
Low Profile Solder Tail
(Not Quick-Turn)
AY
D
E
LI
V
Type -29
Low Profile Solder Tail
(Not Quick-Turn)
Type -51
Low Profile Solder Tail
.165
(4.19)
.125
(3.18)
.020 Dia.
(.51)
.020 Dia.
(.51)
.165
(4.19)
.170
(4.32)
.020 Dia.
(.51)
.165
(4.19)
.275
(6.99)
.020 Dia.
(.51)
Type -04
Super Low Profile
Not for use with Closed Frame
Type -49
Ultra Low Profile
Not for use with Closed Frame
Type -237
Surface Mount
(Not Quick-Turn)
ER
Y
5
.130
(3.30)
.110
(2.79)
Intrusive Reflow Application:
.120
(3.05)
.110
(2.79)
.028 Dia.
(.71)
.028 Dia.
(.71)
.095
(2.41)
.095
(2.41)
.155
(3.94)
SOLDER
PREFORM
.052 Dia.
(1.32)
PLATED THRU
HOLE (PTH)
PCB
PCB
Solder Preform Terminals
Tin/Lead: Type -150
Lead-free: Type -811
.072 Dia.
(1.83)
Tin/Lead: Type -151
Lead-free: Type -812
.072 Dia.
(1.83)
.130
(3.30)
BEFORE REFLOW
AFTER REFLOW
• Combines the labor of socket
loading and solder application into
one operation.
• Eliminates the use of solder paste
and screening operation.
• Eliminates solder bridges and/or
solder shorts due to excess
solder.
• Ensures a reliable solder joint with
controlled solder volume.
A
C
B
.165
(4.19)
Solder
Preform
.125
(3.18)
.020 Dia.
(.51)
Solder
Preform
.110
(2.79)
.020 Dia.
(.51)
Dimensional Information
A
C
B
• Ideal for surface mount and mixed
technology applications.
• For custom solder preform
terminal applications consult
factory.
Closed Frame
Open Frame
.125
(3.18)
.050*
(1.27)
Available Online:
C
1.100
(27.54)
1.200
(30.48)
1.200
(30.48)
1.400
(35.56)
1.600
(40.64)
2.000
(50.80)
2.400
(60.96)
3.200
(81.28)
# of Pins
8
14
16
18
20
22
24
28
A
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
B
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
C
.400
(10.16)
.700
(17.78)
.800
(20.32)
.900
(22.86)
1.000
(25.40)
1.100
(27.94)
1.200
(30.48)
1.400
(35.56)
# of Pins
22
24
24
28
32
40
48*
64*
A
.400
(10.16)
.400
(10.16)
.600
(15.24)
.600
(15.24)
.600
(15.24)
.600
(15.24)
.600
(15.24)
.900
(22.86)
B
.500
(12.70)
.500
(12.70)
.700
(17.78)
.700
(17.78)
.700
(17.78)
.700
(17.78)
.700
(17.78)
1.000
(25.40)
• RoHS Qualification Test Report
• CAD Drawings
The dimensions in
blue
are for Open Frame only.
*Socket body thickness is .100/(2.54) for 48 and 64 positions.
inch/(mm)
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16
rev. Sept. 07
FPGA/CPLD
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EEWORLD
