RS
KBPC15005L THRU KBPC1510L
IN - LINE SINGLE - PHASE SILICON BRIDGE RECTIFIER
VOLTAGE - 50 TO 1000 VOLTS CURRENT - 15.0 AMPERES
FEATURES
C
D
KBPC-L
Min Max
28.45 28.70
19.05
13.97
5.10
10.97 11.23
1.02
3.05 3.60
Metal heat sink
epoxy case
A
AC
B
Dim
A
B
C
D
E
G
H
J
Surge overload rating - 300 amperes peak
Integrally molded heat-sink provide very low thermal
resistance for maximum heat dissipation.
Universal 3 way terminals: snap-on, wire wrap-around,
or P.C. board mounting.
Plastic package used has Underwriters Laboratory
Flammability Classification 94V-0
High temperature soldering guaranteed:
260
O
C/10 seconds at 5lbs. (2.3kg) tension
MECHANICAL DATA
Case: Molded plastic with heatsink integrally mounted
in the bridge encapsulation
Terminals: wire lead 50 mils.
Weight: 0.65 ounce, 18 grams
J
H
G E
All Dimensions in mm
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25
O
C ambient temperature unless otherwise specified
Sing phase half-wave 60H
Z
,
resistive or inductive load
For capacitive load, derate current by 20%
KBPC KBPC KBPC KBPC KBPC KBPC KBPC
SYMBOL
15005L 1501L 1502L 1504L 1506L 1508L 1510L
UNITS
Volts
Volts
Volts
Amps
Maximum Repetitive Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
T
A
= 55
O
C
Peak Forward Surge Current 8.3ms Single
Half Sine-Wave Superimposed on Rated Load
Maximum Instantaneous Forward Voltage
Drop Per Bridge Element at 7.5A
Maximum DC Reverse Current
at Rated DC Blocking Voltage
Rating for fusing (t < 8.3ms)
Typical Junction Capacitance
(NOTE 1)
Typical Thermal Resistance
(NOTE 2)
T
A
= 25
O
C
T
A
= 125 C
O
V
RRM
V
RMS
V
DC
I
(AV)
50
35
50
100
70
100
200
140
200
400
280
400
15.0
300
1.2
10
600
420
600
800
560
800
1000
700
1000
I
FSM
Amps
V
F
Volts
A
A
2
s
pF
o
I
R
I
2
t
C
J
R
JC
500
375
300
6.3
C/W
o
-55 to + 150
Operating and Storage Temperature Range
T
J
, T
STG
NOTES:
1. Measured at 1.0MHz and applied reverse voltage of 4.0 volts
2. Thermal resistance from junction to case per bridge element
3. Bolt down on heatsink with silicon thermal compound between bridge and mounting surface
for maximum heat transfer efficiency with #10 screw
C
RS
KBPC15005L THRU KBPC1510L
100
30
INSTANTANEOUS FORWARD CURRENT
(AMPS)
AVERAGE FORWARD CURRENT
(AMPS)
10
25
MOUNTED ON A
220 x 220 x 50MM
AL. PLATED HEATSINK
20
1.0
15
10
60Hz RESISTIVE OR
INDUCTIVE LOAD
0.1
5
T
J
= 25
O
C
PULSE WIDTH = 300 s
1 % DUTY CYCLE
0.01
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0
0
50
100
O
150
CASE TEMPERATURE ( C)
INSTANTANEOUS FORWARD VOLT
AGE (VOLTS)
Figure 1. Forward Current Derating Curve
Figure 2. Typical Instantaneous Forward
Characteristics Per Bridge Element
1000
PEAK FORWARD SURGE CURRENT
(AMPS)
T
J
= T
J
MAX
SINGLE SINE-WAVE
(JEDEC METHOD)
INSTANTANEOUS REVERSE CURRENT
A)
500
T
J
= 125
O
C
100
100
10
1
T
J
= 25
O
C
0.1
1.0 CYCLE
1
1
10
100
0.01
0
20
40
60
80
100
NUMBER OF CYCLES AT 60Hz
PERCENT OF RATED PEAK REVERSE VOLTS (%)
Figure 3. Maximum Non-repetitive Peak Forward
Surge Current Per Bridge Element
1000
T
J
= 25 C
f = 1.0MHz
Vsig = 50m Vp-p
O
Figure 4. Typical Reverse Leakage Characteristics
Per Bridge Element
80
AVERAGE POWER DISSIPATION OF BRIDGE
(WATTS)
70
60
50
40
30
20
10
CAPACITIVE LOAD
JUNCTION CAPACITANCE
(pF)
T
J
= T
J MAX.
100
RESISTIVE OR
INDUCTIVE LOAD
10
1
10
100
0
0
10
20
30
40
50
REVERSE VOLTAGE (VOLTS)
AVERAGE OUTPUT CURRENT (AMPS)
Figure 5. Typical Junction Capacitance Per Bridge Element
Figure 6. Maximum Power Dissipation
FPGA/CPLD
京公网安备 11010802033920号
EEWORLD
