DATA SHEET
SEMICONDUCTOR
KBPC15005N THRU KBPC1510N
BR35N / Unit:inch(mm)
VOLTAGE RANGE 50 to 1000 Volts
CURRENT 15 Ampere
FEATURES
•Low
cost
•This
series is UL recognized under component
index, file number E127707
•High
forward surge current capability
•Intergrally
molded heatsink provide
very low thermal resistance.
•High
isolation voltage from case to lugs.
•High
temperature soldering guaranteed:
260℃/10 second, at 5 lbs. (2.3kg) tension.
•High
temperature soldering : 260
O
C / 10 seconds at terminals
•Pb
free product at available : 99% Sn above meet RoHS
environment substance directive request
MECHANICAL DATA
•Case:
Molded plastic body, suffic "N" for thinner type
•Terminal:
Plated 0.25" (6.35mm) lug.
•Polarity:
Polarity symbols marked on case.
•Mounting:
Thru hole for #10 screw, 20 in,- lbs. Torqute Max.
•Weight:
0.55 ounce, 15.6 gram(KBPC15N)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
•Ratings
at 25℃ ambient temperature unless otherwise specified
•Single
phase, half wave, 60Hz, resistive or inductive load.
•For
capacitive load derate current by 20%
SYMBOLS
Maximum Repetitive Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Output
Current, at TC = 55℃ (Note 1, 2)
Peak Forward Surge Current
8.3ms single half sine - wave superimposed on
rated load (JEDEC method )
Rating for Fusing (t<8.3ms)
Maximum Instantaneous Forward Voltage Drop
per bridge element at 7.5A
Maximum DC Reverse Current at rate
DC blocking voltage per element
Isolation Voltage from case to lugs
Typical Thermal Resistance (Note 1,2)
Operating Temperature Range
Storage Temperature Range
TA = 25℃
IR
TA =100℃
VISO
RθJC
TJ
TSTG
1.0
2500
2.0
(-65 to +150)
(-65 to +150)
mA
VAC
℃/W
℃
I2t
VF
373
1.1
10
A2s
Volts
μA
IFSM
300
Amps
VRRM
VRMS
VDC
I(AV)
KBPC
KBPC
KBPC
1502N
200
140
200
KBPC
1504N
400
280
400
15
KBPC
1506N
600
420
600
KBPC
1508N
800
560
800
KBPC
1510N
1000
700
1000
Volts
Volts
Volts
Amps
15005N 1501N
50
35
50
100
70
100
1. Unit mounted on 5" X 4" X 3" (12.8cm X 10.2cm X 7.3cm)Al. finned Plate.
2. Bolt down on heat-sink with silicon thermal compound between bridge and mounting sutfae for maximum heat
transfer efficiency with # 10 screw.
http://www.yeashin.com
1
REV.02 20120305
DEVICE CHARACTERISTICS
KBPC15005N THRU KBPC1510N
FIG.1-DERATING CURVE FOR
OUTPUT RECTIFIED CURRENT
15
FIG.2-MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT PER ELEMENT
AVERAGE FORWARD OUTPUT
Heat Sink Mounting
PEAK FORWARD SURGE
5" X 4" X 3" Thick
300
CURRENT,(A)
(12.8 X 10.2 X 7.3cm)
8.3ms Single Half Sine-Wave
T
j
(JEDEC Method)
=T
j max
10
AL.Finned Plate
CURRENT, (A)
200
Single Phase
5.0
Half Wave 60Hz
Inductive or Resistive
Load
100
1 Cycle
0
0
25
50 55
75
100
125
150
175
0
1
10
100
CASE TEMPERATURE, ( ° C)
NUMBER OF CYCLES AT 60 Hz
FIG.4-TYPICAL REVERSE
CHARACTERISTICS
FIG.3-TYPICAL FORWARD CHARACTERICTICS
PER BRIDGE ELEMENT
100
PER BRIDGE ELEMENT
100
T
j
=100 ° C
INSTANTANEOUS FORWARD CURRENT,
INSTANTANEOUS REVERSE CURRENT,
10
10
(A)
(uA)
1.0
1.0
T
j
=25 ° C
Pulse Width=300uS
1%Duty Cycle
T
j
=25 ° C
0.1
0.1
0.01
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0.01
0
20
40
60
80
100
120
140
INSTANTANEOUS FORWARD VOLT
AGE,(V)
PERCENT OF RATED PEAK
REVERSE VOLTAGE,(%)
FIG.5-TYPICAL JUNCTION CAPACITANCE
PER BRIDGE ELEMENT
1000
FIG.6-MAXIMUM POWER DISSIPATION
100
AVERAGE POWER DISSIPATION OF BRIDGE,
JUNCTION CAPACITANCE,(pF)
80
(W)
T =T
j j max
60
Capacitive
Load
100
T
j
=25 ° C
f=1MHz
V
sig
=50mV
p-p
40
Resistive
or
20
Inductive
Load
10
0.1
1.0
10
100
0
0
5
10
15
20
25
30
35
REVRESE VOLTAGE,(V)
AVERAGE OUTPUT CURRENT, (A)
http://www.yeashin.com
2
REV.02 20120305
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
