DATA SHEET
SEMICONDUCTOR
KBPC15005 THRU KBPC1510
MB35 Unit:inch(mm)
VOLTAGE RANGE 50 TO 1000V CURRENT 15 Ampere
FEATURES
•Low
cost
•This
series is UL recognized under component
index, file number E127707
•High
overload surge current capability
•Low
thermal resistance.
•High
isolation voltage from case to lugs.
•High
temperature soldering guaranteed:
260℃/10 second, at 5 lbs. (2.3kg) tension.
•High
temperature soldering : 260
O
C / 10 seconds at terminals
•Pb
free product at available : 99% Sn above meet RoHS
environment substance directive request
MECHANICAL DATA
•Case:
Metal case
•Terminal:
Plated 0.25" (6.35mm) lug.
•Polarity:
Polarity symbols marked on case.
•Mounting:
Thru hole for #10 screw, 20 in,- lbs. Torqute Max.
•Weight:
1.02 ounce, 29 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
•
•
•
Ratings at 25℃ ambient temperature unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load derate current by 20%
KBPC
15005
50
35
50
KBPC KBPC
1501
100
70
100
1502
200
140
200
KBPC
1504
400
280
400
15
KBPC
1506
600
420
600
KBPC
1508
800
560
800
KBPC
1510
1000
700
1000
UNIT
Volts
Volts
Volts
Amps
PARAMETER
Maximum Repetitive Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Output
Current, at TC = 55℃ (Note 1, 2)
Peak Forward Surge Current
8.3ms single half sine - wave superimposed on
rated load (JEDEC method )
Rating for Fusing (t<8.3ms)
Maximum Instantaneous Forward Voltage Drop
per bridge element at 7.5A
Maximum DC Reverse Current at rate
DC blocking voltage per element
Isolation Voltage from case to lugs
Typical Thermal Resistance (Note 1,2)
Operating Temperature Range
Storage Temperature Range
TA = 25℃
SYMBOLS
VRRM
VRMS
VDC
I(AV)
IFSM
I2t
VF
300
373
1.1
10
Amps
A2s
Volts
μA
mA
VAC
℃/W
℃
IR
TA =100℃
VISO
RθJC
TJ
TSTG
1.0
2500
2.0
(-65 to +150)
(-65 to +150)
1. Unit mounted on 5" X 4" X 3" (12.8cm X 10.2cm X 7.3cm)Al. finned Plate.
2. Bolt down on heat-sink with silicon thermal compound between bridge and mounting sutfae for maximum heat
transfer efficiency with # 10 screw.
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REV.02 20120305
DEVICE CHARACTERISTICS
KBPC15005 THRU KBPC1510
FIG.1-DERATING CURVE FOR
OUTPUT RECTIFIED CURRENT
15
FIG.2-MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT PER ELEMENT
AVERAGE FORWARD OUTPUT
Heat Sink Mounting
PEAK FORWARD SURGE
5" X 4" X 3" Thick
300
CURRENT,(A)
(12.8 X 10.2 X 7.3cm)
8.3ms Single Half Sine-Wave
T
j
(JEDEC Method)
=T
j max
10
AL.Finned Plate
CURRENT, (A)
200
Single Phase
5.0
Half Wave 60Hz
Inductive or Resistive
Load
100
1 Cycle
0
0
25
50 55
75
100
125
150
175
0
1
10
100
CASE TEMPERATURE, ( ° C)
NUMBER OF CYCLES AT 60 Hz
FIG.4-TYPICAL REVERSE
CHARACTERISTICS
FIG.3-TYPICAL FORWARD CHARACTERICTICS
PER BRIDGE ELEMENT
100
PER BRIDGE ELEMENT
100
T
j
=100 ° C
INSTANTANEOUS FORWARD CURRENT,
INSTANTANEOUS REVERSE CURRENT,
10
10
(A)
(uA)
1.0
1.0
T
j
=25 ° C
Pulse Width=300uS
1%Duty Cycle
T
j
=25 ° C
0.1
0.1
0.01
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0.01
0
20
40
60
80
100
120
140
AGE,(V)
INSTANTANEOUS FORWARD VOLT
PERCENT OF RATED PEAK
REVERSE VOLTAGE,(%)
FIG.5-TYPICAL JUNCTION CAPACITANCE
PER BRIDGE ELEMENT
1000
FIG.6-MAXIMUM POWER DISSIPATION
100
AVERAGE POWER DISSIPATION OF BRIDGE,
JUNCTION CAPACITANCE,(pF)
80
(W)
T =T
j j max
60
Capacitive
Load
100
T
j
=25 ° C
f=1MHz
V
sig
=50mV
p-p
40
Resistive
or
20
Inductive
Load
10
0.1
1.0
10
100
0
0
5
10
15
20
25
30
35
REVRESE VOLTAGE,(V)
AVERAGE OUTPUT CURRENT,
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REV.02 20120305
Embedded System
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