BUFFER AMPLIFIER, MBCY12
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | DIP |
| package instruction | DIP, DIP16,.3 |
| Contacts | 16 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Amplifier type | BUFFER |
| Nominal bandwidth (3dB) | 200 MHz |
| Maximum input offset voltage | 10000 µV |
| JESD-30 code | R-PDIP-T16 |
| JESD-609 code | e0 |
| length | 21.755 mm |
| Negative supply voltage upper limit | -20 V |
| Nominal Negative Supply Voltage (Vsup) | -15 V |
| Number of functions | 1 |
| Number of terminals | 16 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -25 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | +-15 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| minimum slew rate | 2000 V/us |
| Nominal slew rate | 2500 V/us |
| Maximum slew rate | 26 mA |
| Supply voltage upper limit | 20 V |
| Nominal supply voltage (Vsup) | 15 V |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| Base Number Matches | 1 |
| LH4010CN | LH4010 | LH4010CG | LH4010G | |
|---|---|---|---|---|
| Description | BUFFER AMPLIFIER, MBCY12 | BUFFER AMPLIFIER, MBCY12 | BUFFER AMPLIFIER, MBCY12 | BUFFER AMPLIFIER, MBCY12 |
| Is it Rohs certified? | incompatible | - | incompatible | incompatible |
| Parts packaging code | DIP | - | BCY | BCY |
| package instruction | DIP, DIP16,.3 | - | TO-8, QUAD12,.4SQ | TO-8, QUAD12,.4SQ |
| Contacts | 16 | - | 12 | 12 |
| Reach Compliance Code | unknow | - | unknow | unknow |
| ECCN code | EAR99 | - | EAR99 | EAR99 |
| Amplifier type | BUFFER | - | BUFFER | BUFFER |
| Nominal bandwidth (3dB) | 200 MHz | - | 200 MHz | 200 MHz |
| Maximum input offset voltage | 10000 µV | - | 10000 µV | 25000 µV |
| JESD-30 code | R-PDIP-T16 | - | O-MBCY-W12 | O-MBCY-W12 |
| JESD-609 code | e0 | - | e0 | e0 |
| Negative supply voltage upper limit | -20 V | - | -20 V | -20 V |
| Nominal Negative Supply Voltage (Vsup) | -15 V | - | -15 V | -15 V |
| Number of functions | 1 | - | 1 | 1 |
| Number of terminals | 16 | - | 12 | 12 |
| Maximum operating temperature | 85 °C | - | 85 °C | 125 °C |
| Minimum operating temperature | -25 °C | - | -25 °C | -55 °C |
| Package body material | PLASTIC/EPOXY | - | METAL | METAL |
| encapsulated code | DIP | - | TO-8 | TO-8 |
| Encapsulate equivalent code | DIP16,.3 | - | QUAD12,.4SQ | QUAD12,.4SQ |
| Package shape | RECTANGULAR | - | ROUND | ROUND |
| Package form | IN-LINE | - | CYLINDRICAL | CYLINDRICAL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| power supply | +-15 V | - | +-15 V | +-15 V |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified |
| minimum slew rate | 2000 V/us | - | 2000 V/us | 2000 V/us |
| Nominal slew rate | 2500 V/us | - | 2500 V/us | 2500 V/us |
| Maximum slew rate | 26 mA | - | 26 mA | 26 mA |
| Supply voltage upper limit | 20 V | - | 20 V | 20 V |
| Nominal supply voltage (Vsup) | 15 V | - | 15 V | 15 V |
| surface mount | NO | - | NO | NO |
| technology | BIPOLAR | - | BIPOLAR | BIPOLAR |
| Temperature level | OTHER | - | OTHER | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | - | WIRE | WIRE |
| Terminal pitch | 2.54 mm | - | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | - | BOTTOM | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
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