32-Bit System-on-Chip

| LH7A400 | LH7A400N0F000B3A | LH7A400N0F000B5 | LH7A400N0F076B5 | LH7A400N0G000B5 | |
|---|---|---|---|---|---|
| Description | 32-Bit System-on-Chip | 32-Bit System-on-Chip | 32-Bit System-on-Chip | 32-Bit System-on-Chip | 32-Bit System-on-Chip |
| Is it Rohs certified? | - | conform to | conform to | conform to | conform to |
| Maker | - | NXP | NXP | NXP | NXP |
| Parts packaging code | - | BGA | BGA | BGA | BGA |
| package instruction | - | LFBGA, BGA256,16X16,40 | LFBGA, BGA256,16X16,40 | PLASTIC, LFBGA-256 | PLASTIC, BGA-256 |
| Contacts | - | 256 | 256 | 256 | 256 |
| Reach Compliance Code | - | unknow | compli | unknow | unknow |
| Has ADC | - | NO | NO | NO | NO |
| Other features | - | ALSO REQUIRES 3.3 V I/O SUPPLY | ALSO REQUIRES 3.3 V I/O SUPPLY | ALSO REQUIRES 3.3 V I/O SUPPLY | ALSO REQUIRES 3.3 V I/O SUPPLY |
| Address bus width | - | 28 | 28 | 28 | 28 |
| bit size | - | 32 | 32 | 32 | 32 |
| maximum clock frequency | - | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| DAC channel | - | NO | NO | NO | NO |
| DMA channel | - | YES | YES | YES | YES |
| External data bus width | - | 32 | 32 | 32 | 32 |
| JESD-30 code | - | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 |
| length | - | 14 mm | 14 mm | 14 mm | 17 mm |
| Number of I/O lines | - | 60 | 60 | 60 | 60 |
| Number of terminals | - | 256 | 256 | 256 | 256 |
| Maximum operating temperature | - | 70 °C | 70 °C | 70 °C | 70 °C |
| PWM channel | - | YES | YES | YES | YES |
| Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | - | LFBGA | LFBGA | LFBGA | BGA |
| Encapsulate equivalent code | - | BGA256,16X16,40 | BGA256,16X16,40 | BGA256,16X16,40 | BGA256,16X16,40 |
| Package shape | - | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | - | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY |
| power supply | - | 1.8,3.3 V | 1.8,3.3 V | 1.8,3.3 V | 1.8,3.3 V |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| ROM programmability | - | FLASH | FLASH | FLASH | FLASH |
| Maximum seat height | - | 1.7 mm | 1.7 mm | 1.7 mm | 1.95 mm |
| speed | - | 250 MHz | 250 MHz | 250 MHz | 250 MHz |
| Maximum supply voltage | - | 1.89 V | 1.89 V | 1.89 V | 1.89 V |
| Minimum supply voltage | - | 1.71 V | 1.71 V | 1.71 V | 1.71 V |
| Nominal supply voltage | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| surface mount | - | YES | YES | YES | YES |
| technology | - | CMOS | CMOS | CMOS | CMOS |
| Temperature level | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | - | BALL | BALL | BALL | BALL |
| Terminal pitch | - | 0.8 mm | 0.8 mm | 0.8 mm | 1 mm |
| Terminal location | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| width | - | 14 mm | 14 mm | 14 mm | 17 mm |
| uPs/uCs/peripheral integrated circuit type | - | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
| JESD-609 code | - | - | e1 | e1 | e1 |
| Humidity sensitivity level | - | - | 3 | 3 | 3 |
| Peak Reflow Temperature (Celsius) | - | - | 260 | 260 | 260 |
| Terminal surface | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| Maximum time at peak reflow temperature | - | - | 30 | 30 | 30 |