Innovative
Technology
for a
Connected
World
Ferrite Chip Beads
Laird Technologies has broadened its Ferrite Chip Bead product offering by adding the smaller EIA 0201
(Metric 0603) version to the existing EIA 0402 ~ 3312 (Metric 1005 ~ 8531) product family. The smaller
foot-print makes this chip bead ideal for miniature and portable electronic system devices. The new LI0201
series is an ultra-compact, monolithic EMI suppression chip designed for digital signal lines. It offers space
efficiency with superior EMI noise filtering over a wide frequency range of low to several hundred MHz for
broad-band signal interfaces, up to GHz ranges for high-frequency signal lines.
LI0201
FEATURES
• Rugged monolithic construction
• Smaller foot-print: 0.6 mm x 0.3 mm x 0.3 mm
• Superior impedance vs. frequency characteristics with
low DCR
• EMI noise suppression for high frequency and
broad-band signal lines
• Lead free and RoHS compliant
MARKETS
• Advanced hand-held devices
• Cellular phones
• Bluetooth headsets
• PDAs
• GPS
• MP3 players
• Digital camcorders and cameras
ELECTRICAL PROPERTIES
IMpedanCe (Ω)
Part Number
Metric
Package
Size
0603
0603
0603
0603
0603
0603
0603
0603
25
MHz
7
11
31
18
41
39
59
81
100
MHz
33
56
80
80
80
120
120
240
500
MHz
113
186
195
335
119
247
189
586
1
GHz
153
252
224
428
116
269
182
321
peak IMpedanCe
Frequency
(MHz)
1646
1347
978
903
605
800
630
390
Impedance
(Ω)
171
268
225
434
120
275
190
619
DCR
Max
(Ω)
0.5
0.6
0.8
0.6
0.5
0.8
0.7
1
Current Rating
(mA)
300
300
200
300
500
200
300
200
LI0201C330R-10
LI0201C560R-10
LI0201B800R-10
LI0201C800R-10
LI0201E800R-10
LI0201B121R-10
LI0201C121R-10
LI0201B241R-10
MECHANICAL DIMENSIONS
Land Pattern
Metric
(EIA)
Pkg
Size
0603
(0201)
A
mm
(inch)
0.60
(.024)
B
mm
(inch)
0.30
(.012)
C
mm
(inch)
0.30
(.012)
D
mm
(inch)
0.15
(.006)
G
mm
(inch)
0.25
(.010)
H
mm
(inch)
0.32
(.013)
L
mm
(inch)
0.69
(.027)
global
solutions:
local
support
USA: +1 800 634.2673
+1 423 308.1690
Europe: +49 8031.2460.0
Asia: +86 755.2714.1166
www.lairdtech.com
TM
Ferrite Chip Beads
Innovative
Technology
for a
Connected
World
LI0201
Packaging Specifications
STANDARD QUANTITY
Type
0201
QTY (PCS)
15,000
REEL DIMENSION
TAPING DIMENSION 8mm wide
* Paper Tape
unit:mm
Type
0201
W [mm]
9.0 ±0.3
TAPING MATERIAL
* Paper Tape
Product
Type
0201
A
0.38 ±0.02
B
0.68 ± 0.02
P
2.0 ±0.05
T(max.)
0.44
Top tape
Chip Bead
Paper tape
Bottom tape
TOP TAPE STRENGTH
* The force for tearing off top tape is 20 to 70 grams in the arrow direction.
165° to 180°
Top Cover Tape
Sprocket hole
Chip cavity
LEADER AND BLANK PORTION
Blank
10 to 20 pitches
Chips
Blank
20 to 40 pitches
Leader
210mm to 250mm
Drawing direction
* The pitch holes shift within ±0.3mm for cumulative 10 pitches
global
solutions:
local
support
USA: +1 800 634.2673
+1 423 308.1690
Europe: +49 8031.2460.0
Asia: +86 755.2714.1166
www.lairdtech.com
TM
SIP-SPEC-0201 1008
Any information furnished by Laird Technologies and its agents is believed to be accurate and reliable. Responsibility for the use and application of Laird Technologies
materials rests with the end user since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness,
merchantability, or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or conse-
quential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies domestic terms and conditions of sale in effect from time to time, a
copy of which will be furnished upon request. For further information please visit our website at www.lairdtech.com Alternatively contact: sales@lairdtech.com. Bluetooth
®
is a
trademark owned by Bluetooth SIG, Inc., USA and licensed to Laird Technologies.
® 2008 All Rights Reserved. Laird Technologies is a registered trademark of Laird Technologies, Inc.
Ferrite Chip Beads
Innovative
Technology
for a
Connected
World
LI0201
Application Notes
LEAD-FREE/ROHS COMPLIANCE
PART NUMBERING SYSTEM
All Laird Technologies’ surface mount and through hole EMI components (including assemblies with wire and cofired monolithic ferrite
chip beads and common mode chokes) are available lead-free and RoHS compliant.
Lead-free board level part numbers are differentiated by a suffix descriptor. The suffix (-10) identifies the part number for all lead-free
parts. This part number suffix is for use on board level part numbers only.
PART NUMBER EXAMPLES
Old Part
New Part
HZ0805E601R-00
HZ0805E601R-10
contains lead
is lead-free
Old Part 28F0121-0SR
contains lead
New Part 28F0121-0SR-10 is lead-free
All Laird Technologies’ new and old ferrite cable cores are RoHS compliant. No part number change for cable cores.
COMPOSITION
Laird Technologies’ lead-free component terminations and wire platings are 100% matte Tin (Sn) over a Nickel (Ni) barrier and are
reverse compatible with existing Tin (Sn)/Lead (Pb) materials.
Concerns over the use of pure tin coatings on component leads and terminations, due to the possibility of tin whiskering, are still under
industry discussion. Electroplating 100% matte tin over a nickel barrier is recognized as an effective whisker growth mitigation strategy
that is accepted by most industry groups. Laird Technologies’ maintains a minimum plating thickness of 2.5µm [99µin] of Tin, and
0.7µm [28µin] of Nickel.
RECOMMENDED LEAD-FREE
SOLDERING PROFILE
While Laird Technologies’ lead-free surface mount and
through hole components are reverse compatible with
existing Sn/Pb materials, higher peak temperatures (up to
260°C) provide better wetting characteristics during the
solder reflow process. The higher reflow temperatures
typically used for lead-free processes will not damage
Laird Technologies’ surface mount components, but
the delta T between the board and larger components
must be considered. Smaller delta Ts can be achieved
with slower belt speed to increase the pre-heat time.
Soldering cycle time (throughput) must be balanced with
reflow temperature. Allowance must be made for the
coldest part (largest heat sink) to solder, considering the
thermal mass of the board and size of the components.
global
solutions:
local
support
USA: +1 800 634.2673
+1 423 308.1690
Europe: +49 8031.2460.0
Asia: +86 755.2714.1166
www.lairdtech.com
TM
NXP MCU
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