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LMX9838SB

Description
SPECIALTY TELECOM CIRCUIT, PBGA70
CategoryWireless rf/communication    Telecom circuit   
File Size988KB,30 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
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LMX9838SB Overview

SPECIALTY TELECOM CIRCUIT, PBGA70

LMX9838SB Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNational Semiconductor(TI )
package instructionLGA, LGA70(UNSPEC)
Reach Compliance Codecompliant
JESD-30 codeR-PBGA-N70
JESD-609 codee0
length17 mm
Number of functions1
Number of terminals70
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLGA
Encapsulate equivalent codeLGA70(UNSPEC)
Package shapeRECTANGULAR
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)235
power supply3.3 V
Certification statusNot Qualified
Maximum seat height2.1 mm
Maximum slew rate0.065 mA
Nominal supply voltage3.3 V
surface mountYES
Telecom integrated circuit typesTELECOM CIRCUIT
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width10 mm

LMX9838SB Related Products

LMX9838SB LMX9838_0709 LMX9838 LMX9838SBX
Description SPECIALTY TELECOM CIRCUIT, PBGA70 SPECIALTY TELECOM CIRCUIT, PBGA70 SPECIALTY TELECOM CIRCUIT, PBGA70 SPECIALTY TELECOM CIRCUIT, PBGA70
Number of functions 1 1 1 1
Number of terminals 70 70 70 70
Maximum operating temperature 85 °C 85 Cel 85 Cel 85 Cel
Minimum operating temperature -40 °C -40 Cel -40 Cel -40 Cel
surface mount YES Yes Yes Yes
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form NO LEAD BUTT BUTT BUTT
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
Rated supply voltage - 3.3 V 3.3 V 3.3 V
Processing package description - 10 X 17 MM, 2 MM HEIGHT, LGA-70 10 X 17 MM, 2 MM HEIGHT, LGA-70 10 X 17 MM, 2 MM HEIGHT, LGA-70
state - TRANSFERRED TRANSFERRED TRANSFERRED
packaging shape - RECTANGULAR RECTANGULAR RECTANGULAR
Package Size - GRID ARRAY GRID ARRAY GRID ARRAY
Terminal spacing - 1 mm 1 mm 1 mm
terminal coating - TIN LEAD TIN LEAD NOT SPECIFIED
Packaging Materials - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Communication type - TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT
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