Dual Micropower 150 mA Ultra Low-Dropout CMOS Voltage Regulators in micro SMD Package
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | National Semiconductor（TI ） |
| package instruction | 0.995 MM, MICRO, BUMP, SMD-8 |
| Reach Compliance Code | _compli |
| ECCN code | EAR99 |
| Is Samacsys | N |
| Adjustability | FIXED |
| Maximum drop-back voltage 1 | 0.1 V |
| Nominal dropback voltage 1 | 0.06 V |
| Maximum drop-back voltage 2 | 0.1 V |
| Maximum absolute input voltage | 6.5 V |
| Maximum input voltage | 6 V |
| Minimum input voltage | 2.7 V |
| JESD-30 code | S-PBGA-B8 |
| JESD-609 code | e0 |
| length | 1.55 mm |
| Maximum grid adjustment rate | 0.0095% |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Output times | 2 |
| Number of terminals | 8 |
| Working temperatureTJ-Max | 125 °C |
| Operating temperatureTJ-Mi | -40 °C |
| Maximum output current 1 | 0.15 A |
| Maximum output current 2 | 0.15 A |
| Maximum output voltage 1 | 3.193 V |
| Minimum output voltage 1 | 3.007 V |
| Nominal output voltage 1 | 3.1 V |
| Maximum output voltage 2 | 3.193 V |
| Minimum output voltage 2 | 3.007 V |
| Nominal output voltage 2 | 3.1 V |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | VFBGA |
| Encapsulate equivalent code | BGA8,3X3,20 |
| Package shape | SQUARE |
| Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| method of packing | TAPE AND REEL |
| Peak Reflow Temperature (Celsius) | 260 |
| Certification status | Not Qualified |
| Regulator type | FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR |
| Maximum seat height | 0.995 mm |
| surface mount | YES |
| technology | CMOS |
| Terminal surface | Tin/Lead (Sn63Pb37) |
| Terminal form | BALL |
| Terminal pitch | 0.5 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | 40 |
| Maximum voltage tolerance | 3% |
| width | 1.55 mm |
| Base Number Matches | 1 |
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