|
LP5550SQX |
LP5550 |
LP5550SQ |
| Description |
PowerWise Technology Compliant Energy Management Unit |
PowerWise Technology Compliant Energy Management Unit |
PowerWise Technology Compliant Energy Management Unit |
| Is it Rohs certified? |
incompatible |
- |
incompatible |
| Maker |
National Semiconductor(TI ) |
- |
National Semiconductor(TI ) |
| package instruction |
LLP-16 |
- |
LLP-16 |
| Reach Compliance Code |
_compli |
- |
_compli |
| ECCN code |
EAR99 |
- |
EAR99 |
| Other features |
AUTOMATIC PWM/PFM MODE AVAILABLE |
- |
AUTOMATIC PWM/PFM MODE AVAILABLE |
| Analog Integrated Circuits - Other Types |
SWITCHING REGULATOR |
- |
SWITCHING REGULATOR |
| control mode |
VOLTAGE-MODE |
- |
VOLTAGE-MODE |
| Control Technology |
PULSE WIDTH MODULATION |
- |
PULSE WIDTH MODULATION |
| Maximum input voltage |
5.5 V |
- |
5.5 V |
| Minimum input voltage |
3 V |
- |
3 V |
| Nominal input voltage |
3.6 V |
- |
3.6 V |
| JESD-30 code |
S-XQCC-N16 |
- |
S-XQCC-N16 |
| JESD-609 code |
e0 |
- |
e0 |
| length |
4 mm |
- |
4 mm |
| Humidity sensitivity level |
1 |
- |
1 |
| Number of functions |
1 |
- |
1 |
| Number of terminals |
16 |
- |
16 |
| Maximum operating temperature |
85 °C |
- |
85 °C |
| Minimum operating temperature |
-40 °C |
- |
-40 °C |
| Maximum output current |
0.75 A |
- |
0.75 A |
| Package body material |
UNSPECIFIED |
- |
UNSPECIFIED |
| encapsulated code |
HVQCCN |
- |
HVQCCN |
| Encapsulate equivalent code |
LCC16,.16SQ,20 |
- |
LCC16,.16SQ,20 |
| Package shape |
SQUARE |
- |
SQUARE |
| Package form |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
- |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) |
260 |
- |
260 |
| power supply |
3.3/5 V |
- |
3.3/5 V |
| Certification status |
Not Qualified |
- |
Not Qualified |
| Maximum seat height |
0.8 mm |
- |
0.8 mm |
| surface mount |
YES |
- |
YES |
| Switch configuration |
BUCK |
- |
BUCK |
| Maximum switching frequency |
1360 kHz |
- |
1360 kHz |
| technology |
NMOS |
- |
NMOS |
| Temperature level |
INDUSTRIAL |
- |
INDUSTRIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
- |
Tin/Lead (Sn/Pb) |
| Terminal form |
NO LEAD |
- |
NO LEAD |
| Terminal pitch |
0.5 mm |
- |
0.5 mm |
| Terminal location |
QUAD |
- |
QUAD |
| Maximum time at peak reflow temperature |
40 |
- |
40 |
| width |
4 mm |
- |
4 mm |