Digital Signal Processor, 32-Bit Size, CMOS, CPGA223,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Atmel (Microchip) |
| package instruction | PGA, PGA223,18X18 |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.2.C |
| bit size | 32 |
| Format | FLOATING POINT |
| JESD-30 code | S-XPGA-P223 |
| JESD-609 code | e0 |
| Number of terminals | 223 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | PGA |
| Encapsulate equivalent code | PGA223,18X18 |
| Package shape | SQUARE |
| Package form | GRID ARRAY |
| power supply | 5 V |
| Certification status | Not Qualified |
| RAM (number of words) | 0 |
| Maximum slew rate | 430 mA |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | PIN/PEG |
| Terminal pitch | 2.54 mm |
| Terminal location | PERPENDICULAR |
| TSC21020F-20SA | TSC21020F-20SB | |
|---|---|---|
| Description | Digital Signal Processor, 32-Bit Size, CMOS, CPGA223, | Digital Signal Processor, 32-Bit Size, CMOS, CQFP256, |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | Atmel (Microchip) | Atmel (Microchip) |
| package instruction | PGA, PGA223,18X18 | QFF, QFL256,2.1SQ,20 |
| Reach Compliance Code | unknown | unknown |
| ECCN code | 3A001.A.2.C | 3A001.A.2.C |
| bit size | 32 | 32 |
| Format | FLOATING POINT | FLOATING POINT |
| JESD-30 code | S-XPGA-P223 | S-XQFP-F256 |
| JESD-609 code | e0 | e0 |
| Number of terminals | 223 | 256 |
| Maximum operating temperature | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C |
| Package body material | CERAMIC | CERAMIC |
| encapsulated code | PGA | QFF |
| Encapsulate equivalent code | PGA223,18X18 | QFL256,2.1SQ,20 |
| Package shape | SQUARE | SQUARE |
| Package form | GRID ARRAY | FLATPACK |
| power supply | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified |
| Maximum slew rate | 430 mA | 430 mA |
| Nominal supply voltage | 5 V | 5 V |
| surface mount | NO | YES |
| technology | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | PIN/PEG | FLAT |
| Terminal pitch | 2.54 mm | 0.5 mm |
| Terminal location | PERPENDICULAR | QUAD |