(Notes 2, 3) ................................................ –40 to 125°C
Storage Temperature Range ...................... –65 to 125°C
Lead Temperature (Soldering, 10 sec)
MSE Only .......................................................... 300°C
pin conFiguraTion
TOP VIEW
PZ1
PZ2
CAP
V
IN
SW
1
2
3
4
5
11
GND
10 PGOOD
9 D0
8 D1
7 V
IN2
6 V
OUT
TOP VIEW
PZ1
PZ2
CAP
V
IN
SW
1
2
3
4
5
11
GND
10
9
8
7
6
PGOOD
D0
D1
V
IN2
V
OUT
DD PACKAGE
10-LEAD (3mm
×
3mm) PLASTIC DFN
T
JMAX
= 125°C,
θ
JA
= 43°C/W,
θ
JC
= 7.5°C/W
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB
MSE PACKAGE
10-LEAD PLASTIC MSOP
T
JMAX
= 125°C,
θ
JA
= 45°C/W,
θ
JC
= 10°C/W
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB
orDer inForMaTion
LEAD FREE FINISH
LTC3588EDD-2#PBF
LTC3588IDD-2#PBF
LTC3588EMSE-2#PBF
LTC3588IMSE-2#PBF
TAPE AND REEL
LTC3588EDD-2#TRPBF
LTC3588IDD-2#TRPBF
LTC3588EMSE-2#TRPBF
LTC3588IMSE-2#TRPBF
PART MARKING*
LFYK
LFYK
LTFYM
LTFYM
PACKAGE DESCRIPTION
10-Lead (3mm
×
3mm) Plastic DFN
10-Lead (3mm
×
3mm) Plastic DFN
10-Lead Plastic MSOP
10-Lead Plastic MSOP
TEMPERATURE RANGE
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
For more information on lead free part marking, go to:
http://www.linear.com/leadfree/
This product is only offered in trays. For more information go to:
http://www.linear.com/packaging/
35882fa
2
LTC3588-2
elecTrical characTerisTics
SYMBOL
V
IN
I
Q
PARAMETER
Input Voltage Range
V
IN
Quiescent Current
UVLO
Buck Enabled, Sleeping
Buck Enabled, Not Sleeping
V
IN
Undervoltage Lockout Threshold
V
IN
Shunt Regulator Voltage
Maximum Protective Shunt Current
Internal Bridge Rectifier Loss
(|V
PZ1
– V
PZ2
| – V
IN
)
Internal Bridge Rectifier Reverse
Leakage Current
Internal Bridge Rectifier Reverse
Breakdown Voltage
V
OUT
Regulated Output Voltage
The
l
denotes the specifications which apply over the full operating
junction temperature range, otherwise specifications are for T
A
= 25°C (Note 2). V
IN
= 18V unless otherwise specified.
CONDITIONS
Low Impedance Source on V
IN
V
IN
= 12V, Not PGOOD
V
IN
= 18V
I
SW
= 0A (Note 4)
V
IN
Rising
V
IN
Falling
V
SHUNT
I
SHUNT
I
VIN
= 1mA
1ms Duration
I
BRIDGE
= 10µA
V
REVERSE
= 18V
I
REVERSE
= 1µA
3.45V Output Selected
Sleep Threshold
Wake-Up Threshold
4.1V Output Selected
Sleep Threshold
Wake-Up Threshold
4.5V Output Selected
Sleep Threshold
Wake-Up Threshold
5.0V Output Selected
Sleep Threshold
Wake-Up Threshold
As a Percentage of the Selected V
OUT
V
OUT
= 5.0V
200
100
1.1
1.3
l
l
l
l
l
l
MIN
TYP
MAX
18.0
UNITS
V
nA
nA
µA
V
V
V
mA
mV
nA
V
830
1500
150
16.0
13.0
18.8
25
350
400
14.0
20.0
1400
2500
250
17.0
21.2
450
20
V
UVLO
V
SHUNT
30
l
l
l
l
l
l
l
l
3.346
3.979
4.354
4.825
83
3.466
3.434
4.116
4.084
4.516
4.484
5.016
4.984
92
125
260
3.554
4.221
4.646
5.175
V
V
V
V
V
V
V
V
%
nA
mA
mA
Ω
Ω
%
V
PGOOD Falling Threshold
I
VOUT
I
PEAK
I
BUCK
R
P
R
N
V
IH(D0, D1)
V
IL(D0, D1)
I
IH(D0, D1)
I
IL(D0, D1)
Output Quiescent Current
Buck Peak Switch Current
Available Buck Output Current
Buck PMOS Switch On-Resistance
Buck NMOS Switch On-Resistance
Max Buck Duty Cycle
D0/D1 Input High Voltage
D0/D1 Input Low Voltage
D0/D1 Input High Current
D0/D1 Input Low Current
250
350
100
1.2
0.4
10
10
V
nA
nA
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2:
The LTC3588E-2 is tested under pulsed load conditions such
that T
J
≈ T
A
. The LTC3588E-2 is guaranteed to meet specifications
from 0°C to 85°C junction temperature. Specifications over the –40°C
to 125°C operating junction temperature range are assured by design,
characterization and correlation with statistical process controls. The
LTC3588I-2 is guaranteed over the –40°C to 125°C operating junction
temperature range. Note that the maximum ambient temperature
consistent with these specifications is determined by specific operating
conditions in conjunction with board layout, the rated package thermal
impedance and other environmental factors.
Note 3:
The junction temperature (T
J
, in °C) is calculated from the ambient
temperature (T
A
, in °C) and power dissipation (P
D
, in Watts) according
to the formula: T
J
= T
A
+ (P
D
•
θ
JA
), where
θ
JA
(in °C/W) is the package
thermal impedance.
Note 4:
Dynamic supply current is higher due to gate charge being
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