SSY39L400454CEK datasheet, PDF

Datasheet> All Categories > SSY39L400454CEK

Preview

SSY39L400454CEK: Description2 MBIT / 4 MBIT / 8 MBIT ( X 16 ) MULTI - PURPOSE FLASH; File Size317KB，30 Pages; ManufacturerSST; Websitehttp://www.ssti.com

Download Datasheet View All

SSY39L400454CEK Overview

2 MBIT / 4 MBIT / 8 MBIT ( X 16 ) MULTI - PURPOSE FLASH

Preview

Download Datasheet

View All

2 Mbit / 4 Mbit / 8 Mbit (x16) Multi-Purpose Flash

SST39LF200A / SST39LF400A / SST39LF800A

SST39VF200A / SST39VF400A / SST39VF800A

SST39LF/VF200A / 400A / 800A3.0 & 2.7V 2Mb / 4Mb / 8Mb (x16) MPF memories

Data Sheet

FEATURES:

• Organized as 128K x16 / 256K x16 / 512K x16

• Single Voltage Read and Write Operations

– 3.0-3.6V for SST39LF200A/400A/800A

– 2.7-3.6V for SST39VF200A/400A/800A

• Superior Reliability

– Endurance: 100,000 Cycles (typical)

– Greater than 100 years Data Retention

• Low Power Consumption

– Active Current: 20 mA (typical)

– Standby Current: 3 µA (typical)

• Sector-Erase Capability

– Uniform 2 KWord sectors

• Block-Erase Capability

– Uniform 32 KWord blocks

• Fast Read Access Time

– 45 and 55 ns for SST39LF200A/400A

– 55 ns for SST39LF800A

– 70 and 90 ns for SST39VF200A/400A/800A

• Latched Address and Data

• Fast Erase and Word-Program

– Sector-Erase Time: 18 ms (typical)

– Block-Erase Time: 18 ms (typical)

– Chip-Erase Time: 70 ms (typical)

– Word-Program Time: 14 µs (typical)

– Chip Rewrite Time:

2 seconds (typical) for SST39LF/VF200A

4 seconds (typical) for SST39LF/VF400A

8 seconds (typical) for SST39LF/VF800A

• Automatic Write Timing

– Internal V

Generation

• End-of-Write Detection

– Toggle Bit

– Data# Polling

• CMOS I/O Compatibility

• JEDEC Standard

– Flash EEPROM Pinouts and command sets

• Packages Available

– 48-lead TSOP (12mm x 20mm)

– 48-ball TFBGA (6mm x 8mm)

PRODUCT DESCRIPTION

The SST39LF200A/400A/800A and SST39VF200A/400A/

800A devices are 128K x16 / 256K x16 / 512K x16 CMOS

Multi-Purpose Flash (MPF) manufactured with SST’s pro-

prietary, high performance CMOS SuperFlash technology.

The split-gate cell design and thick oxide tunneling injector

attain better reliability and manufacturability compared with

alternate approaches. The SST39LF200A/400A/800A

write (Program or Erase) with a 3.0-3.6V power supply. The

SST39VF200A/400A/800A write (Program or Erase) with a

2.7-3.6V power supply. These devices conform to JEDEC

standard pinouts for x16 memories.

Featuring high performance Word-Program, the

SST39LF200A/400A/800A and SST39VF200A/400A/

800A devices provide a typical Word-Program time of 14

µsec. The devices use Toggle Bit or Data# Polling to detect

the completion of the Program or Erase operation. To pro-

tect against inadvertent write, they have on-chip hardware

and software data protection schemes. Designed, manu-

factured, and tested for a wide spectrum of applications,

these devices are offered with a guaranteed endurance of

10,000 cycles. Data retention is rated at greater than 100

years.

The SST39LF200A/400A/800A and SST39VF200A/400A/

800A devices are suited for applications that require conve-

nient and economical updating of program, configuration,

or data memory. For all system applications, they signifi-

cantly improve performance and reliability, while lowering

power consumption. They inherently use less energy dur-

ing Erase and Program than alternative flash technologies.

When programming a flash device, the total energy con-

sumed is a function of the applied voltage, current, and

time of application. Since for any given voltage range, the

SuperFlash technology uses less current to program and

has a shorter erase time, the total energy consumed during

any Erase or Program operation is less than alternative

flash technologies. These devices also improve flexibility

while lowering the cost for program, data, and configuration

storage applications.

The SuperFlash technology provides fixed Erase and Pro-

gram times, independent of the number of Erase/Program

cycles that have occurred. Therefore the system software

or hardware does not have to be modified or de-rated as is

necessary with alternative flash technologies, whose Erase

and Program times increase with accumulated Erase/Pro-

gram cycles.

To meet surface mount requirements, the SST39LF200A/

400A/800A and SST39VF200A/400A/800A are offered in

both 48-lead TSOP packages and 48-ball TFBGA pack-

ages. See Figures 1 and 2 for pinouts.

S71117-04-000 6/01

360

The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc.

MPF is a trademark of Silicon Storage Technology, Inc.

These specifications are subject to change without notice.

Recommended Resources

Human touch alarm circuit diagram

TDA1515B power amplifier circuit diagram

Heavy load motor starting circuit_1

Prote MAM-SWF star-delta starting automatic water supply circuit

Temperature compensation output circuit diagram of MAX663

28V, 7A regulated power supply composed of MPC1000

How to debug EK-LM3S811-ND Rev 2 with J-Link?: How to debug EK-LM3S811-ND Rev 2 with J-Link? Previously, I used the chip on the board and a USB data cable to burn the program. Now I want to use J-Link for debugging so that I can draw the board mys...; xupz123 MCU

How to compile: Experts, please tell me. In MPLAB7.5, the PIC microcontroller compiler, how do you compile the instructions after the GOTO jump? For example: [color=red]CHECK[/color] ; Mode 1, turn for 60S and stop f...; yealien MCU

"Play Board" + Shared Bicycle Control Board - GPRS Module SIM800C: [i=s]This post was last edited by chenzhufly on 2020-3-16 20:23[/i]SIM800C is a quad-band GSM/GPRS module with a castellated hole package. It has stable performance, compact appearance, high cost perf...; chenzhufly Special Edition for Assessment Centres

How to use Visual Studio 2005 to write WinCE applications using Intel Celeron CPU?: How to use Visual Studio 2005 to write a WinCE application using Intel Celeron CPU? The application is required to be written in C++....; 梦想之家 Embedded System

The speed of Toshiba USB flash drive!: [i=s]This post was last edited by nemo1991 on 2015-5-1 23:26[/i] 7.70g of high-definition movies copied to a Toshiba USB drive! Equivalent to from SSD to USB drive. The speed is good~...; nemo1991 Talking

Please tell me, why is copper deposited on the inner wall of the via?: This is a MEMS microphone package with a bottom hole. When it was received on the PCB, the hole wall was coppered. I have drawn a similar package before. At that time, I used a soldering pad, and the ...; littleshrimp PCB Design

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components