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M58LT128GST1ZA5

Description
128Mbit (8Mb x16, Multiple Bank, Multi-Level, Burst) 1.8V Supply Secure Flash Memories
Categorystorage    storage   
File Size503KB,98 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Download Datasheet Parametric Compare View All

M58LT128GST1ZA5 Overview

128Mbit (8Mb x16, Multiple Bank, Multi-Level, Burst) 1.8V Supply Secure Flash Memories

M58LT128GST1ZA5 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSTMicroelectronics
Parts packaging codeBGA
package instruction10 X 13 MM, 1 MM PITCH, TBGA-64
Contacts64
Reach Compliance Code_compli
ECCN code3A991.B.1.A
Is SamacsysN
Maximum access time110 ns
Other featuresALSO OPERATES IN SYNC-REGISTERED MODE
startup blockTOP
command user interfaceYES
Universal Flash InterfaceYES
Data pollingNO
JESD-30 codeR-PBGA-B64
JESD-609 codee0
length13 mm
memory density134217728 bi
Memory IC TypeFLASH
memory width16
Number of functions1
Number of departments/size4,127
Number of terminals64
word count8388608 words
character code8000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
organize8MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTBGA
Encapsulate equivalent codeBGA64,8X8,40
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE
page size8 words
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
power supply1.8,3/3.3 V
Programming voltage1.8 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Department size16K,64K
Maximum standby current0.000005 A
Maximum slew rate0.047 mA
Maximum supply voltage (Vsup)2 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
switch bitNO
typeNOR TYPE
width10 mm
Base Number Matches1
M58LT128GST
M58LT128GSB
128Mbit (8Mb x16, Multiple Bank, Multi-Level, Burst)
1.8V Supply Secure Flash Memories
PRELIMINARY DATA
Features Summary
SUPPLY VOLTAGE
– V
DD
= 1.7 to 2.0V for program, erase and
read
– V
DDQ
= 2.7 to 3.6V for I/O Buffers
– V
PP
= 9V for fast program
SYNCHRONOUS / ASYNCHRONOUS READ
– Random Access: 110ns
– Asynchronous Page Read: 25ns.
– Synchronous Burst Read: 52MHz
SYNCHRONOUS BURST READ SUSPEND
PROGRAMMING TIME
– 10µs typical Word program time using
Buffer Enhanced Factory Program
command
MEMORY ORGANIZATION
– Multiple Bank Memory Array:
8 Mbit Banks
– Parameter Blocks (Top or Bottom location)
DUAL OPERATIONS
– program/erase in one Bank while read in
others
– No delay between read and write
operations
HARDWARE PROTECTION
– All Blocks Write Protected when V
PP
PPLK
V
SECURITY
– Software Security Features
– 64-bit Unique Device Identifier
– 2112 bits of User-Programmable OTP
memory
COMMON FLASH INTERFACE (CFI)
BGA
TBGA64 (ZA)
10 x 13mm
100,000 PROGRAM/ERASE CYCLES per
BLOCK
ELECTRONIC SIGNATURE
– Manufacturer Code: 20h
– Device Code:
M58LT128GST: 88C6h
M58LT128GSB: 88C7h
ECOPACK
®
PACKAGE AVAILABLE
September 2005
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
Rev 1.0
1/98
www.st.com
1

M58LT128GST1ZA5 Related Products

M58LT128GST1ZA5 M58LT128GS M58LT128GSB M58LT128GSB1ZA5E M58LT128GSB1ZA5F M58LT128GST M58LT128GST1ZA5E M58LT128GST1ZA5F
Description 128Mbit (8Mb x16, Multiple Bank, Multi-Level, Burst) 1.8V Supply Secure Flash Memories 128Mbit (8Mb x16, Multiple Bank, Multi-Level, Burst) 1.8V Supply Secure Flash Memories 128Mbit (8Mb x16, Multiple Bank, Multi-Level, Burst) 1.8V Supply Secure Flash Memories 128Mbit (8Mb x16, Multiple Bank, Multi-Level, Burst) 1.8V Supply Secure Flash Memories 128Mbit (8Mb x16, Multiple Bank, Multi-Level, Burst) 1.8V Supply Secure Flash Memories 128Mbit (8Mb x16, Multiple Bank, Multi-Level, Burst) 1.8V Supply Secure Flash Memories 128Mbit (8Mb x16, Multiple Bank, Multi-Level, Burst) 1.8V Supply Secure Flash Memories 128Mbit (8Mb x16, Multiple Bank, Multi-Level, Burst) 1.8V Supply Secure Flash Memories
Is it Rohs certified? incompatible - - conform to conform to - conform to conform to
Maker STMicroelectronics - - STMicroelectronics STMicroelectronics - STMicroelectronics STMicroelectronics
Parts packaging code BGA - - BGA BGA - BGA BGA
package instruction 10 X 13 MM, 1 MM PITCH, TBGA-64 - - 10 X 13 MM, 1 MM PITCH, LEAD FREE, TBGA-64 10 X 13 MM, 1 MM PITCH, LEAD FREE, TBGA-64 - 10 X 13 MM, 1 MM PITCH, LEAD FREE, TBGA-64 10 X 13 MM, 1 MM PITCH, LEAD FREE, TBGA-64
Contacts 64 - - 64 64 - 64 64
Reach Compliance Code _compli - - compli compli - compli compli
ECCN code 3A991.B.1.A - - 3A991.B.1.A 3A991.B.1.A - 3A991.B.1.A 3A991.B.1.A
Maximum access time 110 ns - - 110 ns 110 ns - 110 ns 110 ns
Other features ALSO OPERATES IN SYNC-REGISTERED MODE - - ALSO OPERATES IN SYNC-REGISTERED MODE ALSO OPERATES IN SYNC-REGISTERED MODE - ALSO OPERATES IN SYNC-REGISTERED MODE ALSO OPERATES IN SYNC-REGISTERED MODE
startup block TOP - - BOTTOM BOTTOM - TOP TOP
command user interface YES - - YES YES - YES YES
Universal Flash Interface YES - - YES YES - YES YES
Data polling NO - - NO NO - NO NO
JESD-30 code R-PBGA-B64 - - R-PBGA-B64 R-PBGA-B64 - R-PBGA-B64 R-PBGA-B64
length 13 mm - - 13 mm 13 mm - 13 mm 13 mm
memory density 134217728 bi - - 134217728 bi 134217728 bi - 134217728 bi 134217728 bi
Memory IC Type FLASH - - FLASH FLASH - FLASH FLASH
memory width 16 - - 16 16 - 16 16
Number of functions 1 - - 1 1 - 1 1
Number of departments/size 4,127 - - 4,127 4,127 - 4,127 4,127
Number of terminals 64 - - 64 64 - 64 64
word count 8388608 words - - 8388608 words 8388608 words - 8388608 words 8388608 words
character code 8000000 - - 8000000 8000000 - 8000000 8000000
Operating mode ASYNCHRONOUS - - ASYNCHRONOUS ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C - - 85 °C 85 °C - 85 °C 85 °C
Minimum operating temperature -25 °C - - -25 °C -25 °C - -25 °C -25 °C
organize 8MX16 - - 8MX16 8MX16 - 8MX16 8MX16
Package body material PLASTIC/EPOXY - - PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TBGA - - TBGA TBGA - TBGA TBGA
Encapsulate equivalent code BGA64,8X8,40 - - BGA64,8X8,40 BGA64,8X8,40 - BGA64,8X8,40 BGA64,8X8,40
Package shape RECTANGULAR - - RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR
Package form GRID ARRAY, THIN PROFILE - - GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE - GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE
page size 8 words - - 8 words 8 words - 8 words 8 words
Parallel/Serial PARALLEL - - PARALLEL PARALLEL - PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 240 - - 260 260 - 260 260
power supply 1.8,3/3.3 V - - 1.8,3/3.3 V 1.8,3/3.3 V - 1.8,3/3.3 V 1.8,3/3.3 V
Programming voltage 1.8 V - - 1.8 V 1.8 V - 1.8 V 1.8 V
Certification status Not Qualified - - Not Qualified Not Qualified - Not Qualified Not Qualified
Maximum seat height 1.2 mm - - 1.2 mm 1.2 mm - 1.2 mm 1.2 mm
Department size 16K,64K - - 16K,64K 16K,64K - 16K,64K 16K,64K
Maximum standby current 0.000005 A - - 0.000005 A 0.000005 A - 0.000005 A 0.000005 A
Maximum slew rate 0.047 mA - - 0.047 mA 0.047 mA - 0.047 mA 0.047 mA
Maximum supply voltage (Vsup) 2 V - - 2 V 2 V - 2 V 2 V
Minimum supply voltage (Vsup) 1.7 V - - 1.7 V 1.7 V - 1.7 V 1.7 V
Nominal supply voltage (Vsup) 1.8 V - - 1.8 V 1.8 V - 1.8 V 1.8 V
surface mount YES - - YES YES - YES YES
technology CMOS - - CMOS CMOS - CMOS CMOS
Temperature level OTHER - - OTHER OTHER - OTHER OTHER
Terminal form BALL - - BALL BALL - BALL BALL
Terminal pitch 1 mm - - 1 mm 1 mm - 1 mm 1 mm
Terminal location BOTTOM - - BOTTOM BOTTOM - BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 - - 40 40 - 40 40
switch bit NO - - NO NO - NO NO
type NOR TYPE - - NOR TYPE NOR TYPE - NOR TYPE NOR TYPE
width 10 mm - - 10 mm 10 mm - 10 mm 10 mm
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