5962-9471605HUA datasheet, PDF

Datasheet> All Categories > storage> storage> 5962-9471605HUA

5962-9471605HUA: DescriptionFlash Module, 128KX32, 60ns, HIP-66; Categorystorage storage; File Size5MB，923 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

Download Datasheet Parametric View All

5962-9471605HUA Overview

Flash Module, 128KX32, 60ns, HIP-66

5962-9471605HUA Parametric

Parameter Name	Attribute value
Maker	Microsemi
package instruction	HIP-66
Reach Compliance Code	unknown
Maximum access time	60 ns
Data polling	YES
JESD-30 code	S-XHIP-P66
JESD-609 code	e0
length	30.1 mm
memory density	4194304 bit
Memory IC Type	FLASH MODULE
memory width	32
Number of functions	1
Number of departments/size	8
Number of terminals	66
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	128KX32
Package body material	UNSPECIFIED
encapsulated code	HIP
Encapsulate equivalent code	PGA66,11X11
Package shape	SQUARE
Package form	IN-LINE
page size	128 words
Parallel/Serial	PARALLEL
power supply	5 V
Programming voltage	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	6.22 mm
Department size	16K
Maximum standby current	0.0065 A
Maximum slew rate	0.2 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	HEX
switch bit	YES
type	NOR TYPE
width	30.1 mm

Preview

Download Datasheet

View All

NOT MEASUREMENT

SENSITIVE

MIL-HDBK-103AJ

19 SEPTEMBER 2011

SUPERSEDING

MIL-HDBK-103AH

28 MARCH 2011

DEPARTMENT OF DEFENSE

HANDBOOK

LIST OF STANDARD MICROCIRCUIT DRAWINGS

This handbook is for guidance only. Do not cite this document

as a requirement.

AMSC N/A

FSC 5962

MIL-HDBK-103AJ

SCOPE

1.1 Purpose. The Standard Microcircuit Drawing Program (SMDP) is directly under the auspices of the

DoD Parts Management Program (PMP). The PMP is implemented by MIL-HDBK-512, "Parts Management." The PMP

will be the avenue for screening candidate parts for the SMDP by the DLA Land and Maritime Military Parts

Control Advisory Group (MPCAG).

1.2 Part or Identifying number (PIN). The PIN's listed in section 1, part I, are composed of the

elements shown in the following example (see 1.2.2 for one part - one part number differentiation):

One part - one part number PIN

5962-90123

Drawing number

(1.2.1)

Device

Type

Device

Class

Designator

(1.2.2)

Case

Outline

(1.2.3)

Lead

Finish

(1.2.3)

Non - one part - one part number PIN

86030

5962-88668

Drawing number

Device type

Case outline

(1.2.3)

Lead finish

(1.2.3)

1.2.1 Drawing number. One part - one part number SMD's for device classes Q, V, H, and K may cover

custom device products which are generally used to specify application specific integrated circuits

(both monolithic and hybrid). To differentiate between one part - one part number SMD's that cover

standard product from custom product a single alpha character will be placed in the unique 3 digit

portion of the SMD drawing number as in the following example: 5962-90A23. This will be the only

change to the SMD PIN for custom products.

1.2.2 Device class designator. One part - one part number SMD's (fully implemented after SMD

5962-90659) contain device requirements for all three of the major military microcircuit requirements

documents. By establishing a one part number system covering all three documents, the OEM can acquire

to the highest level available for a given generic device to meet system needs without modifying the

original contract parts selection criteria.

Military documentation format

New MIL-PRF-38535 Standard

Microcircuit Drawings

New MIL-PRF-38534 Standard

Microcircuit Drawings

New 1.2.1 of MIL-STD-883 Standard

Microcircuit Drawings, based on

Appendix A of MIL-PRF-38535

Example PIN

5962-XXXXXZZ(Q,V,T or N)YY

5962-XXXXXZZ(H,K,D,G or E)YY

5962-XXXXXZZ(M)YY

Manufacturing

source listing

QML-38535

QML-38534

MIL-HDBK-103

Document

listing

MIL-HDBK-103

1.2.3 Case outline/lead finish. Case outline and lead finish are as described in each SMD. The lead

finish indicated in the section 1 Part I listing is the most readily available from the manufacturer

listed for the part. The manufacturer is authorized to supply other lead finishes than what is listed

provided that further testing/qualification is performed by the manufacturer on the other lead finish(es).

The user needs to contact the manufacturer to determine the availability of other lead finishes not listed

herein.

1.2.4

Substitutability.

Device-class-Q devices will replace device-class-M devices.

This handbook is for guidance only and cannot be cited as a requirement.

MIL-HDBK-103AJ

APPLICABLE DOCUMENTS

DEFINITIONS

REQUIREMENTS

SMD's will be prepared in accordance with ASME Y14.100 and DOD

The procedures for the generation of an SMD are provided in

This section is not applicable to the handbook.

4.1 Drawing requirements.

directives.

4.2 Preparation procedures.

MIL-HDBK-780.

4.3 Drawing effectivity and duration. SMD's and device class M one part - one part number SMDs

which have become inactive for new design are reflected in section 1, part 1 of the appendix of this

document with an "I" in the status column.

4.4 Approved sources of supply. The approved sources of supply list in this handbook supersedes the

approved sources formerly listed in each individual SMD/DLA Land and Maritime Drawing. This handbook is the

official list of approved sources of supply for non-one part - one part number SMD PIN's and for device

class M one part - one part number SMD PIN's. Device classes B, S, Q, V, T, N (monolithic) and H, K, D, G, E

(hybrid) one part - one part number SMD PIN's are listed for the convenience of the users. Official listing

for B, S, Q, V, T, N, H, K, D, G, and E levels are available in the applicable QML. Manufacturers should

notify DLA Land and Maritime-VA in writing if they no longer wish to be listed as an approved source of

supply for any device listed herein. This letter will be used by DSCC to remove the manufacturer from

MIL-HDBK-103 for those devices that the manufacturer specifies that he will no longer supply.

4.5 Radiation hardness assurance (RHA) levels. SMD devices which meet the RHA requirements of MIL-PRF-

38535 or MIL-PRF-38534 will be marked with the appropriate RHA designator M, D, P, L, R, F, G, or H replacing

the dash (-) in the PIN as indicated in the following example:

5962(M, D, P, L, R, F, G, or H)8999901EA

Only the highest RHA level for which the device is qualified will be listed in Section 1, Part I of the

appendix of this document; however, at the request of the customer, the manufacturer is authorized to supply

any lower RHA level device. At the request of the customer, the non-RHA PIN designated with a dash (-) may

be supplied at the option of the manufacturer. The manufacturer may also opt to submit a certificate of

compliance to have the non-RHA PIN listed in addition to the RHA PIN in Section 1, Part I of the appendix of

this document.

4.6 Electrostatic discharge sensitivity (ESD) listing. ESD classification levels, as required by

MIL-PRF-38534 or MIL-PRF-38535, will be listed in the status column of section 1, part 1, of the

appendix. Manufacturers are required to send these classification levels to DLA Land and Maritime-VA for all

Standard Microcircuit Drawings for which they are an approved source. The ESD listing in section 1, part 1 of

the appendix will be in accordance with the following:

STATUS

Blank

INTERPRETATION

Data not submitted

Class 0; < 250 V

Class 1; 0 – 1999 V

Class 1A; 250 V – 499 V

Class 1B; 500 V – 999 V

Class 1C; 1,000 V – 1999 V

Class 2; 2000 V – 3999 V

Class 3;

≥

4000 V

Class 3A; 4000 V – 7999 V

Class 3B;

≥

8000 V

Recommended Resources

Working principle diagram of bidirectional thyristor trigger circuit

Record player ceramic phono amplifier circuit using LM386

Control circuit with multiple buttons to start and stop a motor

Internal circuit diagram of HM7101 thick film circuit

555 AC welding machine no-load power saving device circuit

Samsung 753DFhe755DF monitor diagram

[TI's First Low Power Design Competition] How to use the IAR For MSP430 library to build your own project: [i=s] This post was last edited by Mandy on 2014-12-13 19:48 [/i] [align=center][b][font=宋体][size=14.0pt]How to use the library provided by IAR For MSP430[/size][/font][font=宋体][size=14.0pt] to create...; Mandy Microcontroller MCU

2016 Goal List: [size=3]2015 has quietly gone, and 2016 has quietly arrived. [/size][size=3]A day's plan begins in the morning, so what should a year's plan begin with? [/size] [size=3]Does the 2016 goal list count? ...; lightxixi Talking

Please tell me how to protect the gas meter using Hall device from strong magnetism, and whether it has one or two Hall devices.: Please tell me, how does a gas meter that uses Hall devices for measurement protect itself from strong magnetism? Also, is there one or two Hall devices inside it? How does it measure using Hall devic...; 一沙一世 stm32/stm8

51 single chip microcomputer music player: The school has a YL236 (51 learning equipment). I have been playing with it for more than a year. I have some understanding of the software, but I found that I don’t know anything about the hardware. ...; 刘W杰 51mcu

Identification of Common Components: Identification of Common Components...; fighting PCB Design

X-ray Detector A121: Has anyone used the X-ray detector A121? Need help...; guiwan Analog electronics

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components