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5962-9471605HXX

Description
Flash Module, 128KX32, 60ns, HIP-66
Categorystorage    storage   
File Size5MB,923 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

5962-9471605HXX Overview

Flash Module, 128KX32, 60ns, HIP-66

5962-9471605HXX Parametric

Parameter NameAttribute value
MakerMicrosemi
package instructionHIP-66
Reach Compliance Codeunknown
Maximum access time60 ns
JESD-30 codeS-XHIP-P66
JESD-609 codee0
length28.7 mm
memory density4194304 bit
Memory IC TypeFLASH MODULE
memory width32
Number of functions1
Number of terminals66
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize128KX32
Package body materialUNSPECIFIED
encapsulated codeHIP
Package shapeSQUARE
Package formIN-LINE
Parallel/SerialPARALLEL
Programming voltage5 V
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum seat height5.84 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTIN LEAD
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationHEX
width28.7 mm
NOT MEASUREMENT
SENSITIVE
MIL-HDBK-103AJ
19 SEPTEMBER 2011
SUPERSEDING
MIL-HDBK-103AH
28 MARCH 2011
DEPARTMENT OF DEFENSE
HANDBOOK
LIST OF STANDARD MICROCIRCUIT DRAWINGS
This handbook is for guidance only. Do not cite this document
as a requirement.
AMSC N/A
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