AS1115
600mA Low Dropout NPN Voltage Regulator
FEATURES
•
Guaranteed 600mA Output
•
Three Terminal Adjustable Or Fixed 1.5V, 2.5V, 3V, 3.3V & 5V
•
Very Low Quiescent Current
•
Low Dropout Voltage Of 1.2 Volts At Full Load
•
Extremely Tight Load And Line Regulation
•
Very Low Temperature Coefficient
•
Logic-Controlled Electronic Shutdown
•
Internal Overcurrent Limiting & Thermal Overload Protection
•
Surface Mount Package SOT-223, TO-263, TO-252 , TO-220 & SO-8
APPLICATIONS
•
Portable/ Palm Top / Notebook Computers
•
Battery Chargers
•
Disk Drives
•
Portable Consumer Equipment
•
Portable Instrumentation
•
SMPS Post-Regulator
PRODUCT DESCRIPTION
The AS1115 is a low power positive-voltage regulator designed to meet 600mA output current. This device is an excellent choice for
use in battery-powered applications, as active terminators for the SCSI bus, and portable computers. The AS1115 features very low
quiescent current and very low dropout voltage of 1.2V at a full load and lower as output current decreases. This product is available
as an adjustable or fixed 3V, 3.3V, and 5V output voltages.
The AS1115 is offered in a 3-pin surface mount package SOT-223, TO-252, TO-220 & TO-263. The output capacitor of 10µF or
larger is needed for output stability of AS1115 as required by most of the other regulator circuits.
ORDERING INFORMATION
TO-220
3-PIN
AS1115U
AS1115U-X
TO-263
3-PIN
AS1115T
AS1115T-X
SOT-223
3-PIN
AS1115M3
AS1115M3-X
PLASTIC
SOIC 8-PIN
AS1115S
AS1115S-X
TO-252
DPAK
AS1115R
AS1115R-X
Oper. Temp.
Range
-40°C to +85°C
-40°C to +85°C
X = Output Voltage (X = 1.5V, 2.5V, 3.0V, 3.3V, 5.0V or Blank for Adjustable).
PIN CONNECTIONS
TO-263-3 Package
3 V
IN
2 V
OUT
SOT-223 Package
TO-220 Package
8-Pin Surface Mount
GND
1
2
8
7
V
IN
V
IN
V
IN
N/C
TO-252 Package
AS1115
AS1115
AS1115
1
2
3
V
OUT
ADJ/GND
N/C
V
OUT
V
OUT
AS1115
V
IN
3
2
1
V
IN
V
OUT
ADJ/GND
3
AS1115
6
4
5
1 ADJ/GND
ADJ/GND
V
OUT
V
IN
Front View
Front View
Front View
Top View
Front View
Rev. 10/2/00
AS1115
ABSOLUTE MAXIMUM RATINGS
Power Dissipation..........................................Internally Limited
Lead Temp. (Soldering, 5 Seconds) ................................ 260°C
Storage Temperature Range ............................ -65° to +150°C
Operating Junction Temperature Range
AS1115 .................................................. -40C° to +125°C
Input Supply Voltage ......................................-20V to +20V
ESD Rating ............................................................2KV Min
ELECTRICAL CHARACTERISTICS
at V
IN
= V
OUT
+1, Ta=25°C, CL =3.3µf, unless otherwise specified. Limits in
Boldface
apply over the full operating temperature range.
Parameter
1.5V Version
Conditions
I
OUT
=10mA, V
IN
=5.00V
0
≤I
OUT
≤600mA,
4.50≤V
IN
≤10V
I
OUT
=10mA, V
IN
=5.00V
0
≤I
OUT
≤600mA,
4.50≤V
IN
≤10V
I
OUT
=10mA, V
IN
=5.00V
0
≤I
OUT
≤600mA,
4.50≤V
IN
≤10V
I
OUT
=10mA, V
IN
=5.00V
0
≤I
OUT
≤600mA,
4.50≤V
IN
≤10V
I
OUT
=10mA, V
IN
=5.00V
0
≤I
OUT
≤600mA,
4.50≤V
IN
≤10
I
OUT
=10mA, (V
IN-
V
IN
) =2V
10
≤I
OUT
≤600mA,
1.4≤(V
IN
-V
IN
)
≤10V
Typ
1.500
AS1115
Min
1.485
1.470
2.475
2.450
2.970
2.940
3.267
3.234
4.950
4.900
1.238
1.225
Max
1.515
1.530
2.525
2.550
3.030
3.060
3.333
3.366
5.050
5.100
1.262
1.270
0.05
7.00
7.00
10.00
12.00
12.00
15.00
1.10
1.15
10.00
1000
0.1
75
0.03
0.003
15
Units
V
Output Voltage
2.5V Version
Output Voltage
3.0V Version
2.500
V
Output Voltage
3.3 V Version
3.000
V
Output Voltage
5.0V Version
3.300
V
Output Voltage
All Output Voltage
Reference Voltage
Output Voltage
Temperature Stability
Line Regulation
5.000
V
1.250
V
%
mV
Load Regulation
Dropout Voltage
( Note 2)
Quiescent Current
Current Limit
Thermal Regulation
Ripple Rejection
Long Term Stability
RMS Output Noise
Thermal Resistance
(Note 1)
4.50V
≤V
IN
≤12V,
V
OUT
=3.00, I
OUT
=0
4.80V
≤V
IN
≤12V,
V
OUT
=3.30, I
OUT
=0
6.50V
≤V
IN
≤15V,
V
OUT
=5.00, I
OUT
=0
0≤I
OUT
≤600mA,
V
IN
=4.50V, V
OUT
=3.00
0≤I
OUT
≤600mA,
V
IN
=4.80V, V
OUT
=3.30
0≤I
OUT
≤600mA,
V
IN
=6.50V, V
OUT
=5.00
I
L
= 100mA
I
L
= 600mA
4.25V
≤V
IN
≤6.5V
(V
IN
-V
OUT
)=5V
25°
°C,
30mS Pulse
f
RIPPLE
=120Hz, (V
IN
-V
OUT
) = 3V,
V
RIPPLE
=1V
p-p
125
°C, 1000Hrs
% of V
OUT
, 10Hz≤f≤10kHz
Junction to case, at tab
1.00
1.00
1.00
1.00
1.00
1.00
1.00
1.05
5.00
850
0.01
60
mV
V
mA
mA
%/W
dB
%
%
°C/W°
Note 1: Output temperature coefficient is defined as the worst case voltage change divided by the total temperature range
Note 2:
Dropout voltage is defined as the input to output differential at which the output voltage drops 100mV below its nominal value measured at 1V differential at
very low values of programmed output voltage, the minimum input supply voltage of 2V ( 2.3V over temperature) must be taken into account.
Note 3: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied. excluding loads or line
regulation effect
Rev. 10/2/00
AS1115
APPLICATION NOTES EXTERNAL
CAPACITOR
To ensure the stability of the AS1115 an output capacitor of
at least 10µF (tantalum)or 50µF (aluminum) is required. The
value may change based on the application requirements on
the output load or temperature range. The capacitor
equivalent series resistance (ESR) will effect the AS1115
stability. The value of ESR can vary from the type of
capacitor used in the applications. The recommended value
for ESR is 0.5Ω. The output capacitance could increase in
size to above the minimum value. The larger value of output
capacitance as high as 100µF can improve the load transient
response.
Maximum Junction Temperature range:
T
J
= T
ambient
(max) + P
D
* thermal resistance(Junction-to-
ambient)
Maximum Junction temperature must not exceed the 125°C.
10V
2.85V
SOLDERING METHODS
The AS1115 SOT-223 package is designed to be compatible
with infrared reflow or vapor-phase reflow soldering
techniques. During soldering the non-active or mildly active
fluxes may be used. The AS1115 die is attached to the
heatsink lead which exits opposite the input, output, and
ground pins.
Hand soldering and wave soldering should be avoided since
these methods can cause damage to the device with excessive
thermal gradients on the package.
The SOT-223
recommended soldering method are as follows: vapor phase
reflow and infrared reflow with the component preheated to
within 65°C of the soldering temperature range.
AS1115-3.3
+
+
10uF
10uF
27K
Ω
..
P
O
= (10V - 2.85)(105mA) = (7.15)(105mA) = 703mW
Fig. 1. Circuit Layout, Thermal Experiments.
THERMAL CHARACTERISTICS
The thermal resistance of AS1115 is 15°C/W from junction
to tab and 31
°C/W
from tab to ambient for a total of 46
°C/W
from junction to ambient. The AS1115 features the
internal thermal limiting to protect the device during
overload conditions. Special care needs to be taken during
continuos load conditions the maximum junction temperature
does not exceed 125
°C.
Taking the FR-4 printed circuit board and 1/16 thick with 1
ounce copper foil as an experiment (fig.1 & fig.2), the PCB
material is effective at transmitting heat with the tab attached
to the pad area and a ground plane layer on the backside of
the substrate. Refer to table 1 for the results of the
experiment.
The thermal interaction from other components in the
application can effect the thermal resistance of the AS1115.
The actual thermal resistance can be determined with
experimentation. AS1115 power dissipation is calculated as
follows:
P
D
= (V
IN
- V
OUT
)(I
OUT
)
50 X 50 mm
35 X 17 mm
16 X 10 mm
Fig. 2. Substrate Layout for SOT-223
Rev. 10/2/00
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