EEWORLDEEWORLDEEWORLD

Part Number

Search

89H22H16G2ZBBLI

Description
PCI Bus Controller, PBGA1156
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size347KB,57 Pages
ManufacturerIDT (Integrated Device Technology)
Download Datasheet Parametric Compare View All

89H22H16G2ZBBLI Overview

PCI Bus Controller, PBGA1156

89H22H16G2ZBBLI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
package instructionBGA, BGA1156,34X34,40
Reach Compliance Codecompliant
ECCN code3A001.A.3
Address bus width
Bus compatibilityI2C; ISA; PCI; SMBUS; VGA
maximum clock frequency125 MHz
Maximum data transfer rate22000 MBps
External data bus width
JESD-30 codeS-PBGA-B1156
length35 mm
Number of terminals1156
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA1156,34X34,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply1,2.5,2.5/3.3 V
Certification statusNot Qualified
Maximum seat height3.42 mm
Maximum slew rate5455 mA
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width35 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
22-Lane 16-Port PCIe® Gen2
System Interconnect Switch
®
89HPES22H16G2
Data Sheet
Device Overview
The 89HPES22H16G2 is a member of the IDT PRECISE™ family of
PCI Express® switching solutions. The PES22H16G2 is a 22-lane, 16-
port system interconnect switch optimized for PCI Express Gen2 packet
switching in high-performance applications, supporting multiple simulta-
neous peer-to-peer traffic flows. It provides connectivity and switching
functions between a PCI Express upstream port and up to fifteen down-
stream ports and supports switching between downstream ports.
• Drive strength
Switch Partitioning
Features
High Performance Non-Blocking Switch Architecture
Sixteen maximum switch ports
• Two x4 ports
• Fourteen x1 ports
Integrated SerDes supports 5.0 GT/s Gen2 and 2.5 GT/s
Gen1 operation
Delivers 22 GBps (176 Gbps) of aggregate switching capacity
Supports up to 128 Bytes to 2 KB maximum payload size
Low latency cut-through architecture
Supports one virtual channel and eight traffic classes
Standards and Compatibility
PCI Express Base Specification 2.0 compliant
Implements the following optional PCI Express features
• Advanced Error Reporting (AER) on all ports
• End-to-End CRC (ECRC)
• Access Control Services (ACS)
• Power Budgeting Enhanced Capability
• Device Serial Number Enhanced Capability
• Sub-System ID and Sub-System Vendor ID Capability
• Internal Error Reporting ECN
• Multicast ECN
• VGA and ISA enable
• L0s and L1 ASPM
• ARI ECN
Port Configurability
x4, x2, and x1 ports
• Ability to merge adjacent x4 ports to create a x8 port
Automatic per port link width negotiation (x4
x2
x1)
Crosslink support
Automatic lane reversal
Autonomous and software managed link width and speed
control
Per lane SerDes configuration
• De-emphasis
• Receive equalization
IDT proprietary feature that creates logically independent
switches in the device
Supports up to 16 fully independent switch partitions
Configurable downstream port device numbering
Supports dynamic reconfiguration of switch partitions
• Dynamic port reconfiguration — downstream, upstream
• Dynamic migration of ports between partitions
• Movable upstream port within and between switch partitions
Initialization / Configuration
Supports Root (BIOS, OS, or driver), Serial EEPROM, or
SMBus switch initialization
Common switch configurations are supported with pin strap-
ping (no external components)
Supports in-system Serial EEPROM initialization/program-
ming
Quality of Service (QoS)
Port arbitration
• Round robin
Request metering
• IDT proprietary feature that balances bandwidth among
switch ports for maximum system throughput
High performance switch core architecture
• Combined Input Output Queued (CIOQ) switch architecture
with large buffers
Multicast
Compliant to the PCI-SIG multicast ECN
Supports arbitrary multicasting of Posted transactions
Supports 64 multicast groups
Multicast overlay mechanism support
ECRC regeneration support
Clocking
Supports 100 MHz and 125 MHz reference clock frequencies
Flexible port clocking modes
• Common clock
• Non-common clock
• Local port clock with SSC and port reference clock input
Hot-Plug and Hot Swap
Hot-plug controller on all ports
• Hot-plug supported on all downstream switch ports
All ports support hot-plug using low-cost external I
2
C I/O
expanders
Configurable presence detect supports card and cable appli-
cations
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 57
2011 Integrated Device Technology, Inc.
November 28, 2011

89H22H16G2ZBBLI Related Products

89H22H16G2ZBBLI 89H22H16G2ZBBL 89H22H16G2ZBBLG 89H22H16G2ZBBLGI 89H22H16G2ZCBLGI
Description PCI Bus Controller, PBGA1156 PCI Bus Controller, PBGA1156 PCI Bus Controller, PBGA1156 PCI Bus Controller, PBGA1156 PCI Bus Controller, PBGA1156
Is it Rohs certified? incompatible incompatible conform to conform to conform to
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
package instruction BGA, BGA1156,34X34,40 BGA, BGA1156,34X34,40 BGA, BGA1156,34X34,40 BGA, BGA1156,34X34,40 FCBGA-1156
Reach Compliance Code compliant compliant compliant compliant compliant
ECCN code 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3
Bus compatibility I2C; ISA; PCI; SMBUS; VGA I2C; ISA; PCI; SMBUS; VGA I2C; ISA; PCI; SMBUS; VGA I2C; ISA; PCI; SMBUS; VGA I2C; ISA; PCI; SMBUS; VGA
maximum clock frequency 125 MHz 125 MHz 125 MHz 125 MHz 125 MHz
Maximum data transfer rate 22000 MBps 22000 MBps 22000 MBps 22000 MBps 22000 MBps
JESD-30 code S-PBGA-B1156 S-PBGA-B1156 S-PBGA-B1156 S-PBGA-B1156 S-PBGA-B1156
length 35 mm 35 mm 35 mm 35 mm 35 mm
Number of terminals 1156 1156 1156 1156 1156
Maximum operating temperature 85 °C 70 °C 70 °C 85 °C 85 °C
Minimum operating temperature -40 °C - - -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA BGA
Encapsulate equivalent code BGA1156,34X34,40 BGA1156,34X34,40 BGA1156,34X34,40 BGA1156,34X34,40 BGA1156,34X34,40
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 1,2.5,2.5/3.3 V 1,2.5,2.5/3.3 V 1,2.5,2.5/3.3 V 1,2.5,2.5/3.3 V 1,2.5,2.5/3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.42 mm 3.42 mm 3.42 mm 3.42 mm 3.42 mm
Maximum slew rate 5455 mA 5455 mA 5455 mA 5455 mA 5455 mA
Maximum supply voltage 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V
Minimum supply voltage 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V
Nominal supply voltage 1 V 1 V 1 V 1 V 1 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 35 mm 35 mm 35 mm 35 mm 35 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
I can't use IAR and 430 simulator to write program into MCU, it always shows fatal error, session abort...
Please help me!!! Urgent, urgent!!! :Sad: I programmed with msp430f1122, using IAR5.3 version, the emulator is from Lierda, the emulator is set to the right chip, and other settings are basically corr...
48202022 Microcontroller MCU
【GD32450I-EVAL】+ 06SDRAM Introduction
[i=s]This post was last edited by DDZZ669 on 2020-10-4 17:28[/i]1 SDRAMRAM can be understood as memory, the space required by the program when running. GD32F450IK comes with 256K RAM. When a large mem...
DDZZ669 GD32 MCU
【ST NUCLEO-H743ZI Review】(1)First impressions of ST NUCLEO-H743ZI
The development board ST NUCLEO-H743ZI evaluated in this event is provided by STMicroelectronics. Thanks to STMicroelectronics for supporting EEWorld's evaluation! Actually, I should have received the...
dsjsjf stm32/stm8
Looking to buy an unused stm32f429 discovery development board
As the title says, can you please provide the price and board condition? Location: Nanjing. It is best if it has a screen and the screen functions well....
散吧散吧 Buy&Sell
What are the applications of sensor technology in automobiles?
What are the applications of sensor technology in automobiles? Please give some simple examples....
sensorexpert Automotive Electronics
Z-Stack low power consumption issue! ! ! ! ! !
[b]After the End Device enters sleep mode, the parent node will retain data for it. How long will the parent node retain data for the End Device? I saw a post in a TI community [url=http://www.deyisup...
_10104 RF/Wirelessly

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 695  2330  2706  232  993  14  47  55  5  20 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号