BD095-64C-A0-0250-0250-0570-LB datasheet, PDF

Datasheet> All Categories > The connector> The connector> BD095-64C-A0-0250-0250-0570-LB

BD095-64C-A0-0250-0250-0570-LB: DescriptionBoard Connector, 64 Contact(s), 2 Row(s), Male, Straight, 0.05 inch Pitch, Surface Mount Terminal, Black Insulator,; CategoryThe connector The connector; File Size133KB，1 Pages; ManufacturerGlobal Connector Technology; Environmental Compliance

Download Datasheet Parametric View All

BD095-64C-A0-0250-0250-0570-LB Overview

Board Connector, 64 Contact(s), 2 Row(s), Male, Straight, 0.05 inch Pitch, Surface Mount Terminal, Black Insulator,

BD095-64C-A0-0250-0250-0570-LB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Global Connector Technology
Reach Compliance Code	compliant
ECCN code	EAR99
body width	0.134 inch
subject depth	0.157 inch
body length	1.6 inch
Connector type	BOARD CONNECTOR
Contact to complete cooperation	SN ON NI
Contact completed and terminated	Tin (Sn) - with Nickel (Ni) barrier
Contact point gender	MALE
Contact material	COPPER ALLOY
contact mode	RECTANGULAR
Contact resistance	20 mΩ
Contact style	SQ PIN-SKT
Dielectric withstand voltage	300VAC V
Durability	100 Cycles
Insulation resistance	1000000000 Ω
Insulator color	BLACK
insulator material	LIQUID CRYSTAL POLYMER (LCP)
JESD-609 code	e3
Manufacturer's serial number	BD095
Plug contact pitch	0.05 inch
Match contact row spacing	0.05 inch
Installation method	STRAIGHT
Installation type	BOARD
Number of connectors	ONE
PCB row number	2
Number of rows loaded	2
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
PCB contact pattern	RECTANGULAR
PCB contact row spacing	4.8514 mm
Rated current (signal)	1 A
Guideline	UL
reliability	COMMERCIAL
Terminal pitch	1.27 mm
Termination type	SURFACE MOUNT
Total number of contacts	64

Preview

Download Datasheet

View All

Global Connector Technology Ltd. - BD095: 1.27mm PITCH PIN HEADER, DUAL ROW, SURFACE MOUNT, VERTICAL

Ordering Grid

BD095

No. of Contacts

06 to 66

XX X

XXXX

SPECIFICATIONS

规格:

CURRENT RATING

电流额定值：

1 AMP

INSULATOR RESISTANCE

绝缘电阻值：

1000 MEGOHMS MIN.

DIELECTRIC WITHSTANDING

耐电压：

AC 300 V

CONTACT RESISTANCE

接触电阻值：

20m

Ω

Max.

OPERATING TEMPERATURE

工½温度：

-40°C TO +105°C

CONTACT MATERIAL

端子物料：

COPPER ALLOY

INSULATOR MATERIAL

绝缘½物料

: POLYESTER

聚酯

, LCP, UL94V-0

SOLDERING PROCESS

可焊性

LCP -

IR REFLOW

回流焊

: 260°C for 10 sec.

WAVE

波峰焊

: 250°C for 5-10 sec

MANUAL SOLDER

人工焊接

: 350°C for 3-5 sec

MATES WITH

配套之母座

(SUBJECT TO PIN LENGTH

在端子长度适合的条件下

BD050

BD055

BD060

BD064

BD065

BD067

BD091

Contact Plating

A = Gold Flash All Over (Standard)

B = Selective Gold Flash Contact Area/

Tin On Tail

C = Tin All Over

G = 10µ" Gold Contact Area/Tin On Tail

H = 15µ Gold Contact Area/Tin On Tail

I = 30µ" Gold Contact Area/Tin On Tail

Locating Peg

0 = No Peg

1 = With Peg

Insulator Height "H"

A = 1.50mm (Standard)

K = 1.00mm

B = 2.00mm

Dimension D (1/100mm)

L = 2.50mm

(Post Height)

F = 3.00mm

Standard - 2.00mm = 0200

Standard - 3.50mm = 0350

or specify Dimension D

e.g. 2.50mm = 0250

Tolerances

(Except as noted)

Packing Options

B = Tape and Reel with Cap (Standard)

D = Tube (not available in 6, 8 & 10 Contacts)

E = Tube with Cap (not available in 6, 8 & 10 Contacts)

G = Plastic Box (only available in 6, 8 & 10 Contacts)

Insulator Material

L = LCP (Insulator H = A, B, L, F)

N = Nylon 6T (Insulator H = K)

Dimension F (1/100mm)

(Width of Footprint)

Standard - 5.70mm = 0570

or specify Dimension F

e.g. 2.50mm = 0250

Dimension E (1/100mm)

(PCB to Insulator)

Standard - 0.70mm = 0070

Minimum - 0.70mm = 0070

or specify Dimension E

e.g. 2.50mm = 0250

Part Number:-

Date:-

Dimensions in mm

ASE

INSULATOR

MATERIAL OPTION

REMOVED

BD095

Description:-

28 DEC 07

LYH

NO. CONTACTS &

PACKING OPTIONS

CHANGED

ASE

SOLDER TEMP &

MATES INFO.

UPDATED

ASE

INSULATOR MATERIAL

UPDATED FOR SPECIFIC

HEIGHT OPTIONS

CHANGES TO

STANDARD

DIMENSIONS

AJO

B2B PCN002

1.27mm HEADER

N6T REMOVAL

X. ± 0.30

X.X ± 0.20

X.XX ± 0.15

X.XXX ± 0.10

DRAWING

DETAIL

RELEASE

REV

DATE

28/12/07

CHANGE TO

PACKAGING

27/04/12

X.°±5°

.X°±2°

.XX°±1°

.XXX°±0.5°

1.27mm PITCH PIN HEADER, DUAL ROW,

SURFACE MOUNT, VERTICAL

Scale

NTS

www.gct.co

Drawn by

LYH

E & OE

20/05/09

27/07/09

07/08/09

08/12/09

31/05/12

18/03/13

Third Angle Projection

THIS DRAWING IS CONFIDENTIAL AND MUST NOT BE

COPIED OR DISCLOSED WITHOUT WRITTEN CONSENT

Revision

Material

See Note

Sheet No.

1/1

Recommended Resources

Low-side current sensing for high-performance, cost-sensitive applications

Inductive high voltage alarm circuit 4

Electromagnetic vibration table circuit 5

Phototransistor in series with photocontrolled thyristor

Circuit diagram (direct feedback)

Symmetrical power amplifier circuit

Semiconductor Heat Sink Design (pdf): Power supply cannot be separated from heat dissipation, here is the theoretical basis; let’s discuss it;...; zhuxl Power technology

The first "Embedded and Internet of Things" theme forum of China Embedded System Industry Association: [b] The "Embedded and Internet of Things" theme forum of the China Embedded Systems Industry Association will continue the original form of the "Hundreds of E-Forums" of the China Embedded Industry Al...; hirobox Embedded System

I found the purchase channel of Launchpad: This is not an advertisement, it is mainly for the convenience of forum members. I have searched for the more reliable channels: 1. In fact, the forum has a corresponding Taobao store, and forum membe...; wstt Microcontroller MCU

R329 development board series tutorial | Running aipu program on real machine: Through the Zhouyi AIPU deployment and simulation tutorial , everyone should have completed the simulation and execution of the model using the simulator on the PC. This tutorial will lead you to run ...; nmg Domestic Chip Exchange

PIC16F877 與RF CC2500程式???: 各為大家好!!我想請問一下PIC16F877 與 RF CC2500 所結合的程式碼要如何寫呢??(PIC16F877的資料經過RF傳輸再由另一個RF接收資料)麻煩請會寫的可以貼給我嗎??(傳送以及接收的程式)謝謝大家!!...; cow0295 Microchip MCU

Issues with timing simulation in Modelsim: I used Modlsim to perform functional simulation on the design , and it was correct. Then I added constraints to the design in QuarusII, generated a .sdc file, and compiled it. I put the generated netl...; eeleader-mcu FPGA/CPLD

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components