Polymeric PTC
MPTS Series
Feature and Applications
ROHS Compliant & Halogen Free
Excellent for high density applications
Surface Mount, 0805, 1206, 1210, 1812, 2920
Faster time to trip than standard SMD devices
Lower resistance than standard SMD devices
Operation Current: 0.05A ~ 3.0A
Maximum Voltage: 6V ~ 60V
Temperature Range: -40ºC to 85ºC
UL E223037
MPTS
Meritek Series
Size
1210
0805
L
10
R
0805
1206
1812
2920
Current rating
Semi-circular Termination
Rev.7
Polymeric PTC
MPTS Series
Electrical Characteristics (23ºC)
MPTS0805
Part
Number
MPTS0805L010R
MPTS0805L020R
MPTS0805L035R
MPTS0805L050R
MPTS0805L075R
MPTS0805L100R
Hold
Current
I
H
, A
0.10
0.20
0.35
0.50
0.75
1.00
Trip
Current
I
T
, A
0.30
0.50
0.75
1.00
1.50
1.95
Rated
Voltage
V
MAX
, Vdc
15
9
6
6
6
6
Max
Current
I
MAX
, A
100
100
100
100
40
40
Typical
Power
Pd, W
0.5
0.5
0.5
0.5
0.6
0.6
Max Time to Trip
Current
Amp
0.50
8.00
8.00
8.00
8.00
8.00
Time
Sec
1.50
0.02
0.10
0.10
0.20
0.30
Resistance
R
MIN
Ω
0.700
0.400
0.250
0.150
0.090
0.060
R1
MAX
Ω
6.000
3.500
1.200
0.850
0.350
0.210
I
H
=Hold current-maximum current at which the device will not trip at 23ºC still air.
I
T
=Trip current-minimum current at which the device will always trip at 23ºC still air.
V
MAX
=Maximum voltage device can withstand without damage at its rated current (I
MAX
)
I
MAX
= Maximum fault current device can withstand without damage at rated voltage (V
MAX
).
P
d
=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23ºC still air
environment.
R
MIN
=Minimum device resistance at 23ºC prior to tripping.
R1
MAX
=Maximum device resistance at 23ºC measured 1 hour after tripping or reflow soldering of 260ºC for 20 seconds.
Termination pad characteristics
Termination pad materials: Pure Tin
Product Dimensions (Millimeters)
MPTS0805
Part
Number
MPTS0805L010R
MPTS0805L020R
MPTS0805L035R
MPTS0805L050R
MPTS0805L075R
MPTS0805L100R
A
Min
2.00
2.00
2.00
2.00
2.00
2.00
Max
2.30
2.30
2.30
2.30
2.30
2.30
Min
1.20
1.20
1.20
1.20
1.20
1.20
B
Max
1.50
1.50
1.50
1.50
1.50
1.50
Min
0.55
0.55
0.45
0.55
0.55
0.75
C
Max
1.00
1.00
0.75
1.25
1.25
1.80
Min
0.20
0.20
0.20
0.20
0.20
0.20
D
Max
0.60
0.60
0.60
0.60
0.60
0.60
Min
0.10
0.10
0.10
0.10
0.10
0.10
E
Max
0.45
0.45
0.45
0.45
0.45
0.45
Rev.7
Polymeric PTC
MPTS Series
Thermal Derating Curve
Typical Time-To-Trip at 23ºC
A =MPTS0805L010R
B =MPTS0805L020R
C =MPTS0805L035R
D =MPTS0805L050R
E =MPTS0805L075R
F =MPTS0805L100R
100
A
B
C
D E
F
10
Time-to-trip (S)
1
0.1
0.01
0.1
1
Fault current (A)
10
Rev.7
Polymeric PTC
MPTS Series
The dimension in the table below provides the recommended pad layout for each MPTS0805 device
Pad dimensions (millimeters)
Device
All 0805 Series
A
Nominal
1.20
B
Nominal
1.00
C
Nominal
1.50
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Preheat :
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (tsmin to tsmax)
Time maintained above:
Temperature(T
L
)
Time (t
L
)
Pb-Free Assembly
3
℃/second
max.
150
℃
200
℃
60-180 seconds
217
℃
60-150 seconds
Peak/Classification Temperature(Tp) :
260
℃
Time within 5℃ of actual Peak :
Temperature (tp)
Ramp-Down Rate :
Time 25
℃
to Peak Temperature :
20-40 seconds
6
℃/second
max.
8 minutes max.
Solder reflow
Due to “Lead Free” nature, Temperature
and Dwell time for the soldering zone is
higher than those for Non-compliant
parts. This may cause damage to other
components.
Recommended max solder paste
thickness > 0.25mm.
Devices can be cleaned using standard
methods and aqueous solvent.
Rework should utilize standard industry
practices. Theses changes should apply
to all notes for each case size.
Storage Environment : < 30ºC / 60%RH
Caution:
If reflow temperatures exceed the
recommended profile, devices may not
meet the performance requirements.
Devices are not designed to be wave
soldered to the bottom side of the board.
Rev.7
Polymeric PTC
MPTS Series
Electrical Characteristics (23º)
MPTS1206
Part
Number
MPTS1206L005R
MPTS1206L010R
MPTS1206L012R
MPTS1206L016R
MPTS1206L020R
MPTS1206L025R
MPTS1206L035R
MPTS1206L050R
MPTS1206L050-24R
MPTS1206L075R
MPTS1206L075-16R
MPTS1206L100R
MPTS1206L110R
MPTS1206L150R
MPTS1206L200R
Hold
Current
I
H
, A
0.05
0.10
0.12
0.16
0.20
0.25
0.35
0.50
0.50
0.75
0.75
1.00
1.10
1.50
2.00
Trip
Current
I
T
, A
0.15
0.25
0.39
0.45
0.40
0.50
0.75
1.00
1.00
1.50
1.50
1.80
2.20
3.00
3.50
Rated
Voltage
V
MAX
, Vdc
60
60
48
48
30
16
16
8
24
6
16
6
6
6
6
Max
Current
I
MAX
, A
10
10
10
10
10
40
40
40
100
100
100
100
100
100
100
Typical
Power
Pd, W
0.4
0.4
0.6
0.6
0.4
0.6
0.4
0.4
0.6
0.6
0.6
0.6
0.8
0.8
0.8
Max Time to Trip
Current
Amp
0.25
0.50
1.00
1.00
8.00
8.00
8.00
8.00
8.00
8.00
8.00
8.00
8.00
8.00
8.00
Time
Sec
1.50
1.00
0.20
0.30
0.10
0.08
0.10
0.10
0.10
0.20
0.20
0.30
0.30
1.00
1.50
Resistance
R
MIN
Ω
3.60
1.60
1.40
1.10
0.600
0.550
0.300
0.150
0.150
0.090
0.090
0.055
0.040
0.030
0.018
R1
MAX
Ω
50.00
15.00
6.50
5.00
2.500
2.300
1.200
0.700
0.750
0.290
0.290
0.210
0.180
0.120
0.080
I
H
=Hold current-maximum current at which the device will not trip at 23ºC still air.
I
T
=Trip current-minimum current at which the device will always trip at 23ºC still air.
V
MAX
=Maximum voltage device can withstand without damage at its rated current (I
MAX
)
I
MAX
= Maximum fault current device can withstand without damage at rated voltage (V
MAX
).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23ºC still air
environment.
R
MIN
=Minimum device resistance at 23ºC prior to tripping.
R1
MAX
=Maximum device resistance at 23ºC measured 1 hour after tripping or reflow soldering of 260ºC for 20 seconds.
Termination pad characteristics
Termination pad materials: Pure Tin
Rev.7
FPGA/CPLD
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