MT47H128M8CF-25AT datasheet, PDF

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MT47H128M8CF-25AT: DescriptionDDR DRAM; Categorystorage; File Size9MB，131 Pages; ManufacturerMicron; Websitehttp://www.micron.com/

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MT47H128M8CF-25AT Overview

DDR DRAM

MT47H128M8CF-25AT Parametric

Parameter Name	Attribute value
state	ACTIVE
Memory IC type	double rate synchronous dynamic random access memory dynamic random access memory

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1Gb: x4, x8, x16 DDR2 SDRAM

Features

DDR2 SDRAM

MT47H256M4 – 32 Meg x 4 x 8 banks

MT47H128M8 – 16 Meg x 8 x 8 banks

MT47H64M16 – 8 Meg x 16 x 8 banks

Features

•

= +1.8V ±0.1V, V

DDQ

= +1.8V ±0.1V

JEDEC-standard 1.8V I/O (SSTL_18-compatible)

Differential data strobe (DQS, DQS#) option

4n-bit prefetch architecture

Duplicate output strobe (RDQS) option for x8

DLL to align DQ and DQS transitions with CK

8 internal banks for concurrent operation

Programmable CAS latency (CL)

Posted CAS additive latency (AL)

WRITE latency = READ latency - 1

Selectable burst lengths (BL): 4 or 8

Adjustable data-output drive strength

64ms, 8192-cycle refresh

On-die termination (ODT)

Industrial temperature (IT) option

RoHS-compliant

Supports JEDEC clock jitter specification

Options

•

Configuration

–

256 Meg x 4 (32 Meg x 4 x 8 banks)

–

128 Meg x 8 (16 Meg x 8 x 8 banks)

–

64 Meg x 16 (8 Meg x 16 x 8 banks)

•

FBGA package (Pb-free) – x16

–

84-ball FBGA (8mm x 12.5mm)

Rev. G, H

•

FBGA package (Pb-free) – x4, x8

–

60-ball FBGA (8mm x 11.5mm)

Rev. G

•

FBGA package (Pb-free) – x4, x8

–

60-ball FBGA (8mm x 10mm) Rev. H

•

FBGA package (lead solder) – x16

–

84-ball FBGA (8mm x 12.5mm)

Rev. G, H

•

FBGA package (lead solder) – x4, x8

–

60-ball FBGA (8mm x 11.5mm)

Rev. G

•

FBGA package (lead solder) – x4, x8

–

60-ball FBGA (8mm x 10mm) Rev. H

•

Timing – cycle time

–

1.875ns @ CL = 7 (DDR2-1066)

–

2.5ns @ CL = 5 (DDR2-800)

–

2.5ns @ CL = 6 (DDR2-800)

–

3.0ns @ CL = 4 (DDR2-667)

–

3.0ns @ CL = 5 (DDR2-667)

–

3.75ns @ CL = 4 (DDR2-533)

•

Self refresh

–

Standard

–

Low-power

•

Operating temperature

–

Commercial (0°C

≤

85°C)

–

Industrial (–40°C

≤

95°C;

–40°C

≤

85°C)

–

Automotive (–40°C

≤

, T

≤

105ºC)

•

Revision

Note:

Marking

256M4

128M8

64M16

-187E

-25E

-25

-3E

-3

-37E

None

:G/:H

1. Not all options listed can be combined to

define an offered product. Use the Part

Catalog Search on

www.micron.com

for

product offerings and availability.

PDF: 09005aef821ae8bf

1GbDDR2.pdf – Rev. T 02/10 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

1Gb: x4, x8, x16 DDR2 SDRAM

State Diagram .................................................................................................................................................. 9

Functional Description ................................................................................................................................... 10

Industrial Temperature .............................................................................................................................. 10

Automotive Temperature ........................................................................................................................... 11

General Notes ............................................................................................................................................ 11

Functional Block Diagrams ............................................................................................................................. 12

Ball Assignments and Descriptions ................................................................................................................. 15

Packaging ...................................................................................................................................................... 19

Package Dimensions .................................................................................................................................. 19

FBGA Package Capacitance ......................................................................................................................... 22

Electrical Specifications – Absolute Ratings ..................................................................................................... 23

Temperature and Thermal Impedance ........................................................................................................ 23

Electrical Specifications – I

Parameters ........................................................................................................ 26

Specifications and Conditions ............................................................................................................... 26

DD7

Conditions .......................................................................................................................................... 27

AC Timing Operating Specifications ................................................................................................................ 31

AC and DC Operating Conditions .................................................................................................................... 41

ODT DC Electrical Characteristics ................................................................................................................... 42

Input Electrical Characteristics and Operating Conditions ............................................................................... 43

Output Electrical Characteristics and Operating Conditions ............................................................................. 46

Output Driver Characteristics ......................................................................................................................... 48

Power and Ground Clamp Characteristics ....................................................................................................... 52

AC Overshoot/Undershoot Specification ......................................................................................................... 53

Input Slew Rate Derating ................................................................................................................................ 55

Commands .................................................................................................................................................... 68

Truth Tables ............................................................................................................................................... 68

DESELECT ................................................................................................................................................. 72

NO OPERATION (NOP) .............................................................................................................................. 73

LOAD MODE (LM) ..................................................................................................................................... 73

ACTIVATE .................................................................................................................................................. 73

READ ......................................................................................................................................................... 73

WRITE ....................................................................................................................................................... 73

PRECHARGE .............................................................................................................................................. 74

REFRESH ................................................................................................................................................... 74

SELF REFRESH ........................................................................................................................................... 74

Mode Register (MR) ........................................................................................................................................ 74

Burst Length .............................................................................................................................................. 75

Burst Type ................................................................................................................................................. 76

Operating Mode ......................................................................................................................................... 76

DLL RESET ................................................................................................................................................. 76

Write Recovery ........................................................................................................................................... 77

Power-Down Mode .................................................................................................................................... 77

CAS Latency (CL) ........................................................................................................................................ 78

Extended Mode Register (EMR) ....................................................................................................................... 79

DLL Enable/Disable ................................................................................................................................... 80

Output Drive Strength ................................................................................................................................ 80

DQS# Enable/Disable ................................................................................................................................. 80

RDQS Enable/Disable ................................................................................................................................. 80

Output Enable/Disable ............................................................................................................................... 80

On-Die Termination (ODT) ........................................................................................................................ 81

Contents

PDF: 09005aef821ae8bf

1GbDDR2.pdf – Rev. T 02/10 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

1Gb: x4, x8, x16 DDR2 SDRAM

Off-Chip Driver (OCD) Impedance Calibration ............................................................................................ 81

Posted CAS Additive Latency (AL) ............................................................................................................... 81

Extended Mode Register 2 (EMR2) .................................................................................................................. 83

Extended Mode Register 3 (EMR3) .................................................................................................................. 84

Initialization .................................................................................................................................................. 85

ACTIVATE ...................................................................................................................................................... 88

READ ............................................................................................................................................................. 90

READ with Precharge ................................................................................................................................. 94

READ with Auto Precharge .......................................................................................................................... 96

WRITE .......................................................................................................................................................... 101

PRECHARGE ................................................................................................................................................. 111

REFRESH ...................................................................................................................................................... 112

SELF REFRESH .............................................................................................................................................. 113

Power-Down Mode ....................................................................................................................................... 115

Precharge Power-Down Clock Frequency Change .......................................................................................... 122

Reset ............................................................................................................................................................. 123

CKE Low Anytime ...................................................................................................................................... 123

ODT Timing .................................................................................................................................................. 125

MRS Command to ODT Update Delay ........................................................................................................ 127

PDF: 09005aef821ae8bf

1GbDDR2.pdf – Rev. T 02/10 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

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