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BU-63825G2-100

Description
Mil-Std-1553 Controller, CMOS, CDSO70
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size824KB,49 Pages
ManufacturerData Device Corporation
Download Datasheet Parametric View All

BU-63825G2-100 Overview

Mil-Std-1553 Controller, CMOS, CDSO70

BU-63825G2-100 Parametric

Parameter NameAttribute value
MakerData Device Corporation
Reach Compliance Codecompliant
JESD-30 codeR-XDSO-G70
Number of terminals70
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC
encapsulated codeSOP
Encapsulate equivalent codeSOP70,1.4
Package shapeRECTANGULAR
Package formSMALL OUTLINE
power supply5,-12 V
Certification statusNot Qualified
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
uPs/uCs/peripheral integrated circuit typeSERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
BU-63825
SPACE LEVEL MIL-STD-1553
BC/RT/MT
ADVANCED COMMUNICATION ENGINE
(SP’ACE II) TERMINAL
FEATURES
Make sure the next
Card you purchase
has...
®
Direct Replacement for BU-61582
and BU-61583
Radiation Tolerant & Radiation
Hardened Versions
Fully Integrated 1553 Terminal
Flexible Processor Interface
16K x 16 Internal RAM
Automatic BC Retries
Programmable BC Gap Times
BC Frame Auto-Repeat
Intelligent RT Data Buffering
Ceramic Package
DESCRIPTION
The BU-63825(925) is a fully hardware & software compatible, direct
drop-in replacement for the BU-61582(83).
DDC’s BU-63825(925) Space Advanced Communication Engine
(Sp’ACE II) is a radiation hardened version of the BU-61580(81) ACE
terminal. DDC supplies the BU-63825 with enhanced screening for
space and other high reliability applications.
The BU-63825 provides a complete integrated BC/RT/MT interface
between a host processor and a MIL-STD-1553 bus. The
BU-63825(925) provides functional and software compatibility with
the standard BU-61580(81) product and is packaged in the same 1.9
square-inch package footprint.
As an option, DDC can supply the BU-63825 with space level screen-
ing. This entails enhancements in the areas of element evaluation
and screening procedures for active and passive elements, as well as
the manufacturing and screening processes used in producing the
terminals.
The BU-63825 integrates dual transceiver, protocol, memory man-
agement and processor interface logic, and 16K words of RAM in the
choice of 70-pin DIP or flat pack packages. Transceiverless versions
may be used with an external electrical or fiber optic transceiver.
To minimize board space and ‘glue’ logic, the Sp’ACE II terminals
provide flexibility in interfacing to a host processor and internal/exter-
nal RAM.
Multiple Ordering Options;
+5V (Only)
+5V/-15V
+5V/-12V
+5V/Transceiverless
+5V (Only, with Transmit Inhibits)
WARNING: ITAR CONTROLLED PRODUCT
The product(s) referenced on this data sheet or product
brief and certain related technical data is subject to the
U.S. Department of State International Traffic in Arms
Regulations (ITAR) 22 CFR 120-130 and may not be
exported without the appropriate prior authorization from
the Directorate of Defense Trade Controls, United States
Department of State. This datasheet includes only basic
marketing information on the function of the product and
therefore is not considered technical data as defined in
22CFR 120.10.
FOR MORE INFORMATION CONTACT:
Data Device Corporation
105 Wilbur Place
Bohemia, New York 11716
631-567-5600 Fax: 631-567-7358
www.ddc-web.com
Technical Support:
1-800-DDC-5757 ext. 7771
All trademarks are the property of their respective owners.
© 2005 Data Device Corporation
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