BF055-60A-B-0250-0250-1200-P-D datasheet, PDF

Datasheet> All Categories > The connector> The connector> BF055-60A-B-0250-0250-1200-P-D

BF055-60A-B-0250-0250-1200-P-D: DescriptionBoard Connector, 60 Contact(s), 2 Row(s), Male, Straight, 0.079 inch Pitch, Solder Terminal, Black Insulator,; CategoryThe connector The connector; File Size86KB，1 Pages; ManufacturerGlobal Connector Technology; Environmental Compliance

Download Datasheet Parametric View All

BF055-60A-B-0250-0250-1200-P-D Overview

Board Connector, 60 Contact(s), 2 Row(s), Male, Straight, 0.079 inch Pitch, Solder Terminal, Black Insulator,

BF055-60A-B-0250-0250-1200-P-D Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Global Connector Technology
Reach Compliance Code	compliant
ECCN code	EAR99
body width	0.157 inch
subject depth	0.472 inch
body length	2.362 inch
Connector type	BOARD CONNECTOR
Contact to complete cooperation	AU ON NI
Contact completed and terminated	GOLD OVER NICKEL
Contact point gender	MALE
Contact material	COPPER ALLOY
contact mode	RECTANGULAR
Contact resistance	20 mΩ
Contact style	SQ PIN-SKT
Dielectric withstand voltage	500VAC V
Durability	100 Cycles
maximum insertion force	2.0016 N
Insulation resistance	1000000000 Ω
Insulator color	BLACK
insulator material	POLYBUTYLENE TEREPHTHALATE
Manufacturer's serial number	BF055
Plug contact pitch	0.079 inch
Match contact row spacing	0.079 inch
Installation method	STRAIGHT
Installation type	BOARD
Number of connectors	ONE
PCB row number	2
Number of rows loaded	2
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
PCB contact pattern	RECTANGULAR
PCB contact row spacing	2.0066 mm
Plating thickness	FLASH inch
Rated current (signal)	2 A
Guideline	UL
reliability	COMMERCIAL
Terminal length	0.098 inch
Terminal pitch	2.0066 mm
Termination type	SOLDER
Total number of contacts	60
Evacuation force-minimum value	.199882 N

Preview

Download Datasheet

View All

Global Connector Technology Ltd. - BF055: 2.0mm PITCH ELEVATED PIN HEADER, DUAL ROW, THROUGH HOLE, VERTICAL

Ordering Grid

SPECIFICATIONS

规格

CURRENT RATING

电流额定值：

2 AMP

INSULATOR RESISTANCE

绝缘额定值：

1000 MEGOHMS MIN.

CONTACT RESISTANCE

接触电阻值：

20 mOHMS MAX

No. of Contacts

DIELECTRIC WITHSTANDING

耐电压：AC

500 V

04 to 80

OPERATING TEMPERATURE

工½温度：-40°C

TO +105°C

CONTACT MATERIAL

端子物料：COPPER

ALLOY

Contact Plating

INSULATOR MATERIAL

绝缘½物料:

A = Gold Flash All Over

STANDARD

标准物料:

POLYAMIDE

聚醯胺,

NYLON 6T, UL 94-V0

B = Selective Gold Flash Contact Area/

OPTIONS

可选物料:

POLYESTER

聚酯,

LCP, UL 94-V0

Tin On Tail

OR POLYESTER

聚酯,

PBT, UL94-V0

C = Tin All Over

SOLDERING PROCESS

可焊性:

G = 10µ" Gold Contact Area/Tin On Tail

NYLON 6T (STANDARD标准物料) -

IR REFLOW

回流焊:

260°C for 10 sec.

I = 30µ" Gold Contact Area/Tin On Tail

WAVE

波峰焊:230°C

for 5-10 sec.

Standard = Gold Flash All Over

MANUAL SOLDER

人工焊接:

350°C for 3-5 sec

PBT (OPTION

可选物料)

- MANUAL SOLDER人工焊接: 330°C for 3-5 sec.

(NOT SUITABLE FOR HI-TEMP PROCESS

不适合高温处理

)

LCP (OPTION

可选物料)

IR REFLOW

回流焊:

260°C for 10 sec.

WAVE

波峰焊:250°C

for 5-10 sec.

MANUAL SOLDER

人工焊接:

350°C for 3-5 sec

MATES WITH

配套之母座

(SUBJECT TO PIN LENGTH

在端子长度适合的条件下

BF065

BF075

BF080

BF095

BF100

BF105

BF115

BF120

BF055

XX X

XXXX

Packing Options

G = Plastic Box (Standard)

D = Tube

E = Tube with Cap

Insulator

Height 'H'

A = 1.50mm

B = 2.00mm

Standard = 2.00mm

Dimension C (1/100mm)

(Post Height)

Standard - 4.00mm = 0400

Or specify Dimension C

e.g. 2.50mm = 0250

TOL +/- 0.2mm

Insulator Material

N = Nylon 6T (Standard)

L = LCP

P = PBT

Dimension D (1/100mm)

(Tail Length)

Standard - 2.80mm = 0280

Or specify Dimension D

e.g. 2.50mm = 0250

TOL +/- 0.2mm

Dimension E (1/100mm)

(Stack Height)

Standard - 12.00mm = 1200

Minimum - 3.00mm = 0300

Or specify Dimension E

e.g. 5.00mm = 0500

TOL +/- 0.2mm

Tolerances

(Except as noted)

Part Number:-

Date:-

Dimensions in mm

X.°±5°

.X°±2°

.XX°±1°

X.XXX ± 0.10 .XXX°±0.5°

X.X ± 0.20

X.XX ± 0.15

Third Angle Projection

X. ± 0.30

BF055

Description:-

31 OCT 07

DETAIL

REV

DATE

LYH

DRAWING

RELEASE

31/10/07

CHANGE TO SOLDER

TEMP. INFORMATION

30/07/09

PACKING OPTIONS

CORRECTION TO

ORDERING GRID

CHANGED

27/04/09

10/06/09

RoHS

2.0mm PITCH ELEVATED PIN HEADER, DUAL ROW,

THROUGH HOLE, VERTICAL

Global

Connector

Technology

www.globalconnectortechnology.com

Scale

NTS

THIS DRAWING IS CONFIDENTIAL AND MUST NOT BE

COPIED OR DISCLOSED WITHOUT WRITTEN CONSENT

Revision

Material

See Note

Drawn by

LYH

E & OE

Sheet No.

1/1

Recommended Resources

Dual tone generator for audio

Excellent performance regulated power supply circuit diagram

Intermittent operation control circuit diagram

music synthesizer circuit

All-in-one single-chip remote control circuit, the mother body is NT6631A

Inverter circuit 1

Recommended RF front-end chips for mobile phones in the 5G era: Yole’s RF team estimates that the RF content in 5G phones is $ 5 to $ 8 more than the 4G version , and the millimeter wave version is $ 10 more . As a result, the RF front-end market is booming. Howev...; alan000345 RF/Wirelessly

【20-bit single-chip audio digital-to-analog converter PCM63P】: Abstract: PCM63P is a precision 20-bit digital-to-analog converter produced by BB Corporation of the United States with ultra-low distortion performance (maximum full-scale output is -93dB). It can be...; dfjso9 Analog electronics

Detailed explanation of CMD file configuration of TMS320F2812: TI's new assembler and linker create object files in a COFF (common object file format) format that is more conducive to modular programming and provides a powerful and flexible programming method for...; Jacktang Microcontroller MCU

Send a wince QQ exchange group: wince/ARM hardware driver/application QQ exchange group 39063007 --- It is too slow to learn by reading blindly. The access to eeworld is very slow at night. This group is specially established. Pleas...; wangshaolei8701 Embedded System

Questions about the underlying driver?: Our boss asked me to work with him on the underlying driver of xc2365. I don't even know what the underlying driver is specifically about. Which big brother can give me some advice and what books shou...; mbb Embedded System

Energy Star 5.0 emerges: Author: PowerAntCurrently, Energy Star 5.0 and Tier 2 of Energy Star 4.0 are being developed.The relevant discussion information can be found here:http://www.energystar.gov/index.cfm?c=revisions.compu...; ZYXWVU Power technology

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components