3592-351-525 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > The connector> The connector> 3592-351-525

3592-351-525: DescriptionCard Edge Connector, 168 Contact(s), 2 Row(s), Straight, 0.05 inch Pitch, Solder Terminal, Latch & Eject, Black Insulator, Receptacle; CategoryThe connector The connector; File Size271KB，1 Pages; ManufacturerTekcon Electronics Corp

Download Datasheet Parametric View All

3592-351-525 Overview

Card Edge Connector, 168 Contact(s), 2 Row(s), Straight, 0.05 inch Pitch, Solder Terminal, Latch & Eject, Black Insulator, Receptacle

3592-351-525 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Tekcon Electronics Corp
Reach Compliance Code	unknown
ECCN code	EAR99
Board mount options	SPLIT BOARD LOCK
body width	0.297 inch
subject depth	0.59 inch
body length	5.55 inch
Body/casing type	RECEPTACLE
Connector type	CARD EDGE CONNECTOR
Contact to complete cooperation	AU
Contact completed and terminated	Tin/Lead (Sn/Pb)
Contact material	COPPER ALLOY
Contact resistance	30 mΩ
Contact style	BELLOWED TYPE
Dielectric withstand voltage	1000VAC V
Durability	25 Cycles
Insulation resistance	10000000000 Ω
Insulator color	BLACK
insulator material	NYLON
JESD-609 code	e0
Manufacturer's serial number	3592
Plug contact pitch	0.05 inch
Installation option 1	LATCH & EJECT
Installation option 2	LOCKING
Installation method	STRAIGHT
Installation type	BOARD
Number of connectors	ONE
PCB row number	4
Number of rows loaded	2
Maximum operating temperature	105 °C
Minimum operating temperature	-55 °C
PCB contact pattern	STAGGERED
PCB contact row spacing	0.075 mm
Plating thickness	30u inch
polarization key	POLARIZED HOUSING
Rated current (signal)	1 A
Guideline	UL
reliability	COMMERCIAL
Terminal pitch	2.54 mm
Termination type	SOLDER
Total number of contacts	168

Preview

Download Datasheet

View All

http://www.tekcon.com

http://www.tekcon.com.tw

3592 Series

DIMM Socket

1.27 mm Pitch, Forming Type

Ordering Information

3592

X X X

XX X

Contact Plating

A - Gold Flash all area

0 - Gold Flash/Tin

1 - 10

µ"

Gold/Tin

2 - 20

µ"

Gold/Tin

3 - 30

µ"

Gold/Tin

4 - 3

µ"

Gold/Tin

5 - 15

µ"

Gold/Tin

8 - Tin

Voltage Key

3 - apply 3.3 V module

5 - apply 5 V module

Function Key (DRAM Key)

1-offset Left Key. (SDRAM)

2-offset Centered Key(DRAM)

3-offset Right Key (Unbuffered DRAM)

Housing Material

1 - LCP, Black

2 - LCP, Ivory

5 - Ny66, Black

6 - Ny66, Ivory

7 - PBT, Black

8 - PBT, Ivory

With Post Position

51- with A,B,C Metal Clip

52- with B,C,D Metal Clip

Specification

Materials:

Housing & Latch:

High Temperature Glass Fiber Reinforced

Thermoplastic, UL94V-0.

Contact:

Copper Alloy.

Plating:

Gold Flash on Contact Area and Tin/

Lead on Solder Tail.

Electrical:

Insulation Resistance:

10,000 MΩ Minimum.

Dielectric Withstanding Voltage:

1000 VAC R.M.S.

Voltage Rating:

500V.

Current Rating:

1 AMP.

Contact Resistance:

30 mΩ Maximum.

Capacitance:

1 PF (Max.) at 1Mhz between

randomly selected adjacent contacts.

Mechanical

Durability:

25 cycles Minimum.

Contact Engaging Force:

1.390N Maximum,

Pair Contact.

Contact Retention Force:

500 g Minimum,

per Contact.

Accept Standard JEDEC Modules:

0.05 +/- 0.004

Enviromental

Temperature: -558C to +1058C

Dimensions

TEKCON Electronics Corporation

11-1

Recommended Resources

Infrared remote control dimming circuit b

Remington refrigerator circuit

Aide CFXB series popular single-lamp thermal insulation automatic rice cooker circuit diagram

TTL logic level controlled dual tracking regulated power supply

The three-phase motor adopts a commutation circuit with automatic stop by proximity switch.

How to Design and Implement Embedded Navigation System: Digital geographic integrated applications and their corresponding solutions based on embedded systems as the main platform, that is, handheld and vehicle-mounted GPS global satellite navigation syste...; fish001 Microcontroller MCU

P89LPC932 Flash MCU User Guide: P89LPC932 Flash MCU User Guide...; 护花使者 MCU

RDA PULL succeeds for the first time, and the program automatically exits for the second time: Environment: VS2005+sqlce3.0+sql2000, Language: C# Steps: 1. Create *.sdf database, if it exists, delete it first and then create it 2. PULL ->rda.Dispose(); 3. Operate *.sdf 4. PUSH Loop the above st...; ceci Embedded System

Is it better for startups to choose driver chips or driver modules?: For the current large number of robot entrepreneurial teams, the three core components of the robot are: motor reducer drive. When it comes to the selection of motor drives, how should our startup com...; 工程师老罗 Robotics Development

【AT32F421 Review】+ Reading and Writing of W25Q16 Memory Module: The AT32F407 and other development boards are equipped with W25Q128 memory. Can the AT32F421 read and write the corresponding memory in an external way? The answer is yes. The read and write functions...; jinglixixi Domestic Chip Exchange

Help~win8.1 stop debugging error···: I installed IAR for msp430 v6.1 on Windows 8.1. There is no problem on desktop XP. After connecting to launchpad, burning programs and other things are also smooth. However, when the program is run at...; chijiemole Microcontroller MCU

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components