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3592-533-527

Description
Card Edge Connector, 168 Contact(s), 2 Row(s), Straight, 0.05 inch Pitch, Solder Terminal, Latch & Eject, Black Insulator, Receptacle
CategoryThe connector    The connector   
File Size271KB,1 Pages
ManufacturerTekcon Electronics Corp
Download Datasheet Parametric View All

3592-533-527 Overview

Card Edge Connector, 168 Contact(s), 2 Row(s), Straight, 0.05 inch Pitch, Solder Terminal, Latch & Eject, Black Insulator, Receptacle

3592-533-527 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTekcon Electronics Corp
Reach Compliance Codeunknown
ECCN codeEAR99
Board mount optionsSPLIT BOARD LOCK
body width0.297 inch
subject depth0.59 inch
body length5.55 inch
Body/casing typeRECEPTACLE
Connector typeCARD EDGE CONNECTOR
Contact to complete cooperationAU
Contact completed and terminatedTin/Lead (Sn/Pb)
Contact materialCOPPER ALLOY
Contact resistance30 mΩ
Contact styleBELLOWED TYPE
Dielectric withstand voltage1000VAC V
Durability25 Cycles
Insulation resistance10000000000 Ω
Insulator colorBLACK
insulator materialPOLYBUTYLENE TEREPHTHALATE
JESD-609 codee0
Manufacturer's serial number3592
Plug contact pitch0.05 inch
Installation option 1LATCH & EJECT
Installation option 2LOCKING
Installation methodSTRAIGHT
Installation typeBOARD
Number of connectorsONE
PCB row number4
Number of rows loaded2
Maximum operating temperature105 °C
Minimum operating temperature-55 °C
PCB contact patternSTAGGERED
PCB contact row spacing0.075 mm
Plating thickness15u inch
polarization keyPOLARIZED HOUSING
Rated current (signal)1 A
GuidelineUL
reliabilityCOMMERCIAL
Terminal pitch2.54 mm
Termination typeSOLDER
Total number of contacts168
b
http://www.tekcon.com
http://www.tekcon.com.tw
3592 Series
DIMM Socket
1.27 mm Pitch, Forming Type
Ordering Information
3592
-
X X X
-
XX X
Contact Plating
A - Gold Flash all area
0 - Gold Flash/Tin
1 - 10
µ"
Gold/Tin
2 - 20
µ"
Gold/Tin
3 - 30
µ"
Gold/Tin
4 - 3
µ"
Gold/Tin
5 - 15
µ"
Gold/Tin
8 - Tin
Voltage Key
3 - apply 3.3 V module
5 - apply 5 V module
Function Key (DRAM Key)
1-offset Left Key. (SDRAM)
2-offset Centered Key(DRAM)
3-offset Right Key (Unbuffered DRAM)
Housing Material
1 - LCP, Black
2 - LCP, Ivory
5 - Ny66, Black
6 - Ny66, Ivory
7 - PBT, Black
8 - PBT, Ivory
With Post Position
51- with A,B,C Metal Clip
52- with B,C,D Metal Clip
Specification
p
Materials:
s
Housing & Latch:
High Temperature Glass Fiber Reinforced
Thermoplastic, UL94V-0.
s
Contact:
Copper Alloy.
s
Plating:
Gold Flash on Contact Area and Tin/
Lead on Solder Tail.
p
Electrical:
s
Insulation Resistance:
10,000 MΩ Minimum.
s
Dielectric Withstanding Voltage:
1000 VAC R.M.S.
s
Voltage Rating:
500V.
s
Current Rating:
1 AMP.
s
Contact Resistance:
30 mΩ Maximum.
s
Capacitance:
1 PF (Max.) at 1Mhz between
randomly selected adjacent contacts.
p
Mechanical
s
Durability:
25 cycles Minimum.
s
Contact Engaging Force:
1.390N Maximum,
Pair Contact.
s
Contact Retention Force:
500 g Minimum,
per Contact.
s
Accept Standard JEDEC Modules:
0.05” +/- 0.004”
p
Enviromental
s
Temperature: -558C to +1058C
Dimensions
TEKCON Electronics Corporation
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