Security & Chip Card ICs
my-d products for contactless systems
my-d vicinity
SRF 55V10P
Intelligent 10–KBit EEPROM
with Contactless Interface complying to ISO/IEC 15693
and Security Logic
Plain Mode Operation
Short Product Information
July 2002
SRF 55V10P Short Product Information
Revision History:
Previous Releases:
Page
Current Version 2002-07-30
2001-08-15
Ref.: SPI_SRF55V10P_0702.doc
Subjects (changes since last revision)
Editorial changes
Important:
Further information is confidential and on request. Please contact:
Infineon Technologies AG in Munich, Germany,
Security & Chip Card ICs,
Tel +49 (0)89 / 234-80000
Fax +49 (0)89 / 234-81000
E-Mail: security.chipcard.ics@infineon.com
Published by Infineon Technologies AG, CC Applications Group
St.-Martin-Strasse 53, D-81541 München
© Infineon Technologies AG 2002
All Rights Reserved.
To our valued customers
We constantly strive to improve the quality of all our products and documentation. We have spent an exceptional
amount of time to ensure that this document is correct. However, we realise that we may have missed a few things. If
you find any information that is missing or appears in error, please use the contact section above to inform us. We
appreciate your assistance in making this a better document.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon
Technologies Office in Germany or our Infineon Technologies Representatives world-wide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of
that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices
or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect
human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
my-d vicinity
SRF 55V10P
Intelligent 10–KBit EEPROM
with Contactless Interface complying to ISO/IEC 15693
and Security Logic
my-d vicinity – Plain Mode Operation
Features
•
10-KBit EEPROM
—
—
—
—
—
—
Organised in 128 pages located in 1 sector
Each page organised in 8 bytes for data storage + 2 bytes for administrative purposes
Configurable number of sectors (1 to 15) & sector size (1 up to 128 pages)
Service Area 4 pages
User Area 124 pages
Unique chip identification number
Easy Integration in existing infrastructure
On/Off EAS switch feature
Each page in User Area configurable as a Counter
Support of Anti-Tearing
Carrier frequency: 13.56 MHz
up to 26 kbit/s data rate transfer
Anticollision method complying with ISO/IEC 15693 with identification of up to 30 tags/sec
Contactless transmission of data and supply energy
Coupling distance from 0 to 120 cm (typical, dependent on antenna)
•
•
•
Smart Electronic Article Surveillance (EAS)
—
—
Value Counters: up to 65536 units
(with a value range from 0 to 2
16
-1)
—
—
Physical Interface and Anticollision complying to ISO/IEC 15693
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•
•
•
•
•
EEPROM updating (erase and program) time maximum 4 ms per page
EEPROM endurance minimum 10
5
write/erase cycles
1
)
Data retention for minimum of 10 years
1
)
ESD
protection typical 4
kV
Ambient temperature –25
…
+85°C for chip and MCC, –25
…
+70°C for Inlay
1)
Values are temperature dependent
Short Product Information
3/9
2002-07-30
my-d vicinity
SRF 55V10P
Document References
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Confidential Data Sheet
Qualification report chip
Chip delivery specification for wafer with chip-layout (die size, orientation, …)
Module specification containing description of package, product logistic etc.
Qualification report module
Inlay specification containing description of package, product logistic etc.
Qualification report inlay
Development Tool Overview
―
my-d vicinity evaluation and demonstration kit
1
Table 1
Type
Ordering and Packaging information
Ordering Information
Package
1)
Die
Inlay 45 x 45 mm
2
Inlay 45 x 76 mm
2
1024 bytes
256 bytes
128
Memory
User
Admin.
Pages
Ordering Code
Q67100H4851
on request
Q67100H4868
Q67100H4869
SRF 55V10P C
SRF 55V10P Y1.0
SRF 55V10P Y2.0
SRF 55V10P MCC8 P-MCC8-2-1
1)
Available as a die (C) for customer packaging, as inlay (Y) or as a Module Contactless Card (MCC) for embedding in
plastic cards
Short Product Information
4/9
2002-07-30
my-d vicinity
SRF 55V10P
Pin Description
Figure 1 Pin Configuration Label Inlay (top view)
Figure 2
Pin Configuration Module Contactless Card (top view)
L
A
m y-d vicinity
SRF 55V10P
L
B
Figure 3
Table 2
Symbol
L
A
L
B
Pad Configuration Die
Pin Definitions and Functions
Function
Antenna connection
Antenna connection
Short Product Information
5/9
2002-07-30
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