Security & Chip Card ICs
my-d products for contactless systems
my-d vicinity
SRF 55V02S
Intelligent 2–KBit EEPROM
with Contactless Interface complying to ISO/IEC 15693
and Security Logic
Secure Mode Operation
Short Product Information
July 2002
SRF 55V02S Short Product Information
Revision History:
Previous Releases:
Page
Current Version 2002-07-30
2001-08-15
Ref.: SPI_SRF55V02S_0702.doc
Subjects (changes since last revision)
Editorial changes
Important:
Further information is confidential and on request. Please contact:
Infineon Technologies AG in Munich, Germany,
Security & Chip Card ICs,
Tel +49 (0)89 / 234-80000
Fax +49 (0)89 / 234-81000
E-Mail: security.chipcard.ics@infineon.com
Published by Infineon Technologies AG, CC Applications Group
St.-Martin-Strasse 53, D-81541 München
© Infineon Technologies AG 2002
All Rights Reserved.
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you find any information that is missing or appears in error, please use the contact section above to inform us. We
appreciate your assistance in making this a better document.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
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Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon
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Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
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human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
my-d vicinity
SRF 55V02S
Intelligent 2–KBit EEPROM
with Contactless Interface complying to ISO/IEC 15693
and Security Logic
my-d vicinity – Secure Mode Operation
Features
•
2-KBit EEPROM
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Organised in 32 pages located in up to 16 sectors
Each page organised in 8 bytes for data storage + 2 bytes for administrative purposes
Configurable number of sectors (1 to 15) & sector size (1 up to 128 pages)
Service Area 4 pages
Configurable Key Area with up to 14 key pairs
Configurable User Area
Unique chip identification number
Easy Integration in existing infrastructure
On/Off EAS switch feature
Each page in User Area configurable as a Counter
Support of Anti-Tearing
2-way (mutual) authentication with 64-bit secret key between reader and label
2 keys for each sector allow hierarchical key management
Multi-level security structure possible
Individual access rights for each key within a sector for each page
Only one sector can be opened at a time
Data integrity supported by 16 bit CRC (ISO 3309) and 32 bit MAC (after authentication)
•
•
•
Smart Electronic Article Surveillance (EAS)
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Value Counters: up to 65536 units
(with a value range from 0 to 2
16
-1)
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High Security Authentication Unit (optional use)
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•
•
Access protection of EEPROM by transport keys on chip delivery (optional use)
Physical Interface and Anticollision complying to ISO/IEC 15693
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Carrier frequency: 13.56 MHz
up to 26 kbit/s data rate transfer
Anticollision method complying with ISO/IEC 15693 with identification of up to 30 tags/sec
Contactless transmission of data and supply energy
Coupling distance from 0 to 120 cm (typical, dependent on antenna)
•
•
•
•
•
EEPROM updating (erase and program) time maximum 4 ms per page
EEPROM endurance minimum 10
5
write/erase cycles
1
)
Data retention for minimum of 10 years
1
)
ESD
protection typical 4
kV
Ambient temperature –25
…
+85°C for chip and MCC, –25
…
+70°C for Inlay
1)
Values are temperature dependent
Short Product Information
3 / 10
2002-07-30
my-d vicinity
SRF 55V02S
Document References
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Confidential Data Sheet
Qualification report chip
Chip delivery specification for wafer with chip-layout (die size, orientation, …)
Module specification containing description of package, product logistic etc.
Qualification report module
Inlay specification containing description of package, product logistic etc.
Qualification report inlay
Development Tool Overview
―
my-d vicinity evaluation and demonstration kit
1
Table 1
Type
Ordering and Packaging information
Ordering Information
Package
1)
Die
Inlay 45 x 45 mm
2
Inlay 45 x 76 mm
2
256 bytes
64 bytes
32
Memory
User
Admin.
Pages
Ordering Code
Q67100H4895
on request
Q67100H4910
Q67100H4911
SRF 55V02S C
SRF 55V02S Y1.0
SRF 55V02S Y2.0
SRF 55V02S MCC8 P-MCC8-2-1
1)
Available as a die (C) for customer packaging, as inlay (Y) or as a Module Contactless Card (MCC) for embedding in
plastic cards
Short Product Information
4 / 10
2002-07-30
my-d vicinity
SRF 55V02S
Pin Description
Figure 1 Pin Configuration Label Inlay (top view)
Figure 2
Pin Configuration Module Contactless Card (top view)
L
A
m y-d vicinity
SRF 55V02S
L
B
Figure 3
Table 2
Symbol
L
A
L
B
Pad Configuration Die
Pin Definitions and Functions
Function
Antenna connection
Antenna connection
Short Product Information
5 / 10
2002-07-30
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