MX29LV160DTGBI-70G datasheet, PDF

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MX29LV160DTGBI-70G: Description1M X 16 FLASH 3V PROM, 70 ns, PDSO48; Categorystorage storage; File Size2MB，66 Pages; ManufacturerMacronix; Websitehttp://www.macronix.com/en-us/Pages/default.aspx; Environmental Compliance

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MX29LV160DTGBI-70G Overview

1M X 16 FLASH 3V PROM, 70 ns, PDSO48

MX29LV160DTGBI-70G Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Macronix
Parts packaging code	BGA
package instruction	VFLGA, LGA48,6X11,20
Contacts	48
Reach Compliance Code	unknow
ECCN code	EAR99
Maximum access time	70 ns
Other features	TOP BOOT BLOCK
Spare memory width	8
startup block	TOP
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PBGA-B48
length	6 mm
memory density	16777216 bi
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of departments/size	1,2,1,31
Number of terminals	48
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX16
Package body material	PLASTIC/EPOXY
encapsulated code	VFLGA
Encapsulate equivalent code	LGA48,6X11,20
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3/3.3 V
Programming voltage	3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	0.5 mm
Department size	16K,8K,32K,64K
Maximum standby current	0.000015 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BUTT
Terminal pitch	0.5 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
switch bit	YES
type	NOR TYPE
width	4 mm

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MX29LV160D T/B

DATASHEET

P/N:PM1315

REV. 1.2, DEC. 22, 2011

MX29LV160D T/B

Contents

FEATURES ............................................................................................................................................................. 5

GENERAL DESCRIPTION ..................................................................................................................................... 6

PIN CONFIGURATIONS ......................................................................................................................................... 7

PIN DESCRIPTION ................................................................................................................................................. 9

BLOCK DIAGRAM................................................................................................................................................ 10

BLOCK DIAGRAM DESCRIPTION ...................................................................................................................... 11

BLOCK STRUCTURE........................................................................................................................................... 12

Table 1-1. MX29LV160DT SECTOR ARCHITECTURE .............................................................................. 12

Table 1-2. MX29LV160DB SECTOR ARCHITECTURE ............................................................................. 13

BUS OPERATION ................................................................................................................................................. 14

Table 2-1. BUS OPERATION ...................................................................................................................... 14

Table 2-2. BUS OPERATION ...................................................................................................................... 15

FUNCTIONAL OPERATION DESCRIPTION ....................................................................................................... 16

WRITE COMMANDS/COMMAND SEQUENCES ....................................................................................... 16

REQUIREMENTS FOR READING ARRAY DATA....................................................................................... 16

RESET# OPERATION ................................................................................................................................ 17

SECTOR PROTECT OPERATION ............................................................................................................. 17

CHIP UNPROTECT OPERATION.............................................................................................................. 17

HARDWARE WRITE PROTECT ................................................................................................................. 17

ACCELERATED PROGRAMMING OPERATION ...................................................................................... 17

TEMPORARY SECTOR UNPROTECT OPERATION ................................................................................ 18

AUTOMATIC SELECT OPERATION........................................................................................................... 18

VERIFY SECTOR PROTECT STATUS OPERATION ................................................................................. 18

DATA PROTECTION ................................................................................................................................... 18

LOW VCC WRITE INHIBIT ......................................................................................................................... 18

WRITE PULSE "GLITCH" PROTECTION................................................................................................... 18

LOGICAL INHIBIT ....................................................................................................................................... 19

POWER-UP SEQUENCE ........................................................................................................................... 19

POWER-UP WRITE INHIBIT ...................................................................................................................... 19

POWER SUPPLY DECOUPLING ............................................................................................................... 19

COMMAND OPERATIONS ................................................................................................................................... 20

TABLE 3. MX29LV160D T/B COMMAND DEFINITIONS ............................................................................ 20

AUTOMATIC PROGRAMMING OF THE MEMORY ARRAY ...................................................................... 21

ERASING THE MEMORY ARRAY .............................................................................................................. 21

SECTOR ERASE ........................................................................................................................................ 22

CHIP ERASE.............................................................................................................................................. 23

SECTOR ERASE SUSPEND ...................................................................................................................... 23

SECTOR ERASE RESUME ........................................................................................................................ 24

AUTOMATIC SELECT OPERATIONS ........................................................................................................ 24

AUTOMATIC SELECT COMMAND SEQUENCE ....................................................................................... 24

P/N:PM1315

REV. 1.2, DEC. 22, 2011

MX29LV160D T/B

READ MANUFACTURER ID OR DEVICE ID ............................................................................................. 25

VERIFY SECTOR GROUP PROTECTION ................................................................................................. 25

RESET ....................................................................................................................................................... 25

COMMON FLASH MEMORY INTERFACE (CFI) MODE ..................................................................................... 26

QUERY COMMAND AND COMMON FLASH INTERFACE (CFI) MODE ................................................... 26

Table 4-1. CFI mode: Identification Data Values

......................................................................................... 26

Table 4-2. CFI Mode: System Interface Data Values

.................................................................................. 26

Table 4-3. CFI Mode: Device Geometry Data Values

.................................................................................. 27

Table 4-4. CFI Mode: Primary Vendor-Specific Extended Query Data Values

............................................ 28

ELECTRICAL CHARACTERISTICS .................................................................................................................... 29

ABSOLUTE MAXIMUM STRESS RATINGS............................................................................................... 29

OPERATING TEMPERATURE AND VOLTAGE .......................................................................................... 29

DC CHARACTERISTICS ............................................................................................................................ 30

SWITCHING TEST CIRCUIT ...................................................................................................................... 31

SWITCHING TEST WAVEFORM ............................................................................................................... 31

AC CHARACTERISTICS ............................................................................................................................ 32

WRITE COMMAND OPERATION......................................................................................................................... 33

Figure 1. COMMAND WRITE OPERATION

................................................................................................ 33

READ/RESET OPERATION ................................................................................................................................. 34

Figure 2. READ TIMING WAVEFORM

........................................................................................................ 34

Figure 3. RESET# TIMING WAVEFORM

................................................................................................... 35

ERASE/PROGRAM OPERATION ........................................................................................................................ 36

Figure 4. AUTOMATIC CHIP ERASE TIMING WAVEFORM

...................................................................... 36

Figure 5. AUTOMATIC CHIP ERASE ALGORITHM FLOWCHART

............................................................ 37

Figure 6. AUTOMATIC SECTOR ERASE TIMING WAVEFORM

................................................................ 38

Figure 7. AUTOMATIC SECTOR ERASE ALGORITHM FLOWCHART

.................................................... 39

Figure 8. ERASE SUSPEND/RESUME FLOWCHART

.............................................................................. 40

Figure 9. AUTOMATIC PROGRAM TIMING WAVEFORM

.......................................................................... 41

Figure 10. ACCELERATED PROGRAM TIMING DIAGRAM

..................................................................... 41

Figure 11. CE# CONTROLLED WRITE TIMING WAVEFORM

................................................................... 42

Figure 12. AUTOMATIC PROGRAMMING ALGORITHM FLOWCHART

.................................................... 43

SECTOR PROTECT/CHIP UNPROTECT ............................................................................................................ 44

Figure 13. SECTOR PROTECT/CHIP UNPROTECT WAVEFORM (RESET# Control)

............................. 44

Figure 14. IN-SYSTEM SECTOR PROTECT WITH RESET#=Vhv

............................................................ 45

Figure 15. CHIP UNPROTECT ALGORITHMS WITH RESET#=Vhv

......................................................... 46

Table 5. TEMPORARY SECTOR UNPROTECT ......................................................................................... 47

Figure 16. TEMPORARY SECTOR UNPROTECT WAVEFORM

............................................................... 47

Figure 17. TEMPORARY SECTOR UNPROTECT FLOWCHART

.............................................................. 48

Figure 18. SILICON ID READ TIMING WAVEFORM

.................................................................................. 49

WRITE OPERATION STATUS .............................................................................................................................. 50

Figure 19. DATA# POLLING TIMING WAVEFORM (DURING AUTOMATIC ALGORITHM)

....................... 50

Figure 20. DATA# POLLING ALGORITHM

................................................................................................. 51

P/N:PM1315

REV. 1.2, DEC. 22, 2011

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