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MX29LV640DTXEI-90G

Description
64M-BIT [8M x 8/4M x 16] SINGLE VOLTAGE 3V
Categorystorage    storage   
File Size791KB,62 Pages
ManufacturerMacronix
Websitehttp://www.macronix.com/en-us/Pages/default.aspx
Environmental Compliance
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MX29LV640DTXEI-90G Overview

64M-BIT [8M x 8/4M x 16] SINGLE VOLTAGE 3V

MX29LV640DTXEI-90G Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMacronix
Parts packaging codeBGA
package instructionLFBGA, BGA48,6X8,32
Contacts48
Reach Compliance Codeunknow
ECCN code3A991.B.1.A
Maximum access time90 ns
Spare memory width8
startup blockTOP
command user interfaceYES
Universal Flash InterfaceYES
Data pollingYES
JESD-30 codeR-PBGA-B48
length8 mm
memory density67108864 bi
Memory IC TypeFLASH
memory width16
Number of functions1
Number of departments/size8,127
Number of terminals48
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize4MX16
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Encapsulate equivalent codeBGA48,6X8,32
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3/3.3 V
Programming voltage3 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1.3 mm
Department size8K,64K
Maximum standby current0.000015 A
Maximum slew rate0.03 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitYES
typeNOR TYPE
width6 mm
MX29LV640D T/B
64M-BIT [8M x 8/4M x 16] SINGLE VOLTAGE 3V
ONLY FLASH MEMORY
FEATURES
GENERAL FEATURES
• 8,388,608 x 8 / 4,194,304 x 16 switchable
• Sector Structure
- 8KB(4KW) x 8 and 64KB(32KW) x 127
• Extra 128-word sector for security
- Features factory locked and identifiable, and customer lockable
• Sector Groups Protection / Chip Unprotect
- Provides sector group protect function to prevent program or erase operation in the protected sector group
- Provides chip unprotect function to allow code changing
- Provides temporary sector group unprotect function for code changing in previously protected sector groups
• Single Power Supply Operation
- 2.7 to 3.6 volt for read, erase, and program operations
• Latch-up protected to 100mA from -1V to 1.5 x Vcc
• Low Vcc write inhibit : Vcc <= Vlko
• Compatible with JEDEC standard
- Pinout and software compatible to single power supply Flash
PERFORMANCE
• High Performance
- Fast access time: 90ns
- Fast program time: 11us/word (typical)
- Fast erase time: 0.7s/sector, 45s/chip (typical)
• Low Power Consumption
- Low active read current: 9mA (typical) at 5MHz
- Low standby current: 5uA (typical)
• 100,000 erase/program cycle (typical)
• 10 years data retention
SOFTWARE FEATURES
• Erase Suspend/ Erase Resume
- Suspends sector erase operation to read data from or program data to another sector which is not being erased
• Status Reply
- Data# Polling & Toggle bits provide detection of program and erase operation completion
• Support Common Flash Interface (CFI)
HARDWARE FEATURES
• Ready/Busy# (RY/BY#) Output
- Provides a hardware method of detecting program and erase operation completion
• Hardware Reset (RESET#) Input
- Provides a hardware method to reset the internal state machine to read mode
• WP#/ACC input pin
- Provides accelerated program capability
P/N:PM1208
REV. 1.6, AUG. 16, 2008
1

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Description 64M-BIT [8M x 8/4M x 16] SINGLE VOLTAGE 3V 64M-BIT [8M x 8/4M x 16] SINGLE VOLTAGE 3V 64M-BIT [8M x 8/4M x 16] SINGLE VOLTAGE 3V 64M-BIT [8M x 8/4M x 16] SINGLE VOLTAGE 3V 64M-BIT [8M x 8/4M x 16] SINGLE VOLTAGE 3V 64M-BIT [8M x 8/4M x 16] SINGLE VOLTAGE 3V 64M-BIT [8M x 8/4M x 16] SINGLE VOLTAGE 3V
Is it Rohs certified? conform to - conform to conform to conform to conform to conform to
Maker Macronix - Macronix Macronix Macronix Macronix -
Parts packaging code BGA - TSOP1 BGA BGA TSOP1 BGA
package instruction LFBGA, BGA48,6X8,32 - TSOP1, TSSOP48,.8,20 LFBGA, BGA48,6X8,32 LFBGA, BGA48,6X8,32 TSOP1, TSSOP48,.8,20 6 X 8 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MO-219, CSP-48
Contacts 48 - 48 48 48 48 48
Reach Compliance Code unknow - unknow unknow unknow unknow unknow
ECCN code 3A991.B.1.A - 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A
Maximum access time 90 ns - 90 ns 90 ns 90 ns 90 ns 90 ns
Spare memory width 8 - 8 8 8 8 8
startup block TOP - BOTTOM BOTTOM BOTTOM TOP TOP
command user interface YES - YES YES YES YES YES
Universal Flash Interface YES - YES YES YES YES YES
Data polling YES - YES YES YES YES YES
JESD-30 code R-PBGA-B48 - R-PDSO-G48 R-PBGA-B48 R-PBGA-B48 R-PDSO-G48 R-PBGA-B48
length 8 mm - 18.4 mm 8 mm 8 mm 18.4 mm 8 mm
memory density 67108864 bi - 67108864 bi 67108864 bi 67108864 bi 67108864 bi 67108864 bi
Memory IC Type FLASH - FLASH FLASH FLASH FLASH FLASH
memory width 16 - 16 16 16 16 16
Number of functions 1 - 1 1 1 1 1
Number of departments/size 8,127 - 8,127 8,127 8,127 8,127 8,127
Number of terminals 48 - 48 48 48 48 48
word count 4194304 words - 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words
character code 4000000 - 4000000 4000000 4000000 4000000 4000000
Operating mode ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C - 85 °C 70 °C 85 °C 85 °C 70 °C
Minimum operating temperature -40 °C - -40 °C - -40 °C -40 °C -
organize 4MX16 - 4MX16 4MX16 4MX16 4MX16 4MX16
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFBGA - TSOP1 LFBGA LFBGA TSOP1 LFBGA
Encapsulate equivalent code BGA48,6X8,32 - TSSOP48,.8,20 BGA48,6X8,32 BGA48,6X8,32 TSSOP48,.8,20 BGA48,6X8,32
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, LOW PROFILE, FINE PITCH - SMALL OUTLINE, THIN PROFILE GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL - PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 3/3.3 V - 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V
Programming voltage 3 V - 3 V 3 V 3 V 3 V 3 V
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
ready/busy YES - YES YES YES YES YES
Maximum seat height 1.3 mm - 1.2 mm 1.3 mm 1.3 mm 1.2 mm 1.3 mm
Department size 8K,64K - 8K,64K 8K,64K 8K,64K 8K,64K 8K,64K
Maximum standby current 0.000015 A - 0.000015 A 0.000015 A 0.000015 A 0.000015 A 0.000015 A
Maximum slew rate 0.03 mA - 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA
Maximum supply voltage (Vsup) 3.6 V - 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V - 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3 V - 3 V 3 V 3 V 3 V 3 V
surface mount YES - YES YES YES YES YES
technology CMOS - CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL - INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL
Terminal form BALL - GULL WING BALL BALL GULL WING BALL
Terminal pitch 0.8 mm - 0.5 mm 0.8 mm 0.8 mm 0.5 mm 0.8 mm
Terminal location BOTTOM - DUAL BOTTOM BOTTOM DUAL BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
switch bit YES - YES YES YES YES YES
type NOR TYPE - NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 6 mm - 12 mm 6 mm 6 mm 12 mm 6 mm

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