Spec. No. JENF243E-0002Q-01
Reference Only
P1 / 8
Chip EMIFIL ® LC Combined Type for Large Current
NFE31PT
□□□□
1E9
□
Reference Specification
1. Scope
This reference specification applies to Chip EMIFIL ® LC Combined Type for Large Current NFE31P Series.
2. Part Numbering
NF
E
Product ID Structure
31
PT
Dimension Features
(L
×
W)
220
Capacitance
R
1E
Characteristics Rated
Voltage
9
L
Electrode Packaging
Code
(L: Taping / B: Bulk)
3. Rating
Customer
Part Number
Murata
Part Number
NFE31PT220R1E9L
NFE31PT220R1E9B
NFE31PT470C1E9L
NFE31PT470C1E9B
NFE31PT101C1E9L
NFE31PT101C1E9B
NFE31PT221D1E9L
NFE31PT221D1E9B
NFE31PT471F1E9L
NFE31PT471F1E9B
NFE31PT152Z1E9L
NFE31PT152Z1E9B
NFE31PT222Z1E9L
NFE31PT222Z1E9B
Capacitance
22pF ± 30%
47pF ±
100pF ±
220pF ±
470pF ±
1500pF ±
５０
２０
Rated
Voltage
Withstanding
Voltage
Rated
Current
Insulation
Resistance
%
%
%
%
%
25 V
(DC)
62.5 V
(DC)
6A
(DC)
1000 MΩ
min.
８０
２０
５０
２０
５０
２０
５０
２０
2200pF ± 50%
•
Storage Temperature: - 55 °C to + 125 °C
•
Operating Temperature: - 40 °C to + 85 °C
4. Standard Testing Condition
<Unless otherwise specified>
Temperature: Ordinary Temp. 15 °C to 35 °C
Humidity: Ordinary Humidity 25 %(RH) to 85 %(RH)
5. Style and Dimensions
0.7±0.2 1.0±0.2
(1)
1 .6 ±0 .1 5
(2)
0.7±0.2
(3)
1 .6 ±0 .1 5
<In case of doubt>
Temperature: 20 °C ± 2 °C
Humidity: 60 %(RH) to 70 %(RH)
Atmospheric pressure: 86kPa to 106kPa
■
Equivalent Circuit
Input
(1)
GND
(2)
Output
(3)
1.6±0.15
3.2±0.35
(in mm)
∗
(1),(3):No Polarity
■
Unit Mass (Typical value)
0.034g
Note : Gap and bend between ceramic capacitor(∗1) and ferrite bead(∗2) may come out as illustrated below,
however, these are not affect the performance, mounting and reliability of the products.
0.3 max.
∗
1
∗
2
∗
1
0.1max.
∗
2
(in mm)
MURATA MFG. CO., LTD.
Spec. No. JENF243E-0002Q-01
Reference Only
P2 / 8
■
Insertion Loss Characteristics (I.L.) (Typ.)
6. Marking
No marking
7. Electrical Performance
No.
7.1
Item
Capacitance
Specification
Meet item 3.
Table 1
Capacitance
22 (pF)
47,100,220,470
1500 (pF)
2200 (pF)
7.2
7.3
Insulation
Resistance(I.R.)
Withstanding
Voltage
Voltage
1 to 5 V(rms)
1±0.2 V(rms)
0.1 V(rms) max.
Frequency
1MHz ± 10%
1kHz ± 10%
1kHz ± 10%
Test Method
Products shall not be damaged.
Voltage : 25 V(DC)
Time : 60±5 seconds
Test Voltage : 62.5 V(DC)
Testing Time : 1 to 5 seconds
Limit the charging current: 10mA max.
8. Mechanical Performance
No.
8.1
8.2
Item
Appearance and
Dimensions
Solderability
Meet item 5.
The electrodes shall be at least 75%
covered with new solder coating.
Specification
Test Method
Visual Inspection and measured with Slide
Calipers
Flux : Ethanol solution of rosin, 25(wt)%
Pre-heat : 150 ± 10 °C, 60 ~ 90 s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240 ± 3 °C
Immersion Time : 3 ± 1 s
Immersion and emersion rates : 25mm / s
Flux : Ethanol solution of rosin, 25(wt)%
Pre-heat : 150 ± 10 °C, 60 ~ 90 s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270 ± 5 °C
(for NFE31PT152Z1E9□ : 250±5°C)
Immersion Time : 10 ± 1 s
Immersion and emersion rates : 25mm / s
Then measured after exposure the room
condition for 4 to 48 hours.
8.3
Resistance to
soldering heat
Meet Table 2.
Table 2
Appearance
No damaged
22,47,100
within
220 (pF)
±15%
Cap. Change
470,1500
within
2200 (pF)
±30%
I.R.
meet item 3
Withstanding
No damaged
Voltage
MURATA MFG. CO., LTD.
Spec. No. JENF243E-0002Q-01
No.
8.4
Item
Bending
Strength
Meet Table 3.
Table 3
Reference Only
Specification
Test Method
It shall be soldered on the paper-phenol
substrate. (t=1.6mm)
Pressure jig
R340
P3 / 8
No damaged
22,47,100
within
220 (pF)
±15%
Cap. Change
470,1500
within
2200 (pF)
±30%
45
Appearance
F
Deflection
45
Product
(in mm)
Deflection : 3 mm
Keeping Time : 30 seconds
9. Environment Performance
(It shall be soldered on the substrate.)
No.
Item
Specification
9.1
Humidity
Meet Table 4.
Table 4
Appearance
No damaged
22,47,100
within
220 (pF)
±15%
470,1500
within
2200 (pF)
±30%
100 MΩ min.
No damaged
Test Method
Temperature : 40 ± 2 °C
Humidity : 90 to 95 %(RH)
Time : 500 h (+ 24h , - 0h)
Then measured after exposure in the room
condition for 4 to 48 hours.
Temperature : 85 ± 2 °C
Test Voltage :
22,47,100,220(pF) : Rated Voltage
×
200 %
470,1500,2200(pF) : Rated Voltage
×
150 %
Time : 1000 h (+ 48h , - 0h)
Then measured after exposure in the room
condition for 4 to 48 hours.
1 Cycle
1 step: -55 °C (+ 0°C , - 3°C) / 30 ± 3 min
2 step: Room Temperature / within 5 min
3 step: +125 °C (+ 3°C , - 0°C) / 30 ± 3 min
4 step: Room Temperature / within 5 min
Total of 10 cycles
Then measured after exposure in the room
condition for 4 to 48 hours.
9.2
Heat Life
Cap. Change
I.R.
Withstanding
Voltage
9.3
Temperature
Cycling
Meet Table 2.
10. Specification of Packaging
10.1. Appearance and Dimensions (8mm-wide plastic tape)
Sprocket Hole
φ
1.5±
0.1
0
Embossed Cavity
1.75±0.1
0.2±0.1
3.5±0.05
3.6±0.05
0.1
8.0±0.2
Dimension of the Cavity is
measured at the bottom side.
1.8±0.05
1.8±0.1
4.0±0.1
2.0±0.05
4.0±0.1
Direction of feed
1.85±0.1
(in mm)
MURATA MFG. CO., LTD.
Spec. No. JENF243E-0002Q-01
Reference Only
P4 / 8
10.2. Specification of Taping
(1) Packing quantity (standard quantity)
2000 pcs. / reel
(2) Packing Method
Products shall be packaged in the cavity of the plastic tape and sealed with cover tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
The cover tape have no spliced point.
(5)
Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
10.3. Pull Strength of Plastic Tape and Cover Tape
Plastic tape
5N min.
Cover tape
10N min.
10.4. Peeling off force of cover tape
0.2N to 0.7N (minimum value is typical)
∗
Speed of Peeling off : 300 mm / min
165 to 180 degree
F
Cover tape
Plastic tape
10.5. Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows.
Trailer
2.0±0.5
160 min.
Leader
Label
190 min.
Empty tape
φ
13.0±0.2
210 min.
Cover tape
1
φ
60±
0
9±
1
0
13±1.4
φ
180±
3
0
φ
21.0±0.8
Direction of feed
(in: mm)
10.6. Marking for reel
Customer part number , MURATA part number , Inspection number(∗1) , RoHS marking(∗2) , Quantity , etc
∗1)
« Expression of Inspection No. »
□□
OOOO
×××
(1)
(1)
Factory Code
(2)
Date
(2)
(3)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep.
→
1 to 9, Oct. to Dec.
→
O, N, D
Third, Fourth digit : Day
ROHS – Y (△)
(1) (2)
(3)
Serial No.
∗2)
« Expression of RoHS marking »
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
10.7. Marking for Outside package (corrugated paper box)
Customer name , Purchasing Order Number , Customer Part Number , MURATA part number ,
RoHS marking (∗2) , Quantity , etc
MURATA MFG. CO., LTD.
Spec. No. JENF243E-0002Q-01
10.8. Specification of Outer Case
Reference Only
P5 / 8
Label
H
D
W
Outer Case Dimensions
Standard Reel Quantity in Outer Case
(mm)
(Reel)
W
D
H
186
186
93
5
∗
Above Outer Case size is typical. It depends on a quantity of an order.
11. Standard Land Dimensions
The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground.
Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be
arranged according to figure to reinforce the ground-pattern.
(Standard land dimensions for reflow)
½Side
on which chips are mounted
Small diamenter thru hole
(
φ
0.4)
1.0
2.6
3.0
0.6
1.2
2.2
4.2
Resist
Copper foil pattern
No pattern
(in mm)
12.
! Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1)Aircraft equipment
(2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment
(5)Medical equipment (6)Transportation equipment(automobiles, trains, ships, etc.) (7)Traffic signal equipment
(8)Disaster prevention / crime prevention equipment (9)Data-processing equipment
(10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
13. Notice
Products can only be soldered with reflow.
If it were soldered with flow, cracks might be caused in the ceramic body.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
13.1. Flux and Solder
Flux
Solder
Use rosin-based flux, Do not use highly acidic flux (with chlorine content
exceeding 0.2(wt)%).
Do not use water-soluble flux.
Use Sn-3.0Ag-0.5Cu solder
13.2. Note for Assembling
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and products
surface is limited to 100 °C max. Also cooling into solvent after soldering should be in such a way that the
temperature difference is limited to 100°C max.
MURATA MFG. CO., LTD.
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