54122-107-53-1350RLF datasheet, PDF

54122-107-53-1350RLF: DescriptionBoard Connector, 106 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Kinked Leads Terminal, Locking, Black Insulator, Receptacle,; CategoryThe connector The connector; File Size107KB，1 Pages; ManufacturerAmphenol; Websitehttp://www.amphenol.com/; Environmental Compliance

Download Datasheet Parametric View All

54122-107-53-1350RLF Overview

Board Connector, 106 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Kinked Leads Terminal, Locking, Black Insulator, Receptacle,

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Objectid	305994178
Reach Compliance Code	compliant
Country Of Origin	France
ECCN code	EAR99
YTEOL	9.4
body width	0.19 inch
subject depth	0.531 inch
body length	5.3 inch
Body/casing type	RECEPTACLE
Connector type	BOARD CONNECTOR
Contact to complete cooperation	AU ON NI
Contact completed and terminated	Matte Tin (Sn) - with Nickel (Ni) barrier
Contact point gender	MALE
Contact material	PHOSPHOR BRONZE
contact mode	RECTANGULAR
Contact style	SQ PIN-SKT
Insulation resistance	5000000000 Ω
Insulator color	BLACK
insulator material	POLYETHYLENE
JESD-609 code	e3
Manufacturer's serial number	54122
Plug contact pitch	0.1 inch
Match contact row spacing	0.1 inch
Installation option 1	LOCKING
Installation method	STRAIGHT
Installation type	BOARD
Number of connectors	ONE
PCB row number	2
Number of rows loaded	2
Maximum operating temperature	125 °C
Minimum operating temperature	-65 °C
PCB contact pattern	RECTANGULAR
PCB contact row spacing	2.54 mm
Plating thickness	30u inch
Rated current (signal)	3 A
Guideline	UL, CSA
reliability	COMMERCIAL
Terminal length	0.12 inch
Terminal pitch	2.54 mm
Termination type	SOLDER KINKED LEADS
Total number of contacts	106

PDM: Rev:K

STATUS:

Released

Printed: Mar 10, 2011

LPC54102 running ADC routine: [i=s]This post was last edited by littleshrimp on 2015-4-7 09:17[/i]...; littleshrimp NXP MCU

EEWORLD University - LabVIEW 2010 from entry to mastery: LABVIEW2010 from entry to mastery : https://training.eeworld.com.cn/course/4341"LabVIEW 2010 Chinese Edition Virtual Instruments from Beginner to Master" explains the application technology and applic...; 老白菜 Embedded System

Where is the best place to place the ESD on the PCB?: Where is the best place to place the ESD on the PCB?...; luck_gfb Analogue and Mixed Signal

TO USB driver development routine problem: I use Cy7c68013A for development. Other routines have been completed, and the control transmission and data search have been completed. Only DriverObject->MajorFunction[IRP_MJ_WRITE] = Ezusb_Write; //...; daviu1234 Embedded System

EEWORLD University ---- MSP432?: The perfect combination of low-power DNA and ARM_2016 TI Embedded Products Seminar Record: MSP432?: The perfect combination of low-power DNA and ARM_2016 TI Embedded Products Seminar Record : https://training.eeworld.com.cn/course/3738This course is a record of the 2016 TI Embedded Products...; soso MCU

Telecommunications Technology Glossary: EDGE Technology Explained: EDGE is the abbreviation of Enhanced Data Rate for GSM Evolution. EDGE is a transitional technology from GSM to 3G. It mainly adopts a new modulation method in the GSM system, namely the most advanced...; maker RF/Wirelessly

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components