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5962-9461108HMC

Description
Cache SRAM Module, 512KX32, 25ns, CMOS, CQFP68, CO-FIRED CERAMIC,QFP-68
Categorystorage    storage   
File Size3MB,939 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

5962-9461108HMC Overview

Cache SRAM Module, 512KX32, 25ns, CMOS, CQFP68, CO-FIRED CERAMIC,QFP-68

5962-9461108HMC Parametric

Parameter NameAttribute value
MakerMicrosemi
Parts packaging codeQFP
package instructionQFP,
Contacts68
Reach Compliance Codecompliant
ECCN code3A001.A.2.C
Maximum access time25 ns
JESD-30 codeS-CQFP-G68
JESD-609 codee4
length22.352 mm
memory density16777216 bit
Memory IC TypeCACHE SRAM MODULE
memory width32
Number of functions1
Number of terminals68
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceGOLD
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
width22.352 mm
Base Number Matches1
NOT MEASUREMENT
SENSITIVE
MIL-HDBK-103AP
6 MARCH 2014
SUPERSEDING
MIL-HDBK-103AN
12 SEPTEMBER 2013
DEPARTMENT OF DEFENSE
HANDBOOK
LIST OF STANDARD MICROCIRCUIT DRAWINGS
This handbook is for guidance only. Do not cite this document
as a requirement.
AMSC N/A
FSC 5962

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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