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5962-9461113H9C

Description
SRAM Module, 512KX32, 35ns, CMOS, CQFP68, CERAMIC, QFP-68
Categorystorage    storage   
File Size3MB,939 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

5962-9461113H9C Overview

SRAM Module, 512KX32, 35ns, CMOS, CQFP68, CERAMIC, QFP-68

5962-9461113H9C Parametric

Parameter NameAttribute value
MakerMicrosemi
package instructionCERAMIC, QFP-68
Reach Compliance Codeunknown
Maximum access time35 ns
I/O typeCOMMON
JESD-30 codeS-CQFP-G68
JESD-609 codee4
length23.88 mm
memory density16777216 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals68
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512KX32
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Encapsulate equivalent codeQFP68,.99SQ,50
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Filter levelMIL-PRF-38534 Class H
Maximum seat height3.56 mm
Minimum standby current2 V
Maximum slew rate0.65 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceGOLD
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
width23.88 mm
NOT MEASUREMENT
SENSITIVE
MIL-HDBK-103AP
6 MARCH 2014
SUPERSEDING
MIL-HDBK-103AN
12 SEPTEMBER 2013
DEPARTMENT OF DEFENSE
HANDBOOK
LIST OF STANDARD MICROCIRCUIT DRAWINGS
This handbook is for guidance only. Do not cite this document
as a requirement.
AMSC N/A
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