5962-9669106HTA datasheet, PDF

Datasheet> All Categories > storage> storage> 5962-9669106HTA

5962-9669106HTA: DescriptionStandard SRAM, 128KX8, 45ns, CMOS, SOJ-32; Categorystorage storage; File Size3MB，939 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

Download Datasheet Parametric View All

5962-9669106HTA Overview

Standard SRAM, 128KX8, 45ns, CMOS, SOJ-32

5962-9669106HTA Parametric

Parameter Name	Attribute value
Maker	Microsemi
package instruction	SOJ-32
Reach Compliance Code	unknown
Maximum access time	45 ns
I/O type	COMMON
JESD-30 code	R-XDSO-J32
JESD-609 code	e0
length	20.985 mm
memory density	1048576 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	128KX8
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	SOJ
Encapsulate equivalent code	SOJ32,.44
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	4.19 mm
Maximum standby current	0.0029 A
Minimum standby current	2 V
Maximum slew rate	0.15 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	DUAL
width	10.67 mm

Preview

Download Datasheet

View All

NOT MEASUREMENT

SENSITIVE

MIL-HDBK-103AP

6 MARCH 2014

SUPERSEDING

MIL-HDBK-103AN

12 SEPTEMBER 2013

DEPARTMENT OF DEFENSE

HANDBOOK

LIST OF STANDARD MICROCIRCUIT DRAWINGS

This handbook is for guidance only. Do not cite this document

as a requirement.

AMSC N/A

FSC 5962

MIL-HDBK-103AP

CONTENTS

PARAGRAPH

1.1

1.2

1.2.1

1.2.2

1.2.3

1.2.4

4.1

4.2

4.3

4.4

4.5

4.6

5.1

5.2

6.1

6.1.1

6.1.2

6.2

7.1

7.2

TABLE 1

SECTION 1

Part I

Part II

Part III

PAGE

SCOPE .......................................................................................................................................... 1

Purpose...................................................................................................................................... 1

Part or identifying number (PIN) ................................................................................................ 1

Drawing number......................................................................................................................... 1

Device class designator ............................................................................................................. 1

Case outline / lead finish ............................................................................................................ 2

Substitutability ............................................................................................................................ 2

APPLICABLE DOCUMENTS ......................................................................................................... 2

DEFINITIONS ................................................................................................................................ 2

REQUIREMENTS .......................................................................................................................... 2

Drawing requirements ................................................................................................................ 2

Preparation procedures ............................................................................................................. 2

Drawing effectivity and duration ................................................................................................. 2

Approved sources of supply....................................................................................................... 2

Radiation hardness assurance (RHA) levels ............................................................................. 2

Electrostatic discharge sensitivity (ESD) listing ......................................................................... 3

CONFIGURATION MANAGEMENT .............................................................................................. 3

Configuration management of SMDs ......................................................................................... 3

Record of users.......................................................................................................................... 3

DISTRIBUTION and REQUESTS .................................................................................................. 4

Distribution ................................................................................................................................. 4

Automatic distribution ................................................................................................................ 4

Electronic distribution ................................................................................................................. 4

Requests .................................................................................................................................... 4

NOTES .......................................................................................................................................... 4

Intended use .............................................................................................................................. 4

Subject item (key word) listing ................................................................................................... 4

Noun code descriptions ................................................................................................................. 5

Microcircuits................................................................................................................................... 12

Listed by SMD PIN .....................................................................................................................

Listed by generic PIN .................................................................................................................

714

Listed approved sources ............................................................................................................

932

Concluding material ...................................................................................................................

936

iii

MIL-HDBK-103AP

1.2.3 Case outline/lead finish. Case outline and lead finish are as described in each SMD. The lead finish indicated in the

section 1 Part I listing is the most readily available from the manufacturer listed for the part. The manufacturer is authorized to

supply other lead finishes than what is listed provided that further testing/qualification is performed by the manufacturer on the

other lead finish(es). The user needs to contact the manufacturer to determine the availability of other lead finishes not listed

herein.

1.2.4 Substitutability. Device-class-Q devices will replace device-class-M devices.

2. APPLICABLE DOCUMENTS This section is not applicable to the handbook.

3. DEFINITIONS This section is not applicable to the handbook.

4. REQUIREMENTS

4.1 Drawing requirements. SMD's will be prepared in accordance with ASME Y14.100 and DOD directives.

4.2 Preparation procedures. The procedures for the generation of an SMD are provided in MIL-HDBK-780.

4.3 Drawing effectivity and duration. SMD's and device class M one part - one part number SMDs which have become

inactive for new design are reflected in section 1, part 1 of the appendix of this document with an "I" in the status column.

4.4 Approved sources of supply. The approved sources of supply list in this handbook supersedes the approved sources

formerly listed in each individual SMD/DLA Land and Maritime Drawing. This handbook is the official list of approved sources

of supply for non-one part - one part number SMD PIN's and for device class M one part - one part number SMD PIN's. Device

classes B, S, Q, V, T, N (monolithic) and H, K, D, G, E (hybrid) one part - one part number SMD PIN's are listed for the

convenience of the users. Official listing for B, S, Q, V, T, N, H, K, D, G, and E levels are available in the applicable QML.

Manufacturers should notify DLA Land and Maritime-VA in writing if they no longer wish to be listed as an approved source of

supply for any device listed herein. This letter will be used by DSCC to remove the manufacturer from MIL-HDBK-103 for

those devices that the manufacturer specifies that he will no longer supply.

4.5 Radiation hardness assurance (RHA) levels. SMD devices which meet the RHA requirements of MIL-PRF-38535 or

MIL-PRF-38534 will be marked with the appropriate RHA designator M, D, P, L, R, F, G, or H replacing the dash (-) in the PIN

as indicated in the following example:

5962(M, D, P, L, R, F, G, or H)8999901EA

Only the highest RHA level for which the device is qualified will be listed in Section 1, Part I of the appendix of this document;

however, at the request of the customer, the manufacturer is authorized to supply any lower RHA level device. At the request

of the customer, the non-RHA PIN designated with a dash (-) may be supplied at the option of the manufacturer. The

manufacturer may also opt to submit a certificate of compliance to have the non-RHA PIN listed in addition to the RHA PIN in

Section 1, Part I of the appendix of this document.

Recommended Resources

Apply LOGO! Electric gate control circuit a

Electric hoist remote control electrical wiring

Long delay circuit diagram 1

Circuit using large capacitor C to replace backup battery

bidirectional monostable circuit

820e computer motherboard circuit diagram_67

I have a question: I am a DSP novice, and I have a question for everyone. How can I load my own program into the main program so that it can be called by the main program? Please explain the process in detail, thank you...; zhangxp DSP and ARM Processors

Oscilloscope development, don’t know where to start?: I want to make an oscilloscope that can store about 500 waveforms, and use an LCD to display them. The time sampling unit is in microseconds. What chip should I use? No one in my company makes the boa...; a8719978 Embedded System

Power supply question analysis: [i=s]This post was last edited by paulhyde on 2014-9-15 09:19[/i]...; liu5013 Electronics Design Contest

About the problem of direct operation of NandFlash by application program: Due to project requirements, it is necessary to provide the application with an interface for directly operating NandFlash. I found some articles on direct Flash operation on the Internet and tried it...; lemonnofeeling Embedded System

Complete 4 mA to 20 mA HART solution with additional voltage output capability: Circuit Note: Complete 4 mA to 20 mA HART Solution with Additional Voltage Output Capability...; 雨中 ADI Reference Circuit

DMA misalignment problem: Does anyone have any good solution?When using DMA to transfer PWM input, it is always misaligned.I don't need to talk about timer and DMA reinitialization....; qiyuan775 stm32/stm8

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components