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BFS19

Description
Surface mount Si-Epitaxial PlanarTransistors
CategoryDiscrete semiconductor    The transistor   
File Size118KB,2 Pages
ManufacturerDIOTEC
Websitehttp://www.diotec.com/
Environmental Compliance
Download Datasheet Parametric View All

BFS19 Overview

Surface mount Si-Epitaxial PlanarTransistors

BFS19 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerDIOTEC
package instruction,
Reach Compliance Codecompli
Is SamacsysN
Maximum collector current (IC)0.03 A
ConfigurationSingle
Minimum DC current gain (hFE)65
Humidity sensitivity level1
Maximum operating temperature135 °C
Polarity/channel typeNPN
Maximum power dissipation(Abs)0.2 W
surface mountYES
Base Number Matches1
BFS 19
NPN
High Frequency Transistors
Surface mount Si-Epitaxial PlanarTransistors
Si-Epitaxial PlanarTransistoren für die Oberflächenmontage
Power dissipation – Verlustleistung
2.9
±0.1
1.1
NPN
250 mW
SOT-23
(TO-236)
0.01 g
0.4
3
Plastic case
Kunststoffgehäuse
1.3
±0.1
Type
Code
1
2
2.5
max
Weight approx. – Gewicht ca.
Plastic material has UL classification 94V-0
Gehäusematerial UL94V-0 klassifiziert
Standard packaging taped and reeled
Standard Lieferform gegurtet auf Rolle
1.9
Dimensions / Maße in mm
1=B
2=E
3=C
Maximum ratings (T
A
= 25
/
C)
Collector-Emitter-voltage
Collector-Base-voltage
Emitter-Base-voltage
Power dissipation – Verlustleistung
Collector current – Kollektorstrom (dc)
Peak Collector current – Kollektor-Spitzenstrom
Junction temperature – Sperrschichttemperatur
Storage temperature – Lagerungstemperatur
B open
E open
C open
V
CE0
V
CB0
V
EB0
P
tot
I
C
I
CM
T
j
T
S
Grenzwerte (T
A
= 25
/
C)
BFS 19
20 V
30 V
5V
250 mW
1
)
30 mA
30 mA
150
/
C
- 65…+ 150
/
C
Characteristics (T
j
= 25
/
C)
Min.
Collector-Base cutoff current – Kollektorreststrom
I
E
= 0, V
CB
= 20 V
I
E
= 0, V
CB
= 20 V, T
j
= 100
/
C
Emitter-Base cutoff current – Emitterreststrom
I
C
= 0, V
EB
= 5 V
I
EB0
I
CB0
I
CB0
Kennwerte (T
j
= 25
/
C)
Typ.
Max.
100 nA
10
:
A
100 nA
1
) Mounted on P.C. board with 3 mm
2
copper pad at each terminal
Montage auf Leiterplatte mit 3 mm
2
Kupferbelag (Lötpad) an jedem Anschluß
01.11.2003
2

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