OPA2277TDD2 datasheet, PDF - EEWORLD Datasheet

OPA2277TDD2: DescriptionHigh Precision Operational Amplifier; CategoryAnalog mixed-signal IC Amplifier circuit; File Size103KB，5 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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High Precision Operational Amplifier

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
package instruction	DIE,
Reach Compliance Code	compli
ECCN code	EAR99
Factory Lead Time	6 weeks
Amplifier type	OPERATIONAL AMPLIFIER
Maximum average bias current (IIB)	0.001 µA
Minimum Common Mode Rejection Ratio	130 dB
Nominal Common Mode Rejection Ratio	140 dB
Maximum input offset voltage	25 µV
JESD-30 code	R-XUUC-N8
length	3.2766 mm
Number of functions	2
Number of terminals	8
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	RECTANGULAR
Package form	UNCASED CHIP
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Nominal slew rate	0.8 V/us
Maximum slew rate	1.65 mA
surface mount	YES
Terminal form	NO LEAD
Terminal location	UPPER
Maximum time at peak reflow temperature	NOT SPECIFIED
Nominal Uniform Gain Bandwidth	1000 kHz
width	2.1336 mm

	OPA2277TDD2	OPA2277TDD1
Description	High Precision Operational Amplifier	High Precision Operational Amplifier
Brand Name	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	Lead free
Is it Rohs certified?	conform to	conform to
Maker	Texas Instruments	Texas Instruments
package instruction	DIE,	DIE,
Reach Compliance Code	compli	compli
ECCN code	EAR99	EAR99
Factory Lead Time	6 weeks	6 weeks
Amplifier type	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER
Maximum average bias current (IIB)	0.001 µA	0.001 µA
Minimum Common Mode Rejection Ratio	130 dB	130 dB
Nominal Common Mode Rejection Ratio	140 dB	140 dB
Maximum input offset voltage	25 µV	25 µV
JESD-30 code	R-XUUC-N8	R-XUUC-N8
length	3.2766 mm	3.2766 mm
Number of functions	2	2
Number of terminals	8	8
Package body material	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIE	DIE
Package shape	RECTANGULAR	RECTANGULAR
Package form	UNCASED CHIP	UNCASED CHIP
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED
Nominal slew rate	0.8 V/us	0.8 V/us
Maximum slew rate	1.65 mA	1.65 mA
surface mount	YES	YES
Terminal form	NO LEAD	NO LEAD
Terminal location	UPPER	UPPER
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
Nominal Uniform Gain Bandwidth	1000 kHz	1000 kHz
width	2.1336 mm	2.1336 mm

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