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WS512K32-20G2TQA

Description
SRAM Module, 512KX32, 20ns, CMOS, CQMA68, CERAMIC, QFP-68
Categorystorage    storage   
File Size588KB,11 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

WS512K32-20G2TQA Overview

SRAM Module, 512KX32, 20ns, CMOS, CQMA68, CERAMIC, QFP-68

WS512K32-20G2TQA Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicrosemi
package instructionCERAMIC, QFP-68
Reach Compliance Codeunknown
Maximum access time20 ns
Other featuresUSER CONFIGURABLE AS 2M X 8
Spare memory width16
I/O typeCOMMON
JESD-30 codeS-CQMA-G68
JESD-609 codee0
memory density16777216 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals68
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512KX32
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Encapsulate equivalent codeQFP68,.99SQ,50
Package shapeSQUARE
Package formMICROELECTRONIC ASSEMBLY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum standby current0.028 A
Minimum standby current2 V
Maximum slew rate0.54 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
WS512K32-XXX
FEATURES
n
Packaging
512Kx32 SRAM MODULE, SMD 5962-94611
n
5 Volt Power Supply
n
Low Power CMOS
n
Built-in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation
n
Weight
WS512K32-XH1X - 13 grams typical
WS512K32-XG2TX
1
- 8 grams typical
WS512K32-XG1UX - 5 grams typical
WS512K32-XG1TX - 5 grams typical
WS512K32-XG4TX
1
- 20 grams typical
*15ns Access Time available only in Commercial and Industrial Temperature.
This speed is not fully characterized and is subject to change without notice.
Note 1: Package Not Recommended For New Design
n
Access Times of 15*, 17, 20, 25, 35, 45, 55ns
• 66 pin, PGA Type, 1.075" square, Hermetic Ceramic
HIP (Package 400).
• 68 lead, 40mm Hermetic Low Profile CQFP, 3.5mm
(0.140") (Package 502)
1
, Package to be developed.
• 68 lead, Hermetic CQFP (G2T) , 22.4mm (0.880") square
(Package 509) 4.57mm (0.180") height. Designed to fit
JEDEC 68 lead 0.990" CQFJ footprint (Fig. 3).
• 68 lead, Hermetic CQFP (G1U), 23.9mm (0.940") square
(Package 519) 3.57mm (0.140") height. Designed to fit
JEDEC 68 lead 0.990" CQFJ footprint (Fig. 3).
• 68 lead, Hermetic CQFP (G1T), 23.9mm (0.940") square
(Package 524) 4.06mm (0.160") height.
n
Organized as 512Kx32, User Configurable as 1Mx16 or
2Mx8
n
Commercial, Industrial and Military Temperature Ranges
n
TTL Compatible Inputs and Outputs
1
F
IG
. 1
P
IN
C
ONFIGURATION
F
OR
WS512K32N-XH1X
T
OP
V
IEW
P
IN
D
ESCRIPTION
I/O
0-31
A
0-18
WE
1-4
CS
1-4
OE
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
B
LOCK
D
IAGRAM
November 2001 Rev. 9
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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