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WS512K32L-45G2LCA

Description
SRAM Module, 512KX32, 45ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
Categorystorage    storage   
File Size577KB,11 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

WS512K32L-45G2LCA Overview

SRAM Module, 512KX32, 45ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68

WS512K32L-45G2LCA Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicrosemi
package instructionQFP-68
Reach Compliance Codeunknown
Maximum access time45 ns
Other featuresALSO CONFIGURABLE AS 2M X 8 AND LG-MAX,WD-MAX
Spare memory width16
JESD-30 codeS-CQFP-G68
length22.36 mm
memory density16777216 bit
Memory IC TypeSTANDARD SRAM
memory width32
Number of functions1
Number of terminals68
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
Maximum seat height5.1 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
width22.36 mm
Base Number Matches1
White Electronic Designs
512Kx32 SRAM MODULE, SMD 5962-94611
FEATURES
Access Times of 15, 17, 20, 25, 35, 45, 55ns
Packaging
66 pin, PGA Type, 1.075" square, Hermetic
Ceramic HIP (Package 400).
68 lead, 40mm Hermetic Low Profile CQFP,
3.5mm (0.140") (Package 502)
1
68 lead, Hermetic CQFP (G2U), 22.4mm
(0.880") square (Package 510) 3.56mm
(0.140") height.
68 lead, Hermetic CQFP (G2L), 22.4mm
(0.880") square, 5.08mm (0.200") high
(Package 528).
WS512K32-XXX
TTL Compatible Inputs and Outputs
5 Volt Power Supply
Low Power CMOS
Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
Weight
WS512K32N-XH1X - 13 grams typical
WS512K32-XG2UX - 8 grams typical
WS512K32-XG4TX
1
- 20 grams typical
WS512K32-XG2LX - 8 grams typical
* This product is subject to change without notice.
Note 1: Package Not Recommended For New Design
Organized as 512Kx32, User Configurable as
1Mx16 or 2Mx8
Commercial, Industrial and Military Temperature
Ranges
FIGURE 1 – PIN CONFIGURATION FOR WS512K32N-XH1X
Top View
1
I/O
8
I/O
9
I/O
10
A
13
A
14
A
15
A
16
A
17
I/O
0
I/O
1
I/O
2
11
22
12
WE
2
#
CS
2
#
GND
I/O
11
A
10
A
11
A
12
V
CC
CS
1
#
NC
I/O
3
33
23
I/O
15
I/O
14
I/O
13
I/O
12
OE#
A
18
WE
1
#
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
6
A
7
NC
A
8
A
9
I/O
16
I/O
17
I/O
18
44
34
V
CC
CS
4
#
WE
4
#
I/O
27
A
3
A
4
A
5
WE
3
#
CS
3
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
I/O
28
A
0
A
1
A
2
I/O
23
I/O
22
I/O
21
I/O
20
66
I/O
0 - 7
I/O
8 - 15
I/O
16 - 23
I/O
24 - 31
WE
1
# CS
1
#
OE#
A
0-18
Pin Description
56
I/O
0-31
A
0-18
WE
1-4
#
CS
1-4
#
OE#
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
Block Diagram
WE
2
# CS
2
#
WE
3
# CS
3
#
WE
4
# CS
4
#
512K X 8
512K X 8
512K X 8
512K X 8
8
8
8
8
May 2006
Rev. 17
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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