|
BGY32 |
BGY35 |
BGY36 |
BGY33 |
| Description |
VHF power amplifier modules |
VHF power amplifier modules |
VHF power amplifier modules |
VHF power amplifier modules |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
| Maker |
Philips Semiconductors (NXP Semiconductors N.V.) |
Philips Semiconductors (NXP Semiconductors N.V.) |
Philips Semiconductors (NXP Semiconductors N.V.) |
Philips Semiconductors (NXP Semiconductors N.V.) |
| Reach Compliance Code |
unknow |
unknow |
unknow |
unknow |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
| Installation features |
THROUGH HOLE MOUNT |
THROUGH HOLE MOUNT |
THROUGH HOLE MOUNT |
THROUGH HOLE MOUNT |
| Number of terminals |
19 |
19 |
19 |
19 |
| Maximum operating temperature |
90 °C |
90 °C |
90 °C |
90 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| Encapsulate equivalent code |
SIP19,.15TB |
SIP19,.15TB |
SIP19,.15TB |
SIP19,.15TB |
| power supply |
12.5 V |
12.5 V |
12.5 V |
12.5 V |
| surface mount |
NO |
NO |
NO |
NO |
| technology |
HYBRID |
HYBRID |
HYBRID |
HYBRID |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |