Ordering number : EN6024
SPI-235-19
GaAs Infrared LED
SPI-235-19
Ultraminiature photointerrupter
(single-transistor type)
Features
•
GaAs Infrared LED plus Single Phototransistor
•
Photo-Interrupter
•
Contact type
•
Compact type : H3.25
!
L5.0
!
W4.5mm
Absolute Maximum Ratings at Ta=25
°
C, 65%RH
Parameter
Forward Current
Reverse Voltage
Power Dissipation
Collector-Emitter Voltage
Emitter-Collector Voltage
Collector Curren
Power Dissipation
Operating Temperature
Storage Temperature
Soldering Temperature
*1
Symbol
I
F
V
R
P
D
V
CEO
V
ECO
I
C
P
C
Topr
Tstg
Tsol
Rating
50
5
70
20
5
20
70
- to +80
-20
- to +85
-30
260
Unit
mA
V
mW
V
V
mA
mW
°C
°C
°C
Input LED
Output
Phototransistor
*1
Soldering conditions : time : max. 3sec; clearance : min. 1mm from lower stay
Electro-Optical Characteristics at Ta=25
°
C, 65%RH
Parameter
Forward Voltage
Reverse Current
Dark Current
Collector Output Current
Collector Emitter
Saturation Voltage
Symbol
V
F
I
R
I
CEO
I
C
V
CE
(sat)
Condition
I
F
=10mA
V
R
=5V
I
F
=0mA, V
CE
=10V
I
F
=10mA,V
CE
=5V
*1
I
F
=10mA, I
C
=100µA
V
CC
=5V, R
L
=100Ω
I
C
=1mA
Min.
1.0
-
-
-
-
200
-
-
-
-
-
-
Typ.
1.15
-
-
10
-
-
-
-
7
7
VCE=5V
IF=10mA
Ic
A
Input
Output
Max.
1.4
10
200
1000
0.5
--
--
Unit
V
µA
nA
µA
V
µs
µs
Coupled
Rise Time
tr
Fall Time
tf
*1
Measurement Circuit of Collector Current
*2
Table
of Classification of Collector Output
Class
A
B
C
Ic (µA)
1000 to 450 650 to 300 450 to 200
SANYO Electric Co.,Ltd. Semiconductor Company
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
72199 GI, (MI) No.6024 1/6
SPI-235-19
Typical Characteristics
CAUTION
These numerical value show the electrical and optical characteristics of this product, and not assure this contents.
Forward Current vs. Ambient Temperature
60
Power Dissipation vs. Ambient Temperature
120
(Rating)
Power Dissipation P (mW)
(Rating)
50
100
Forward Current IF (mA)
40
80
30
60
20
40
10
20
0
-25
0
25
50
75
100
0
-25
0
25
50
75
100
Ambient Temperature Ta (°C)
Ambient Temperature Ta (°C)
Forward Current vs. Forward Voltage
500
1000
Collector vs. Forward Current
VCE=5V
Ta=25°C
Collector Current IC (µA)
800
Forward Current IF (mA)
100
50
Ta=75°C
50°C
25°C
0°C
-25°C
600
400
10
5
200
1
0
0.5
1
1.5
2
0
0
4
8
12
16
20
Forward Voltage VF (V)
Forward Current IF (mA)
Collector Current vs. Collector-emitter Voltage
1000
Relative Collector Current vs. Ambient Temperature
140
Ta=25°C
Collector Current IC (µA)
800
Relative Collector Current (%)
IF=15mA
IF=10mA
VCE=5V
120
600
100
10mA
400
80
5mA
200
60
0
0
5
10
40
-25
0
25
50
75
100
Collector-emitter Voltage VCE (V)
Ambient Temperature Ta (°C)
No.6024 2/6
SPI-235-19
Typical Characteristics
CAUTION
These numerical value show the electrical and optical characteristics of this product, and not assure this contents.
Collector-emitter Saturation Voltage VCE (sat) (V)
Collector-emitter Saturation Voltage vs.
Ambient Temperature
0.18
Collector Dark Current vs. Ambient Temperature
-6
10
5
0.16
Collector Dark Current ICEO (A)
IF=10mA
IC=100µA
VCE=10V
10
-7
5
0.14
10
-8
5
0.12
10
-9
5
0.10
0.08
-25
0
25
50
75
100
10
-10
-25
0
25
50
75
100
Ambient Temperature Ta (°C)
Ambient Temperature Ta (°C)
Response Time vs. Load Resistance
1000
500
Test Circuit for Response Time
IFP=10mA
VCC=5V
Ta=25°C
tf
tr
RD
IFP
VCC
IFP
Vout
10%
Vout
90%
tr
tf
Response (µS)
100
50
RL
10
5
1
0.1
0.5
1
5
10
50
100
Load Resistance RL (kΩ)
Relative Collector Current vs. Shield Distance (1)
120
Relative Collector Current vs. Shield Distance (2)
120
Relative Collector Current (%)
Relative Collector Current (%)
100
IF=10mA
VCE=5V
Ta=25°C
d
Shield
100
IF=10mA
VCE=5V
Ta=25°C
Shield
--
0
d
+
Detector center
3
80
80
60
+
0
Detector center
--
60
40
40
20
20
0
-2
-1
0
1
2
3
0
-2
-1
0
1
2
Shield Distance d (mm)
Shield Distance d (mm)
No.6024 3/6
SPI-235-19
0.5,
Max 0.1
Pin No.
1
2.4
2.5
4.5
3
2
Pin connection
1. Common (Cathode)
2. Ph. Tr Collector
3. LED Anode
LED
Ph.Tr
5
±
0.3
1.5
1
2
±
0.3
1
1.5
Optical C / L
3
Injection gate
2.8
2.7
C0
.5
1.5
2.4
3.25
0.25
2.9
3--0.4
0.25
3.5
0.25
2
Tolerance :
±0.2
Unit
: mm
No.6024 4/6
0.3,
Max 0.1
1.3
SPI-235-19
Package dimensions and Pin connection
As stated in the sttached paper. (No.6024 4/6)
Min. 1mm
Soldering conditions
(1) Temperature : Max. 260°C
(2) Time
: Max. 3 sec
(3) Clearance
: Min. 1mm from stay (include PCB thickness)
PRECAUTIONS
(1) Bending a lead should avoid. However, when bending is necessary, take care the next items.
q
Bending a lead must be done before soldering.
w
Bending a lead must be done in the states of fixing leads and no stress for the regin part. Because it is possible that
stress for the regin part cause troubles such as gold wire breaking and so on.
e
A lead must be bend under the stay.
r
Do not bend the same position of leads more than twice.
(2) The hole pitch of a circuit board must fit to the lead pitch.
(3) Two stays coupling LED and Ph. Tr should be isolated from any PCB pattern or any lead.
(4) Take core the following when soldering.
q
Do not heat a product under any stress (a twist and so on) to leads.
w
Do not heat a product in the states of operating force to the regin part.
(5) Use the flux which contain no chlorine, have no corrosion and do not need washing.
(6) Be careful that flux or other chemicals do not attach to the luminous surface and passive surface.
No.6024 5/6
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