SPEC NO. 05-08-5011 REV. N
REVISION RECORD
DESCRIPTION
RH1009M, 2.5V REFERENCE
REV
0
A
B
DATE
06/12/96
1/23/97
10/17/98
INITIAL RELEASE
BURN-IN CIRCUIT CHANGED TO MATCH THE JAN BURN-IN CIRCUIT.
•
PAGE 2, PARAGRAPH 3.3.b: ADDED “(SEE PARAGRAPH 3.2)”.
•
PAGE 3, PARAGRAPH 3.12: WAFER LOT ACCEPTANCE EXPLANATION WAS REWRITTEN.
•
PAGE 4, PARAGRAPH 4.4.2, GROUP B INSPECTION WAS REDEFINED.
PARAGRAPH 4.4.3, GROUP D INSPECTION WAS REDEFINED.
PARAGRAPH 4.5.1, SOURCE INSPECTION WAS REDEFINED.
•
PAGE 6, FIGURE 1, CASE OUTLINES: ADDED
θja, θjc,
AND Tj MAX.
•
PAGE 7, TOTAL DOSE BIAS CURRENT CHANGED FROM FIGURE 4 TO FIGURE 3.
•
PAGE 8, BURN-IN CIRCUIT CHANGED FROM FIGURE 3 TO FIGURE 4.
•
PAGE 9, TABLE I: REMOVED THE “∆ TEMP” FROM THE TEMPERATURE STABILITY
PARAMETER SYMBOL.
PAGE 4, AMENDED PARAGRAPHS 4.1 AND 4.1.1 TAKING EXCEPTION TO ANALYSIS OF
CATASTROPHIC FAILURES.
DATA SHEET CHANGES TO PRE AND POST IRRADIATION TABLES.
DEVICE TITLE CHANGED TO RH1009M.
PAGE 6, CHANGED
θja
FROM 400°C, TO46 CASE OUTLINE.
PAGE 9, CHANGE -55°C < Tj < 150°C TO -55°C < Tj < 125°C (TABLE I, ELECTRICAL
CHARACTERISTICS, PRE-IRRADIATION).
PAGE 3, PARAGRAPHS 3.2, HAD FIGURE 1, REMOVED.
PAGE 4, PARAGRAPH 3.7, CHANGED VERBIAGE FROM “SPECIFIED IN TABLE III” TO “AND
AS SPECIFIED IN TABLE III HEREIN”, LINE 2.
PAGE 5, PARAGRAPH 4.3, ADDED “HEREIN” AFTER “TABLE III”, LINE 2.
PARAGRAPH 4.4.1, ADDED “HEREIN” AFTER “TABLE III”, LINE 2.
PARAGRAPH 4.4.2.2, CHANGED VERBIAGE IN LINE 1 FROM “ALL FOOTNOTES OF TABLE
IIA IN MIL-STD-883”.
PARAGRAPH 4.4.3.2, CHANGED VERBIAGE IN LINE 1 FROM “ALL FOOTNOTES OF TABLE IV
OF MIL-STD-883” TO “ALL FOOTNOTES PERTAINING TO TABLE IV IN MIL-STD-883”.
PAGE 10, CORRECTED TABLE 1A: ELECTRICAL CHARACTERISTICS, BY ADDING 200K RAD
LIMITS.
C
D
E
•
•
•
•
•
•
•
2/23/98
7/29/98
8/30/99
F
12/29/99
G
•
5/4/00
REVISION RECORD AND DESCRIPTION CONTINUED ON NEXT PAGE.
CAUTION: ELECTROSTATIC DISCHARGE SENSITIVE PART
REVISION
INDEX
REVISION
INDEX
PAGE NO.
REVISION
PAGE NO.
REVISION
1
N
2
N
3
N
4
N
5
N
6
N
7
N
8
N
9
N
10
N
11
N
12
N
13
N
APPLICATION
ORIG
DSGN
ENGR
MFG
CM
QA
PROG
FUNCT
LINEAR TECHNOLOGY CORPORATION
MILPITAS, CALIFORNIA
TITLE:
MICROCIRCUIT, LINEAR,
RH1009M, 2.5V REFERENCE
CAGE CODE
64155
CONTRACT:
SIZE
DRAWING NUMBER
05-08-5011
REV
N
SIGNOFFS
DATE
FOR OFFICIAL USE ONLY
LINEAR TECHNOLOGY CORPORATION
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SPEC NO. 05-08-5011 REV. N
REVISION RECORD
DESCRIPTION
RH1009M, 2.5V REFERENCE
REV
H
DATE
12/3/02
•
PAGE 4:
PARAGRAPH 3.6, TABLE IA CHANGED TO TABLE II.
PARAGRAPH 3.7, TABLE III CHANGED TO TABLE IV.
PARAGRAPH 3.9, TABLE II CHANGED TO TABLE III.
PARAGRAPH 3.11.1 WAS CHANGED FROM “…dosage rate of approximately 20 Rads per
second” TO “…dosage rate of less than or equal to 10 Rads per second”.
PARAGRAPHS 4.1 THROUGH 4.2 CHANGES WERE DONE TO CLARIFY GROUP SAMPLING.
•
PAGE 5:
PARAGRAPHS 4.3 THROUGH 4.4.2.1 CHANGES WERE DONE TO CLARIFY GROUP SAMPLING.
PARAGRAPH 4.4.3 CHANGE WAS DONE TO CLARIFY GROUP SAMPLING.
•
PAGE 6:
PARAGRAPHS 4.6.2 THROUGH 4.6.4 WERE RE-WRITTEN. THESE DATA PROVIDED, AND DATA
AVAILABLE.
PARAGRAPH 4.6.10 NOTE, ADDED FURTHER EXPLANATION OF MINIMUM DELIVERED DATA.
•
PAGE 7:
ADDED “SEATING PLANE” TO THE SEATING PLANE DIMENSION OF CASE OUTLINE.
•
PAGE 9:
UPDATED BURN-IN CIRCUIT TO CURRENT DRAWING. NO MAJOR CHANGES INVOLVED.
•
PAGES 7 THROUGH 9:
ALL FIGURE TITLES CHANGED TO HAVE DEVICE AND PACKAGE TYPES AT TOP OF PAGE,
AND HAVE ALL FIGURES AT BOTTOM OF PAGE.
•
PAGE 10:
MOVED TABLES I, II, III, AND IV ALL ON TO PAGE 10, MAKING THE SPEC ONLY 10 PAGES.
•
PAGE 4:
PARAGRAPH 3.10.3 – LEAD MATERIAL AND FINISH CHANGED
FROM
“The lead material and
finish for device shall be gold plated Kovar and may be hot solder dip (Finish letter A) in accordance with
MIL-PRF-38535”
TO
“The lead material and finish for device shall be gold plated Kovar.”
•
PAGE 4:
CHANGED INITIAL RATE OF RADS TO 240 RADS/SEC.
•
PAGE 3, PARA 3.2.2 - ADDED OPTION 2 - RH1009MW GLASS SEALED FLATPACK, 10 LEADS.
•
PAGE 4, PARA 2.8 – ADDED FIGURE 7; PARA 2.10.1, FIGURE 2, MECHANICAL PACKAGING
REQUIREMENTS; PARA 2.10.2, FIGURE 4, TERMINAL CONNECTIONS.
•
PAGE 23, FIGURE 7 – ADDED BURN-IN CIRCUIT.
•
PAGE 5, CHANGED IN BOTH PARAGRAPHS 3.2, 3.3 IN CONJUNCTION TO 3.3 CHANGED
PARAGRAPHS TO 3.4 AND PARAGRAPH 4.3 CHANGED 3.1.1 TO 3.1 AND 3.2.1 TO 3.1.1
•
PAGE 4, PARAGRAPH 3.103 ADDED OPTION 2 IS ALLOY 42 FOR FLATPACK AND FINISH
HOT SOLDER DIP (FINISH LITTER A) IN ACCORDANCE WITH MIL-PRF-38535.
•
PAGE 4, PARAGRAPH 3.11.1 CHANGED VERBIAGE.
J
11/06/03
K
03/16/05
L
03/23/07
M
12/10/07
N
LINEAR TECHNOLOGY CORPORATION
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SPEC NO. 05-08-5011 REV. N
1.0
SCOPE:
1.1
RH1009M, 2.5V REFERENCE
This specification defines the performance and test requirements for a microcircuit processed to a space
level manufacturing flow.
2.0
APPLICABLE DOCUMENTS:
2.1
Government Specifications and Standards: the following documents listed in the Department of Defense
Index of Specifications and Standards, of the issue in effect on the date of solicitation, form a part of this
specification to the extent specified herein.
SPECIFICATIONS:
MIL-PRF-38535
MIL-STD-883
MIL-STD-1835
2.2
Integrated Circuits (Microcircuits) Manufacturing, General Specification for
Test Method and Procedures for Microcircuits
Microcircuits Case Outlines
Order of Precedence: In the event of a conflict between the documents referenced herein and the contents
of this specification, the order of precedence shall be this specification, MIL-PRF-38535 and other
referenced specifications.
3.0
REQUIREMENTS:
3.1
General Description: This specification details the requirements for the RH1009M, 2.5V REFERENCE
processed to space level manufacturing flow.
Part Number:
3.2.1
Opt io n 1 - RH1009 MH
(TO46 METAL CAN, 3 LEAD)
(Glass Sealed Flat pack, 10 Leads )
3.2
3.2.2 Opt io n 2 – RH1009MW
3.3
Part Marking Includes:
a.
b.
c.
d.
e.
LTC Logo
LTC Part Number (See Paragraph 3.2)
Date Code
Serial Number
ESD Identifier per MIL-PRF-38535, Appendix A
LINEAR TECHNOLOGY CORPORATION
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SPEC NO. 05-08-5011 REV. N
3.4
The Absolute Maximum Ratings:
. .
Reverse Breakdown Current
. . . . . .
Forward Current
Operating Temperature Range
Storage Temperature Range
Lead Temperature (Soldering, 10 sec)
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RH1009M, 2.5V REFERENCE
20mA
10mA
-55°C to +125°C
-65°C to +150°C
+300°C
3.5
Electrostatic discharge sensitivity, ESDS, shall be Class 1.
3.6
Electrical Performance Characteristics: The electrical performance characteristics shall be as specified in
Table I and Table II.
Electrical Test Requirements: Screening requirements shall be in accordance with 4.1 herein,
MIL-STD-883, Method 5004, and as specified in Table IV herein.
3.7
3.8
3.9
Burn-In Requirement: Burn-in circuit is specified in Figure 6 & 7.
Delta Limit Requirement: Delta limit parameters are specified in Table III herein, are calculated after
each burn-in, and the delta rejects are included in the PDA calculation.
Design, Construction, and Physical Dimensions: Detail design, construction, physical dimensions, and
electrical requirements shall be specified herein.
3.10.1 Mechanical / Packaging Requirements: Case outlines and dimensions are in accordance with
Figure 1 & 2.
3.10.2 Terminal Connections: The terminal connections shall be as specified in Figure 3 & 4.
3.10.3 Lead Material and Finish: The lead material and finish for Option 1 shall be gold plated Kovar.
Option 2 lead material is Alloy with lead finish hot solder dip (finish liter A) in
accordance with MIL-PRF-38535.
3.10
3.11
Radiation Hardness Assurance (RHA):
3.11.1 The manufacturer shall perform a lot sample test as an internal process monitor for total dose
radiation tolerance. The sample test is performed with MIL-STD-883 TM1019 Condition A as a
guideline.
3.11.2 For guaranteed radiation performance to MIL-STD-883, Method 1019, total dose irradiation, the
manufacturer will provide certified RAD testing and report through an independent test
laboratory when required as a customer purchase order line item.
3.11.3 Total dose bias circuit is specified in Figure 5.
3.12
Wafer Lot Acceptance: Wafer lot acceptance shall be in accordance with MIL-PRF-38535, Appendix A,
except for the following: Topside glassivation thickness shall be a minimum of 4KÅ.
LINEAR TECHNOLOGY CORPORATION
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SPEC NO. 05-08-5011 REV. N
3.13
RH1009M, 2.5V REFERENCE
4.0
Wafer Lot Acceptance Report: SEM is performed per MIL-STD-883, Method 2018 and copies of SEM
photographs shall be supplied with the Wafer Lot Acceptance Report as part of a Space Data Pack when
specified as a customer purchase order line item.
VERIFICATION (QUALITY ASSURANCE PROVISIONS)
4.1
Quality Assurance Provisions: Quality Assurance provisions shall be in accordance with MIL-PRF-
38535. Linear Technology is a QML certified company and all Rad Hard candidates are assembled on
qualified Class S manufacturing lines.
Sampling and Inspection: Sampling and Inspection shall be in accordance with MIL-STD-883, Method
5005 with QML allowed and TRB approved deviations in conjunction with paragraphs 3.1.1, 3.2.1, and
3.4 of the test method.
Screening: Screening requirements shall be in accordance with MIL-STD-883, Method 5004 with QML
allowed and TRB approved deviations in conjunction with paragraphs 3.1, 3.1.1, and 3.4 of the test
method. Electrical testing shall be as specified in Table IV herein.
4.3.1
Analysis of catastrophic (open/short) failures from burn-in will be conducted only when a lot fails
the burn-in or re-burn-in PDA requirements.
4.2
4.3
4.4
Quality Conformance Inspection: Quality conformance inspection shall be in accordance with 4.2 and 4.3
herein and as follows:
4.4.1
Group A Inspection: Group A inspection shall be performed in accordance with 4.1 herein, per
MIL-STD-883, Method 5005, and specified in Table IV herein.
Group B Inspection: When purchased, a full Group B is performed on an inspection lot. As a
minimum, Subgroup B2 (Resistance to Solvents / Mark Permanency) and Subgroup B3
(Solderability) are performed prior to the first shipment from any inspection lot and Attributes
provided when a Full Space Data Pack is ordered. Subgroup B5 (Operating Life) is performed on
each wafer lot. This subgroup may or may not be from devices built in the same package style as
the current inspection lot. Attributes and variables data for this subgroup will be provided upon
request at no charge.
4.4.2.1
Group B, Subgroup 2c = 10%
Group B, Subgroup 3 = 10%
Group B, Subgroup 4 = 5%
Group B, Subgroup 5 = *5%
(*per wafer or inspection lot
whichever is the larger quantity)
Group B, subgroup 6 = 15%
4.4.2
4.4.2.2 All footnotes pertaining to Table IIa in MIL-STD-883, Method 5005 apply. The quantity
(accept number) of all other subgroups are per MIL-STD-883, Method 5005, Table IIa.
4.4.3
Group D Inspection: When purchased, a full Group D is performed on an inspection lot. As a
minimum, periodic full Group D sampling is performed on each package family for each
assembly location every 26 weeks. A generic Group D Summary is provided when a full Space
Data Pack is ordered.
4.4.3.1
Group D, Subgroups 3, 4 and 5 = 15% each (Sample Size Series).
LINEAR TECHNOLOGY CORPORATION
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